Title:
COVERED PLATE-TYPE HEAT PIPE
Kind Code:
A1


Abstract:
A compact plate-type heat pipe having a large strength includes a plate-type heat pipe having a vaporized end and a condensed end and a metallic plate-like sleeve. The plate-like sleeve is covered outside the plate-type heat pipe tightly with the vaporized end of the plate-type heat pipe being exposed to the outside. The surface of the vaporized end of the plate-type heat pipe is adhered to the surface of a heat-generating electronic element, so that the heat generated by the heat-generating electronic element can be dissipated quickly.



Inventors:
Meyer IV, George Anthony (San Jose, CA, US)
Sun, Chien-hung (Zhongli City, TW)
Lu, Yung-tai (Zhongli City, TW)
Application Number:
12/172361
Publication Date:
01/14/2010
Filing Date:
07/14/2008
Primary Class:
Other Classes:
29/890.032
International Classes:
F28D15/00
View Patent Images:
Related US Applications:
20070227694Spray or Shower Arrangement and Shower InsertOctober, 2007Cederferm
20100018691FIN FOR HEAT EXCHANGER, GUIDE, AND METHOD OF USING THE GUIDEJanuary, 2010Ohgami et al.
20020179295Evaporator consisting of stacked flat tubes having two opposite fluid boxesDecember, 2002Palanchon
20080110596Interdependent lubrication systemsMay, 2008Schwarz et al.
20040265660Cooling device for electrical systems and use of polymers in cooling circuitsDecember, 2004Reuschel et al.
20050126757Internally enhanced tube with smaller groove topJune, 2005Bennett et al.
20080313906METHOD OF FORMING HEAT EXCHANGER TUBESDecember, 2008Eisele
20050199372Cold plate and method of making the sameSeptember, 2005Frazer et al.
20090130442Expanded Graphite and Process for Producing the Expanded GraphiteMay, 2009Christ et al.
20060272796Flexible graphite flooring heat spreaderDecember, 2006Asmussen et al.
20080271879Radiator for a Motor VehicleNovember, 2008Schneider



Primary Examiner:
ACEVEDO TORRES, ALEXANDRO
Attorney, Agent or Firm:
HDLS Patent & Trademark Services (CENTREVILLE, VA, US)
Claims:
What is claimed is:

1. A covered plate-type heat pipe, comprising: a plate-type heat pipe having a vaporized end and a condensed end; and a plate-like sleeve covering the plate-type heat pipe tightly with the vaporized end of the plate-type heat pipe being exposed to the outside.

2. The covered plate-type heat pipe according to claim 1, wherein the plate-type heat pipe is provided therein with a wick structure and a working fluid.

3. The covered plate-type heat pipe according to claim 1, wherein the plate-like sleeve is made by one of Al, Al—Mg alloy and Ti.

4. The covered plate-type heat pipe according to claim 1, wherein the plate-like sleeve has therein a heat-conducting medium that is distributed between the plate-type heat pipe and the plate-like sleeve uniformly.

5. A process for manufacturing a covered plate-type heat pipe, comprising the steps of: providing a plate-type heat pipe having a vaporized end and a condensed end; refrigerating the plate-type heat pipe to reduce a volume thereof; providing a plate-like sleeve; heating the plate-like sleeve to expand a volume thereof; and covering the refrigerated plate-type heat pipe by the heated plate-like sleeve with the vaporized end of the plate-type heat pipe being exposed to the outside; whereby after returning to room temperature, the plate-like sleeve contracts to cover outside the plate-type heat pipe tightly.

6. The process according to claim 5, wherein the plate-type heat pipe is provided therein with a wick structure and a working fluid to form a vacuum chamber.

7. The process according to claim 5, wherein the plate-like sleeve further comprises a heat-conducting medium, after the plate-like sleeve is covered outside the plate-type heat pipe, the heat-conducting medium is distributed uniformly between the plate-type heat pipe and the plate-like sleeve.

Description:

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat pipe, and in particular to a compact plate-type heat pipe.

2. Description of Prior Art

Since the plate-type heat pipe has many advantageous features, such as a large capacity and a high rate of heat conductivity, light in weight, simple in structure and multiple functions, it can be used to transfer a large amount of heat without consuming any electricity. Therefore, the plate-type heat pipe is widely used in the heat conduction of electronic elements. Via the plate-type heat pipe, the heat generated by electronic elements can be dissipated quickly, thereby solving the heat accumulation of electronic elements at present stage.

The working principle of the plate-type heat pipe is described as follows. Via an internal vacuum environment, after being heated, the working fluid filled in the heat pipe generates a phase change thereby to transfer heat. Then, after being cooled, the working fluid returns to liquid state so that it can flow back for circulation. With the surface of an end of the plate-type heat pipe in which the working fluid is vaporized (referred as “vaporized end” hereinafter) abutting against the surface of the electronic heat-generating surface, a portion of the heat generated by the electronic element is absorbed by the surface of the vaporized end of the plate-type heat pipe, thereby achieving the heat-dissipating effect.

Since the electronic devices are made to be more and more compact, the plate-type heat pipe for dissipating the heat generated by the electronic elements also have to be made compact in volume and light in weight due to the increasingly limited volume of the electronic device. However, when the plate-type heat pipe intends to be made further compact, the plate body of the plate-type heat pipe will be bent and broken more easily especially during the transportation and package. Therefore, it is an important issue for the Inventor to provide a plate-type heat pipe that still has a large strength even though it is compact in volume and light in weight.

SUMMARY OF THE INVENTION

The present invention is to provide a covered plate-type heat pipe, in which a plate-type sleeve is covered outside the plate-type heat pipe with a vaporized end of the plate-type heat pipe being exposed to the outside, thereby generating a compact plate-type heat pipe having a large strength.

The present invention is to provide a compact plate-type heat pipe having a large strength, which includes a plate-type heat pipe having a vaporized end and a condensed end and a metallic plate-type sleeve. The plate-type sleeve is tightly covered on the plate-type heat pipe with the vaporized end of the plate-type heat pipe being exposed to the outside, thereby providing a covered plate-type heat pipe that is compact in volume and light in weight with a large heat-dissipating area. In use, the surface of the vaporized end of the plate-type heat pipe is adhered to the surface of a heat-generating electronic element, so that the heat generated by the electronic element can be dissipated quickly via the plate-type heat pipe.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of an embodiment of the present invention;

FIG. 2 is an assembled view of an embodiment of the present invention;

FIG. 3 is a cross-sectional view taken along the line 3-3 of FIG. 2;

FIG. 4 is a cross-sectional view taken along the line 4-4 of FIG. 3;

FIG. 5 is a flow chart showing the process for manufacturing an embodiment of the present invention; and

FIG. 6 is a schematic view showing the operating state of an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The detailed description and technical contents of the present invention will be explained with reference to the accompanying drawings. However, the drawings are illustrative only, but not used to limit the present invention.

Please refer to FIGS. 1 to 4. FIG. 1 is an exploded perspective view of the present invention, and FIG. 2 is an assembled view of the present invention. FIG. 3 is a side cross-sectional view of the present invention, and FIG. 4 is a side cross-sectional view of the present invention taken along another viewing angle. The present invention provides a covered plate-type heat pipe 10, which includes a plate-type heat pipe 20 and a plate-like sleeve 30. The plate-type heat pipe 20 has a vaporized end 21 and a condensed end 22. A plate body 201 of the plate-type heat pipe 20 has an injection port through which the working fluid 202 can be injected and a degassing or vacuum process can be perform. The plate body 201 is made of materials with good heat conductivity, such as aluminum and copper. In the present embodiment of the present invention, the inner wall of the plate body 201 is provided with a wick structure 203. After the above-mentioned vacuum process is completed, the injection port will be sealed by die pressing, thereby forming a necked pipe 23 to keep the vacuum in the space of the plate body 201. In this way, the process for manufacturing the plate-pipe heat pipe 20 of the present invention can be completed.

The plate-like sleeve 30 is a lightweight metallic casing made by one of Al, Al—Mg alloy and Ti. An opening 301 is provided on the plate-like sleeve 30 with a width approximately identical to that of the plate-type heat pipe 20, so that the plate-like sleeve 30 can be tightly covered outside the plate-type heat pipe 20. In the present embodiment, the plate-like sleeve 30 is covered outside the condensed end 22 of the plate-type heat pipe 20, so that the vaporized end 21 of the plate-type heat pipe 20 can be exposed to the outside. The plate-type sleeve 30 can contain therein a heat-conducting medium, such as heat-conducting paste, for accelerating the heat conduction. After the plate-like sleeve 30 is covered outside the plate-type heat pipe 20, the heat-conducting medium 31 is distributed uniformly between the plate-type heat pipe 20 and the plate-like sleeve 30. Via the heat-conducting medium 31, the heat can be conducted to the plate-like sleeve 30 more quickly.

Since the plate-like heat pipe 20 of the covered plate-type heat pipe 10 of the present invention is compact, its strength is insufficient. In order to increase the strength of the plate-type heat pipe 20, a lightweight metallic plate-like sleeve 30 is covered outside the plate-type heat pipe 20. The plate-like sleeve 30 does not fully cover the vaporized end 21 of the plate-type heat pipe 20, so that the vaporized end 21 of the plate-type heat pipe 20 can be adhered to the surface of a heat-generating element. With the metallic plate-like sleeve 30 being covered outside the plate-type heat pipe 20, the strength and the heat-dissipating area of the compact plate-type heat pipe 20 can be increased. Therefore, the present invention provides a covered plate-type heat pipe 10 that is compact in volume and light in weight with a large heat-dissipating area.

Please refer to FIG. 5, which is flow chart showing a process for manufacturing the covered plate-type heat pipe of the present invention. In the present embodiment, the steps of connecting the plate-type heat pipe 20 and the plate-like sleeve 30 are as follows. In the step S1, a plate-type heat pipe 20 having a vaporized end 21 and a condensed end 22 is provided. The plate-type heat pipe 20 is a finished plate-type heat pipe in which a working fluid 202 and a wick structure 203 are provided. In the step S2, the plate-type heat pipe is refrigerated to reduce its volume. This refrigerating step is to reduce the volume of the plate body 201 of the plate-type heat pipe 20. In the step S3, a plate-like sleeve 30 is provided. The plate-like sleeve 30 is made of lightweight metallic materials such as Al, Al—Mg alloy or Ti, and it contains therein a heat-conducting medium for accelerating the heat conduction. In the step S4, the plate-like sleeve is heated to expand its volume. This heating step is to expand the diameter of the opening 301 of the plate-like sleeve 30. In the step S5, the heated plate-like sleeve 30 is covered outside the refrigerated plate-type heat pipe 20 with the vaporized end 21 of the plate-type heat pipe 20 being exposed to the outside. In this way, when returning to room temperature, the plate-like sleeve 30 will contract and thus cover outside the plate-type heat pipe 20 tightly. After the plate-like sleeve 30 is covered outside the plate-type heat pipe 20, the heat-conducting medium 31 is distributed uniformly between the plate-type heat pipe 20 and the plate-like sleeve 30.

Please refer to FIG. 6, which is a schematic view showing the operating state of the covered plate-type heat pipe of the present invention. In the present embodiment, a circuit board 40 is provided thereon with a heat-generating electronic element 41 (such as a CPU). The vaporized end 21 of the plate-type heat pipe 20 that is not covered by the plate-like sleeve 30 is adhered to the surface of the heat-generating electronic element 41 to achieve the best heat-conducting efficiency. In this way, the heat generated by the heat-generating electronic element 41 can be conducted to the plate-type heat pipe 20 quickly. In a low-vacuum environment, the working fluid 202 within the plate-type heat pipe 20 starts to vaporize from its liquid state. At this time, the working fluid 202 absorbs heat. As a result, the gaseous working fluid 202 expands its volume rapidly to fill the interior of the plate-type heat pipe 20. When the gaseous working fluid flows to the condensed end 22 of the plate-type heat pipe 20, it will be condensed to release the heat accumulated during vaporization. After condensation, the working fluid 202 in the liquid state flows back to the vaporized end near the heat source (i.e. the electronic element 41) via the wick structure 203, thereby circulate in the plate-type heat pipe 20. In this way, the heat generated by the heat-generating electronic element 41 in the plate-type heat pipe 20 can be dissipated quickly.

Therefore, according to the present invention, a lightweight metallic plate-like sleeve is covered outside a compact plate-type heat pipe, thereby increasing the strength and the heat-dissipating area of the plate-type heat pipe. Thus, the present invention can provide a covered plate-type heat pipe that is compact in volume and light in weight with a large heat-dissipating area.

Although the present invention has been described with reference to the foregoing preferred embodiment, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.