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(a) Field of the Invention
The present invention relates to an Internal and external connecting liquid cooled heat sink device, which embodies a variation in a liquid cooled exchange device structure of a heat dissipating unit.
(b) Description of the Prior Art
Referring to FIGS. 1 and 2, which show a heat dissipating system A of prior art, wherein a water tank A1, a heat sink A2, fans A3, a motor A4 and a cooling plate A5 are mutually connected in series using a water pipe A6. However, the heat dissipating system A occupies space when installed to a host computer A7, and disorder of component members when set up is a cause for annoyance when.
Furthermore, the heat dissipating effect of the prior art heat sink A2 is realized by mutually connected heat dissipating fins A8 of the heat sink A2 dissipating a heat source, wherein structure of the heat dissipating fins A8 is planar. However, using planarity of the heat dissipating fins A8 to dissipate the heat source results in a poor dissipating effect, which brings about the inability to discharge the heat source within the heat sink A2.
Hence, the inventor of the present invention proposes to resolve and surmount existent technical difficulties to eliminate the aforementioned shortcomings of prior art.
The art of the present invention provides an internal and external connecting liquid cooled heat sink device, which embodies a variation in a liquid cooled exchange device structure of a heat dissipating unit, wherein a plurality of through holes perforate each heat dissipating fin of the liquid cooled heat sink device, and the circulating heat conduction function of the plurality of through holes enables the heat dissipating unit within a holding case to achieve optimum heat dissipation effectiveness.
To enable a further understanding of said objectives and the technological methods of the invention herein, brief description of the drawings is provided below followed by detailed description of the preferred embodiments.
FIG. 1 shows an elevational view of prior art.
FIG. 2 shows a partial schematic view of prior art.
FIG. 3 shows an elevational view according to the present invention.
FIG. 4 shows an exploded elevational view according to the present invention.
FIG. 5 shows a partial elevational view according to the present invention.
FIG. 6 shows an elevational view of a first embodiment according to the present invention.
FIG. 7 shows an elevational view of a second embodiment according to the present invention.
FIG. 8 shows an elevational view of a third embodiment according to the present invention.
FIG. 9 shows an elevational view of a fourth embodiment according to the present invention.
Referring to FIGS. 3, 4 and 5, which show an internal and external connecting liquid cooled heat sink device comprising a liquid cooled heat sink device B primarily structured to comprise a holding case C, a water tank facility D, a heat dissipating unit E, pipes F and a water cooled head G.
The water tank facility D and the heat dissipating unit E are disposed interior of the holding case C and connected in series using the pipes F. A hydraulic pump D1 causes a liquid within the water tank facility D to pass through the pipes F to a water cooled head G to dissipate heat, and the water cooled head G further causes the liquid to pass through the pipes F to the heat dissipating unit E. The heat dissipating unit E further comprises a liquid cooled exchange device El that abstracts heat from the liquid in the pipes F, whereafter the cooled liquid is transported to the water tank facility D through the pipes F. The aforementioned configuration thus forms the liquid cooled heat dissipating system B.
The liquid cooled exchange device E1 of the heat dissipating unit E is configured with heat dissipating fins E3, in each of which is defined a plurality of through holes E4. The perforating through holes E4 enable more effective dissipation of heat from the liquid transported to the heat dissipating unit E. Moreover, the heat dissipating unit E additionally comprises a fan device E2 that is able to outwardly discharge heat produced when the liquid cooled exchange device E1 is dissipating heat.
A water exchange hole is defined at an edge of the holding case C to enable the filling of water into and emptying of water from the water tank facility D, thereby providing functionality to facilitate exchanging the water source within the water tank facility D. Moreover, a plurality of air holes C1 are defined in the holding case C corresponding to position of the fan device E2, which increase heat dissipation effectiveness of the heat dissipating unit E of the liquid cooled heat dissipating system B when operating, thereby achieving an optimum heat dissipating effect.
Referring to FIGS. 6, 7 and 8, which show embodiments of the internal and external connecting liquid cooled heat sink device of the present invention, wherein the holding case C of the liquid cooled heat dissipating system B is a case able to be removably inserted into a retaining slot H1 of a host computer H. When installing the holding case C in the host computer H, the pipes F are used to series connect the liquid cooled heat dissipating system B, and the water cooled head G of the pipes F is disposedly connected to a CPU (central processing unit) of a motherboard of the host computer H. Heat from the motherboard CPU is conducted away through the circulating liquid in the pipes F connected to the water cooled head G, thereby enabling the discharge of heat from the motherboard CPU and effectively achieving heat dissipating effectiveness. Moreover, convenient removable insertion of the holding case C into the host computer H facilitates installation of the liquid cooled heat dissipating system B for use thereof and saves on space. Based on the thermal convection principle, heated hot air I within the host computer H flows upward and is smoothly discharged through heat dissipating holes H2, while cool air J enters through lower end holes H3 of the host computer H, thereby increasing heat dissipation effectiveness of the host computer H.
Furthermore, the holding case C of the liquid cooled heat dissipating system B can also be disposed on an outer portion of the host computer H, thereby enabling the liquid cooled heat dissipating system B to be conveniently examined and repaired when malfunctioning. Moreover, the entire configuration is more pleasing to the eye when set up.
Referring to FIG. 9, a sensor device K can also be disposed within the holding case C, and when the liquid cooled heat dissipating system B is circulating and dissipating heat, if the liquid cooled heat dissipating system B malfunctions causing a high temperature state in the motherboard CPU, then the sensor device K is able to sense the high temperature, emit a signal and force the host computer H to stop operating. Hence, when malfunctioning, the liquid cooled heat dissipating system B is still able to prevent damage to the motherboard CPU from overheating and anxiety resulting therefrom.
1. Planarity of heat dissipating fins results in a poor dissipating effect,
2. Occupies space when installed and the disorder of component members is inconvenient when set up.
3. Unable to realize positional variation according to user needs.
1. The through holes E4 perforating the heat dissipating fins E3 are able to increase the heat dissipation effectiveness of the liquid cooled heat dissipating system B.
2. The liquid cooled heat dissipating system B can be conveniently removed from a host computer.
3. The liquid cooled heat dissipating system B can be conveniently examined and repaired when malfunctioning.
4. Saves on space when set up, and the neat and tidy arrangement is pleasing to the eye.
5. Provided with advancement and practicability.
6. Enhances commercial competitiveness.
In conclusion, the present invention in overcoming structural shortcomings of prior art has assuredly achieved effectiveness of anticipated advancement, and, moreover, is easily understood by persons unfamiliar with related art. Furthermore, contents of the present invention have not been publicly disclosed prior to this application, and practicability and advancement of the present invention clearly comply with essential elements as required for a new patent application. Accordingly, a new patent application is proposed herein.
It is of course to be understood that the embodiments described herein are merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.