Title:
Heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins
Kind Code:
A1


Abstract:
An improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins can assemble several fins for heat radiation of an electronic component. The improved heat-radiating fin set can be quickly mass-produced in an automatic way to lower the manufacturing and assembly cost without using any solder material for binding. The improved heat-radiating fin set comprises a heat pipe and several fins. A sleeve hole is disposed in each fin. A flange is formed at the edge of each of the sleeve holes. The fins are tightly sleeved with the heat pipe through the sleeve holes with the flanges of the sleeve holes of the fins touching the outer wall of the heat pipe.



Inventors:
Wu, Huei-jan (Taipei, TW)
Application Number:
10/951934
Publication Date:
03/31/2005
Filing Date:
09/29/2004
Assignee:
WU HUEI-JAN
Primary Class:
Other Classes:
257/E23.103, 257/E23.088
International Classes:
F28D15/02; F28F1/24; G06F1/20; H01L23/367; H01L23/427; (IPC1-7): F28F7/00
View Patent Images:
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Primary Examiner:
DUONG, THO V
Attorney, Agent or Firm:
ROSENBERG, KLEIN & LEE (ELLICOTT CITY, MD, US)
Claims:
1. A heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to facilitate the operation of a stamping machine comprising: a heat pipe; and several fins each having a sleeve hole and a flange formed at an edge of said sleeve hole, said fins being tightly sleeved with said heat pipe through said sleeve holes with said flanges of said sleeve holes of said fins touching an outer wall of said heat pipe.

2. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein the bore diameter of said sleeve hole of each said fin is smaller than the outer diameter of said heat pipe before said fin is sleeved with said heat pipe.

3. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein said fins are I-shaped.

4. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein said fins are L-shaped.

5. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein said fins are U-shaped.

6. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein said heat pipe is sleeved into said sleeve holes of said fins one by one in accordance with a longitudinal motion of said stamping machine.

7. The heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins as claimed in claim 1, wherein said fins are led to move and sleeved with said vertical and immobile heat pipe one by one in accordance with a longitudinal motion of said stamping machine.

Description:

BACKGROUND OF THE INVENTION

As shown in FIGS. 1 and 2, a conventional heat-radiating fin set comprises a pipe body 12, several fins 11, and a solder bar 13. Each of the fins 11 has a through hole 111 and is sleeved with the pipe body 12 through the through hole 111. A gap 112 is further formed at the through hole 111 of each of the fins 11. After the fins 11 are stacked together one by one, the solder bar 13 penetrates the channel formed of the connected gaps 112 (or solder paste (not shown) is provided at inner edges of the through holes 111 of the fins 11). After passing a solder furnace and heated, the solder bar 13 (or solder paste) will be melted to bind the pipe body 12 and the through holes 111 of the fins 11 together, hence forming the conventional heat-radiating fin set 1.

For the above conventional heat-radiating fin set 1, however, the fins are applied with solder paste and then assembled one by one so that the manufacturing and assembly cost is high and automatic and quick production can't be accomplished. Moreover, because there is still isolation of solder material (the solder bar or solder paste) between the fins 11 and the pipe body 12, conduction of heat will be blocked to cause reduction of the heat conduction efficiency.

Accordingly, the present invention aims to propose an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to solve the above problems in the prior art.

1. Field of the Invention

The present invention relates to an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins and, more particularly, to a heat-radiating fin set capable of assembling several fins for heat radiation of an electronic component (e.g., a CPU).

2. Description of Related Art

SUMMARY OF THE INVENTION

An object of the present invention is to provide an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to effectively match an exclusive manufacturing machine so that quick and mass production can be accomplished in an automatic way for the manufacturing and assembly of the heat-radiating fin set, thereby effectively lowering the manufacturing and assembly cost.

Another object of the present invention is to provide an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to effectively avoid isolation of solder material between the fins and the heat pipe so that the heat-radiating efficiency won't be lowered.

To achieve the above objects, the present invention provides an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins to facilitate the operation of a stamping machine. The improved heat-radiating fin set comprises a heat pipe and several fins each having a sleeve hole and a flange formed at the edge of the sleeve hole. The fins are tightly sleeved with the heat pipe through the sleeve holes with the flanges of the sleeve holes of the fins touching the outer wall of the heat pipe.

The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of a conventional heat-radiating fin set;

FIG. 2 is a perspective assembly view of a conventional heat-radiating fin set;

FIG. 3 is an exploded perspective view of a heat-radiating fin set of the present invention;

FIG. 4 is a perspective assembly view of a heat-radiating fin set of the present invention;

FIG. 5 is a perspective view of a single fin of a heat-radiating fin set of the present invention; and

FIG. 6 is a cross-sectional view of a heat-radiating fin set of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

As shown in FIGS. 3 to 6, the present invention provides an improved heat-radiating fin set 2 formed by combining a heat pipe and several heat-radiating fins. The heat-radiating fin set 2 comprises a heat pipe 22 and several fins 21, which are sleeved with the heat pipe 22 and stacked together one by one. The improved heat-radiating fin set 2 needs to effectively match an exclusive manufacturing machine (e.g., a stamping machine) so that quick and mass production can be accomplished in an automatic way for the manufacturing and assembly of the heat-radiating fin set, thereby effectively lowering the manufacturing and assembly cost.

The heat pipe 22 is used to quickly conduct heat from its one end to the other end for increasing the heat-radiating efficiency of various heat radiators or heat-radiating devices. The heat pipe 22 can be a round pipe, a flat pipe or a pipe body including any round or flat shape.

Each of the fins 21 has a sleeve hole 211. A flange 212 is formed at the edge of each of the sleeve holes 211 to increase the contact area of each of the fins 21 with the heat pipe 22 and also enhance the fixing effect.

The fins 21 are tightly sleeved with the heat pipe 22 through the sleeve holes 211. The bore diameter of the sleeve holes 211 of the fins 21 is smaller than outer diameter of the heat pipe 22 before being sleeved with the heat pipe 22. Therefore, the fins 21 will compel open the bore diameter of the sleeve holes 211 to be tightly sleeved with the heat pipe 22 without using any solder material (e.g., solder paste) for binding when being sleeved with the heat pipe 22.

In addition to the U-shape having two opposite sidewalls shown in FIG. 5, the fins 21 can also be of an L-shape (not shown) having only a sidewall or pf an I-shape (not shown) having no sidewall. Because no solder material (e.g., solder paste) is required for binding, not only reduction of the heat conduction efficiency due to the solder material won't occur, the operation of a stamping machine (not shown) will also be facilitated. One only needs to entrust manufacturing procedures like hole punching, shaping, hole expanding, edge bending, and cutting to the stamping machine for continuous stamping and then provide the manufactured fins 21 for the stamping machine for subsequent operations. The fins 21 can be led to move and sleeved with the vertical and immobile heat pipe 22 one by one (from top to bottom) in accordance with the longitudinal to-and-fro motion of the stamping machine. Of course, it is also feasible that the heat pipe 22 be sleeved with the immobile fins 21. The assembly of the heat-radiating fin set of the present invention can thus be accomplished. The structure of the heat-radiating fin set of the present invention can exactly facilitate the operation of the stamping machine to accomplish quick and mass production in an automatic way, thereby effectively lowering the manufacturing and assembly cost.

To sum up, the present invention can accomplish quick and mass production of an improved heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins in an automatic way, and can also avoid reduction of the heat-radiating efficiency due to solder material (e.g., solder paste) for binding.

Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.