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[0001] The present invention relates to a refrigeration system for cooling electrical components. More particularly, the invention relates to a field and/or customer replaceable refrigeration module coupled to a capillary pumped loop that is suitable for use in standard electronic component environments.
[0002] Electronic components, such as microprocessors and other various integrated circuits, have advanced in at least two significant ways. First, feature sizes have moved into the sub-micron range thereby allowing larger numbers of transistors to be formed on a given surface area. This in turn has resulted in greater device and circuit density on the individual chips. Second, in part due to the first advance discussed above, microprocessors have increased dramatically in clock speed. At present microprocessor speeds of 2.5 Gigahertz are coming to market and the 3 and 4 Gigahertz range is rapidly being approached.
[0003] As a result of the advances in device density and microprocessor speed discussed above, heat dissipation, which has always been a problem in the past, is rapidly becoming the limiting factor in microprocessor performance. Consequently, heat dissipation and cooling is now the foremost concern and the major obstacle faced by system designers.
[0004] As noted, heat dissipation has long been recognized as a serious problem limiting the performance of electronic components and systems. In the past, the solutions to the heat dissipation problem have been mostly limited to air-based cooling systems, with only the most exotic military, scientific and custom electronic systems employing the bulky and costly prior art liquid-based cooling solutions.
[0005] In the prior art, air-based cooling systems, such as heat sinks, cooling fins, heat pipes and fans, have been the systems of choice for several reasons. First, the air-based cooling systems of the prior art were modular and self-contained and were therefore field replaceable with minimal effort using standard tools. Second, the prior art air-based cooling systems attached directly to the components that needed cooling and a discrete cooling unit could be provided for each heat source. In addition, air-based cooling systems were compact and simple in both operation and installation, with minimal parts to fail or break and minimal added system complexity. Therefore, prior art air-based cooling systems were reliable. In addition, and probably most importantly, in the prior art, air-based cooling systems could reasonably meet the cooling needs of electronic devices and systems so there was little motivation to move to the more complex and problematic liquid-based systems. However, as noted above, due to the advances in microprocessor speeds and device density, air-based cooling systems alone will most likely not be a viable option for electronic device cooling for the next generation of microprocessors.
[0006] As noted above, another possible prior art cooling system that could potentially provide the level of cooling required by the next generation of microprocessors is liquid-based cooling systems. Prior art liquid-based cooling systems typically used a refrigerant, such as R134A, that was circulated by a compressor. In prior art liquid-based cooling systems the compressor was typically a crankshaft reciprocating compressor or a rotary compressor similar to those used in home refrigerators.
[0007] As noted above, prior art liquid-based cooling systems have far more potential cooling capability than air-based systems. However, in the prior art liquid-based cooling systems, the crankshaft reciprocating or rotary compressors were typically, by electronics industry standards, very large, on the order of tens of inches in diameter, very heavy, on the order of pounds, and often required more power to operate than the entire electronic system they would be charged with cooling. In addition, the size and design of prior art liquid-based cooling systems often required that the major components of the prior art liquid-based cooling system be centrally located, typically remote from the electronic devices to be cooled, and that a complicated system of tubing or “plumbing” be used to bring the cooling liquid into thermal contact with the heat source, i.e., with the microprocessor or other integrated circuit. Consequently, unlike prior art air-based cooling systems, prior art liquid-based cooling systems were not modular, were not self-contained, and often required special expertise and tools for maintenance and operation. In addition, unlike the prior art air-based cooling systems discussed above, prior art liquid-based cooling systems did not attach directly to the components that needed cooling and a discrete cooling unit typically could not be provided for each heat source. Also, unlike the prior art air-based cooling systems discussed above, prior art liquid-based cooling systems were not compact and were not simple in either operation or installation. Indeed, prior art liquid-based cooling systems typically included numerous parts which could potentially fail or break. This added complexity, and threat of component failure, was particularly problematic with respect to the associated plumbing discussed above because a failure of any of the tubes could result in the introduction of liquid refrigerant into, or onto, the electronic devices and could cause catastrophic system failure.
[0008] In addition, prior art liquid-based cooling systems employed compressors that typically were highly orientation dependent, i.e., they could not operate at angles of more than 30 or 40 degrees. Consequently, prior art liquid based cooling systems were particularly ill suited for the electronics industry that stresses flexibility and often requires orientation independent operation.
[0009] Given that, as discussed above, air-based cooling systems have reached their operational limits when it comes to cooling electronic components, there is a growing realization that some other form of cooling system, such as liquid-based cooling systems will need to be adopted by the electronics industry. However, as discussed above, prior art liquid-based cooling systems are far from ideal and, thus far, the industry has not adopted liquid-based cooling in any meaningful way because the problems associated with prior art liquid-based cooling systems are still thought to outweigh the advantages these systems provide in terms of increased cooling capacity.
[0010] What is needed is a cooling system that has the cooling capacity and efficiency of a liquid-based cooling system yet has the advantages of being modular, simple, and compact like air-based cooling systems.
[0011] The present invention is directed to a field and/or customer replaceable packaged refrigeration module with capillary pumped loop that is suitable for use in standard electronic component environments. According to the present invention, advances in compressor technology are incorporated in a field replaceable packaged refrigeration module that is coupled to a capillary pumped loop cold plate evaporator to be used for cooling electronic components. According to the invention, the field replaceable packaged refrigeration module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe.
[0012] In one embodiment of the invention, the addition of the field replaceable packaged refrigeration module to a capillary pumped loop serves to create a system wherein the capillary pumped loop is used to passively cool the heat source and the field replaceable packaged refrigeration module is used to lower, or maintain, the base temperature of the capillary pumped loop and/or the associated capillary pumped loop working fluid reservoir. Consequently, the field replaceable packaged refrigeration module can be operated intermittently, on an as needed basis, to minimize the power used by the system and to minimize the wear and tear of the moving parts. The net result is the ability to manage and remove heat from the heat source while saving energy since the field replaceable packaged refrigeration module does not need to operate at all times. Consequently, the use of a capillary pumped loop with the field replaceable packaged refrigeration module allows for more cooling capability and more efficient cooling, lowered load on the field replaceable packaged refrigeration module, and a lower failure rate of the cooling system and its moving parts.
[0013] In addition, the addition of the field replaceable packaged refrigeration module to a capillary pumped loop serves to create a system wherein vibration transferred from the field replaceable packaged refrigeration module to the often delicate electronic component to be cooled is significantly reduced because, as discussed above, the field replaceable packaged refrigeration module can be operated intermittently, on an as needed basis.
[0014] The present invention can be utilized in existing electronic systems and unlike prior art liquid-based cooling systems, the various parts of the field replaceable packaged refrigeration module with capillary pumped loop of the invention, including the very minimal tubing, are largely self-contained in the field replaceable packaged refrigeration module with capillary pumped loop. Therefore a failure of any of the tubes would typically not result in the introduction of liquid into, or onto, the electronic devices and would not cause catastrophic system failure, as was the risk with prior art liquid-based cooling systems.
[0015] The field replaceable packaged refrigeration module with capillary pumped loop of the present invention is a modified liquid-based cooling system and therefore provides the cooling capacity of a prior art liquid-based cooling systems. However, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module with capillary pumped loop of the invention is modular and largely self-contained and is therefore field and/or customer replaceable with minimal effort using standard tools. In addition, unlike prior art liquid-based cooling system, the field replaceable packaged refrigeration module with capillary pumped loop of the invention, in one embodiment, uses the passive, simple and low energy capillary pumped loop to perform the majority of the routine cooling, while providing the added cooling capacity of a liquid-based cooling system in the form of the intermittently operating field replaceable packaged refrigeration module. In another embodiment, the field replaceable packaged refrigeration module is positioned directly over the main heat source, such as a CPU, while the capillary pumped loop is used for smaller heat sources or secondary cooling. In addition, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module with capillary pumped loop of the invention is compact and simple in both operation and installation, with minimal parts to fail or break and minimal added complexity. Therefore, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module with capillary pumped loop of the invention is sturdy and reliable.
[0016] In one embodiment of the invention, a single capillary pumped loop is coupled to a single field replaceable packaged refrigeration module as a unit. In other embodiments of the invention, multiple capillary pumped loops are coupled to, and serviced by, a single field replaceable packaged refrigeration module mounted in a central location. In this way, single or multiple heat sources can be serviced by a single field replaceable packaged refrigeration module.
[0017] In addition, capillary pumped loop portion of the field replaceable packaged refrigeration module with capillary pumped loop of the present invention can be constructed using very small tubing and evaporator plates and these tubing and evaporator plates can be used to access electronic devices to be cooled that are in very constrained spaces.
[0018] In one embodiment of the invention, the capillary pumped loop portion of the field replaceable packaged refrigeration module with capillary pumped loop of the present invention is a “micro-capillary pumped loop” that can be fabricated in the electronic component to be cooled using existing technology.
[0019] In addition, the field replaceable packaged refrigeration module portion of the present invention is specifically designed to be operational in any orientation. Consequently, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module portion of the present invention can be mounted, and operated, at any angle. This makes the field replaceable packaged refrigeration module with capillary pumped loop of the present invention particularly well suited for use with electronic systems.
[0020] As discussed briefly above, and in more detail below, the field replaceable packaged refrigeration module with capillary pumped loop of the present invention has the cooling capacity of a liquid-based cooling system and yet is modular, compact, simple in design and simple to use, like an air-based cooling system. Consequently, the field replaceable packaged refrigeration module with capillary pumped loop of the present invention can readily meet the cooling needs of the next generation of electronic devices and systems. As one example, when the field replaceable packaged refrigeration module with capillary pumped loop of the present invention is used to cool a microprocessor or CPU, the CPU can operate at a higher frequency and speed, thereby allowing the parent electronic system to fully utilize the advances in microprocessor technology discussed above.
[0021] The refrigeration system of the present invention will be described in the following detailed description, with reference to the accompanying drawings. In the drawings, the same reference numbers are used to denote similar components in the various embodiments.
[0022]
[0023]
[0024]
[0025]
[0026]
[0027]
[0028] The field replaceable packaged refrigeration module with capillary pumped loop (
[0029] In one embodiment of the invention, the addition of the field replaceable packaged refrigeration module (
[0030] The present invention can be utilized in existing electronic systems and unlike prior art liquid-based cooling systems, the various parts of the field replaceable packaged refrigeration module with capillary pumped loop of the invention, including the very minimal tubing (
[0031] In one embodiment of the invention, a single capillary pumped loop is coupled to a single field replaceable packaged refrigeration module as a unit. In other embodiments of the invention, multiple capillary pumped loops are coupled to, and serviced by a single field replaceable packaged refrigeration module mounted in a central location. In this way, single or multiple heat sources can be serviced by a single field replaceable packaged refrigeration module.
[0032] The field replaceable packaged refrigeration module with capillary pumped loop of the present invention is a modified liquid-based cooling system and therefore provides the cooling capacity of a prior art liquid-based cooling systems. However, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module with capillary pumped loop of the invention is modular and self-contained and is therefore field and/or customer replaceable with minimal effort using standard tools. In addition, unlike prior art liquid-based cooling system, the field replaceable packaged refrigeration module with capillary pumped loop of the invention, in one embodiment, uses the passive, air cooled, and low energy capillary pumped loop to perform the majority of the cooling, while providing the added cooling capacity of a liquid-based cooling system in the form of the intermittently operating field replaceable packaged refrigeration module.
[0033] In addition, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module with capillary pumped loop of the invention is compact and simple in both operation and installation, with minimal parts to fail or break and minimal added complexity. Therefore, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module with capillary pumped loop of the invention is sturdy and reliable.
[0034] In addition, the field replaceable packaged refrigeration module portion of the present invention is specifically designed to be operational in any orientation. Consequently, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module portion of the present invention can be mounted, and operated, at any angle. This makes the field replaceable packaged refrigeration module with capillary pumped loop of the present invention particularly well suited for use with electronic systems.
[0035]
[0036] As also shown in
[0037] In one embodiment of the invention, evaporator
[0038] As is well understood by those of ordinary skill in the art, compressor
[0039] In accordance with the present invention, compressor
[0040] As discussed in more detail with respect to
[0041] The linear compressors suitable for use as compressor
[0042] Referring to
[0043] In the embodiment of exemplary linear compressor
[0044] The embodiment of an exemplary linear compressor
[0045] While a specific embodiment of a field replaceable packaged refrigeration module
[0046] Consequently, the present invention should not be read as being limited the particular embodiments discussed above using linear, or any specific, compressor types.
[0047] In one embodiment of the invention, a single capillary pumped loop (
[0048] In accordance with one industry standard, each rack unit has a height of only 1.75 inches. This fact makes use of prior art liquid-based cooling systems extremely difficult, if not impossible, and makes the extensive, and potentially disastrous, plumbing, discussed above, a system requirement. In contrast, a single, or even multiple, field replaceable packaged refrigeration modules
[0049] One example of a physical implementation of the functional diagram of a field replaceable packaged refrigeration module
[0050] As shown in
[0051] In one embodiment of the invention, condenser
[0052] During the normal operation of field replaceable packaged refrigeration module
[0053]
[0054] As noted above, it is highly desirable to provide a cooling system that uses minimal power and has a large thermal inertia. In these applications, a passive refrigeration sub-system is coupled with the field replaceable packaged refrigeration module discussed above to yield a hybrid system that is more power efficient than the field replaceable packaged refrigeration module used alone.
[0055]
[0056] As shown in
[0057] As also shown in
[0058] As shown in
[0059] Capillary pumped loops, such as capillary pumped loop
[0060] The addition of the field replaceable packaged refrigeration module
[0061] In addition, the addition of the field replaceable packaged refrigeration module
[0062] In one embodiment of the invention, a temperature sensor (not shown) is used to monitor the temperature of a component, such as cold plate evaporator
[0063] In another embodiment of the invention, heat source
[0064] In one embodiment of the invention, a single capillary pumped loop
[0065] As discussed above, the present invention is directed to a field and/or customer replaceable packaged refrigeration module with capillary pumped loop that is suitable for use in standard electronic component environments. According to the present invention, advances in compressor technology are incorporated in a field replaceable packaged refrigeration module that is coupled to a capillary pumped loop cold plate evaporator to be used for cooling electronic components. According to the invention, the field replaceable packaged refrigeration module is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe.
[0066] As discussed above, in one embodiment of the invention, the addition of the field replaceable packaged refrigeration module to a capillary pumped loop serves to create a system wherein the capillary pumped loop is used to passively cool the heat source and the field replaceable packaged refrigeration module is used to lower, or maintain, the base temperature of the capillary pumped loop and/or the associated capillary pumped loop working fluid reservoir. Consequently, the field replaceable packaged refrigeration module can be operated intermittently, on an as needed basis, to minimize the power used by the system and to minimize the wear and tear of the moving parts. The net result is the ability to manage and remove heat from the heat source while saving energy since the field replaceable packaged refrigeration module does not need to operate at all times. Consequently, the use of a capillary pumped loop with the field replaceable packaged refrigeration module allows for more cooling capability and more efficient cooling, lowered load on the field replaceable packaged refrigeration module, and a lower failure rate of the cooling system and its moving parts.
[0067] In addition, the addition of the field replaceable packaged refrigeration module to a capillary pumped loop serves to create a system wherein vibration transferred from the field replaceable packaged refrigeration module to the often delicate electronic component to be cooled is significantly reduced because, as discussed above, the field replaceable packaged refrigeration module can be operated intermittently, on an as needed basis.
[0068] As discussed above, the present invention can be utilized in existing electronic systems and unlike prior art liquid-based cooling systems, the various parts of the field replaceable packaged refrigeration module with capillary pumped loop of the invention, including the very minimal tubing, are largely self-contained in the field replaceable packaged refrigeration module with capillary pumped loop. Therefore a failure of any of the tubes would typically not result in the introduction of liquid into, or onto, the electronic devices and would not cause catastrophic system failure, as was the risk with prior art liquid-based cooling systems.
[0069] As discussed above, the field replaceable packaged refrigeration module with capillary pumped loop of the present invention is a modified liquid-based cooling system and therefore provides the cooling capacity of a prior art liquid-based cooling systems. However, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module with capillary pumped loop of the invention is modular and largely self-contained and is therefore field and/or customer replaceable with minimal effort using standard tools. In addition, unlike prior art liquid-based cooling system, the field replaceable packaged refrigeration module with capillary pumped loop of the invention, in one embodiment, uses the passive, simple and low energy capillary pumped loop to perform the majority of the routine cooling, while providing the added cooling capacity of a liquid-based cooling system in the form of the intermittently operating field replaceable packaged refrigeration module. In another embodiment, the field replaceable packaged refrigeration module is positioned directly over the main heat source, such as a CPU, while the capillary pumped loop is used for smaller heat sources or secondary cooling. In addition, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module with capillary pumped loop of the invention is compact and simple in both operation and installation, with minimal parts to fail or break and minimal added complexity. Therefore, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module with capillary pumped loop of the invention is sturdy and reliable.
[0070] As discussed above, in one embodiment of the invention, a single capillary pumped loop is coupled to a single field replaceable packaged refrigeration module as a unit. In other embodiments of the invention, multiple capillary pumped loops are coupled to, and serviced by, a single field replaceable packaged refrigeration module mounted in a central location. In this way, single or multiple heat sources can be serviced by a single field replaceable packaged refrigeration module.
[0071] In addition, capillary pumped loop portion of the field replaceable packaged refrigeration module with capillary pumped loop of the present invention can be constructed using very small tubing and evaporator plates and these tubing and evaporator plates can be used to access electronic devices to be cooled that are in very constrained spaces.
[0072] As discussed above, in one embodiment of the invention, the capillary pumped loop portion of the field replaceable packaged refrigeration module with capillary pumped loop of the present invention is a “micro-capillary pumped loop” that can be fabricated in the electronic component to be cooled using existing technology.
[0073] In addition, the field replaceable packaged refrigeration module portion of the present invention is specifically designed to be operational in any orientation. Consequently, unlike prior art liquid-based cooling systems, the field replaceable packaged refrigeration module portion of the present invention can be mounted, and operated, at any angle. This makes the field replaceable packaged refrigeration module with capillary pumped loop of the present invention particularly well suited for use with electronic systems. It should be recognized that, while the present invention has been described in relation to the specific embodiments thereof discussed above, those skilled in the art might develop a wide variation of structural and operational details without departing from the principles of the invention.
[0074] As one example, the choice of a linear compressor, or any particular linear compressor, for use as compressor
[0075] As another example, specific dimensions were discussed above as examples of possible values for length