Title:
Riveted bond structure for heat sink
Kind Code:
A1


Abstract:
By the riveting protrusion of the base and the riveting hole of the sideboard, a riveted bond structure for a heat sink of a central processing unit (CPU) rivets the riveting protrusion outside of the sideboard by an external force to mount the base and the sideboard. More particularly, the riveting protrusion has two identical V-shaped pressing parts. Peak points of the V-shaped pressing parts are disposed in a line. When the riveting protrusion inserts through the riveting hole, the V-shaped pressing parts are respectively riveted aside by an external force to mount the base and the sideboard.



Inventors:
Huang, Hung-chu (Shinjuang City, TW)
Application Number:
10/358217
Publication Date:
11/27/2003
Filing Date:
02/05/2003
Assignee:
DATECH TECHNOLOGY CO., LTD.
Primary Class:
Other Classes:
257/E23.086
International Classes:
H01L23/40; (IPC1-7): F28F7/00
View Patent Images:



Primary Examiner:
BRITTAIN, JAMES R
Attorney, Agent or Firm:
TROXELL LAW OFFICE PLLC (FALLS CHURCH, VA, US)
Claims:

What is claimed is:



1. A riveted bond structure for a heat sink of a central processing unit (CPU), comprising at least a base and at least a sideboard, said base having at least a riveting protrusion and said sideboard having riveting holes corresponding to said riveting protrusion, said riveting protrusion being inserted through said riveting hole and being riveted together outside of said sideboard by an external force to mount said base and said sideboard, characterized in that: said riveting protrusion has two identical V-shaped pressing parts, peak points of said V-shaped pressing parts are disposed in a line, when said riveting protrusion inserts through said riveting hole, said V-shaped pressing parts are respectively riveted aside by an external force to mount said base and said sideboard.

Description:

REFERENCE CITED

[0001] 1. U.S. Pat. No. 6,244,332 B1

[0002] 2. Patent No. 2000-315755 (Japan)

[0003] 3. Patent No. DE 3301481 A1

FIELD OF THE INVENTION

[0004] The present invention relates to a riveted bond structure for a heat sink of a CPU, and more particularly, to an improved riveted bond structure.

BACKGROUND OF THE INVENTION

[0005] The most important part of a computer is a central processing unit (CPU). Since the computer technique improves frequently, its speed and efficiency become much faster and the heat generated relatively also becomes much more. Accordingly, a heat dissipation device is often disposed above the CPU to dissipate heat. The present invention provides an improved riveted bond structure, which makes the CPU work steady.

[0006] Referring the conventional heat sink in FIG. 1A, the present invention includes a heat sink 1, a base 11, and two sideboards 12. By riveting the riveting protrusion 111 with the riveting hole 121, the base 11 and the sideboard 12 are mounted together. However, limited by current rivet techniques, it is difficult to rivet the riveting protrusion 111 evenly. Therefore, there are some gaps between the riveting protrusion 111 and the riveting hole 121, as shown in FIG. 1B. Accordingly, the base 11 and the sideboard 12 will get loose easily, resulting in higher manufacturing cost.

[0007] Generally, the riveting protrusion is in a square shape, such as the riveting protrusion 111 in FIG. 1A), or in a round shape. Referring FIG. 2A, another conventional heat sink is shown. By riveting the riveting protrusion 211 with the riveting hole 221, the base 21 and the sideboard 22 are mounted together. However, also limited by current rivet techniques, it is difficult to rivet the riveting protrusion 211 evenly. Therefore, there are some gaps between the riveting protrusion 211 and the riveting hole 221, as shown in FIG. 2B. Accordingly, the base 21 and the sideboard 22 will get loose easily, resulting in higher manufacturing cost.

[0008] Moreover, a W-shaped riveting protrusion 311 is shown in FIG. 3A. The riveting protrusion 311 includes two pressing parts 311a and 311b. However, the peak points a, a′, b, and b′ of these pressing parts 311a and 311b are not in a same line. Instead, there is a distance D between the peak points a, b and a′, b′. Since the technique for manufacturing riveting protrusion is limited, the distance D is inaccurate. If the distance D is too large, after riveted by an external force as shown in FIG. 3B, the base 31 and the sideboard 32 will get loose easily, resulting in higher manufacturing cost.

SUMMARY OF THE INVENTION

[0009] The main objective of the present invention is to provide a riveted bond structure with stronger riveting capacity, which improves the structure of the base and the sideboard of the heat sink.

[0010] Therefore, another objective of the present invention is to provide a riveted bond structure for heat sink, which is simple-manufactured and hard to loose.

[0011] The present invention provides a riveted bond structure for a heat sink of a CPU. By the riveting protrusion of the base and the riveting hole of the sideboard, the riveting protrusion is riveted outside of the sideboard by an external force to mount the base and the sideboard. More particularly, the riveting protrusion has two identical V-shaped pressing parts. Peak points of the V-shaped pressing parts are disposed in a line. When the riveting protrusion inserts through the riveting hole, the V-shaped pressing parts are respectively riveted aside by an external force to mount the base and the sideboard.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG. 1A, FIG. 2A, and FIG. 3A show the conventional structure diagram before riveting with the heat sink.

[0013] FIG. 1B, FIG. 2B, and FIG. 3B show the conventional structure diagram and the partial diagram after riveting with the heat sink.

[0014] FIG. 4A shows the structure diagram and the partial diagram before riveting with the heat sink of the present invention.

[0015] FIG. 4B shows the structure diagram and the partial diagram after riveting with the heat sink of the present invention.

[0016] FIG. 5 shows a structure diagram according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0017] The relative techniques, means, and specific structure features used in the present invention for achieving the above objectives will be fully understood by a preferred exemplary embodiment, following with drawings.

[0018] The present invention provides a riveted bond structure for a heat sink of a CPU. Please refer to FIG. 4A, the present invention includes at least a base 41 and at least a sideboard 42. The base 41 has at least a riveting protrusion 411. The sideboard 42 has riveting holes 421 corresponding to the riveting protrusion 411. The riveting protrusion 411 inserts through the riveting holes 421 and rivets the riveting protrusion 411 outside the sideboard 42 by an external force to mount the base 41 and the sideboard 42. More particularly, referring to FIG. 4B, the riveting protrusion 411 has two identical V-shaped pressing parts 411A and 411B. Peak points A, A′, B, and B′ of the V-shaped pressing parts 411A and 411B are disposed in a line. When the riveting protrusion 411 inserts through the riveting hole 421, the V-shaped pressing parts 411A and 411B are respectively riveted aside by an external force to mount the base 41 and the sideboard 42. In a preferred embodiment, referring to FIG. 5, the riveted bond structure of the present invention is combined with a heat sink 5, disposed above a CPU of a computer to dissipate heat and make the CPU work steady. Although current techniques of making the riveting protrusion 411 are limited and therefore may cause an error distance between the peak points A, A′ and B, B′, the error distance will be far less than the thickness of the sideboard 42 and will not result in rivet-loosing.

[0019] As mentioned above, the riveted bond structure of the present invention is truly a practical invention. The present invention is not only of great practicability, but also an innovative creation, expanding the tolerable range. Furthermore, the present invention also increases the yield rate. Therefore, the invention is not just an obvious application and is an unobvious creation. Furthermore, the invention can increase the yield rate without increasing the cost when producing on large scale. Accordingly, the present invention meets all conditions for patent application.

[0020] The present invention has been described above with reference to a preferred embodiment. However, other embodiments not shown herein equally possible within the scope of the invention is in the scope of the present invention. Various changes, modifications and enhancements could be made therein without departing from the scope of the present invention as set forth in the following claims.





 
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