Title:
Heat sink module
Kind Code:
A1


Abstract:
A heat sink module has a heat dissipation performance by a thermal conducting tube with a vacuum and a cooling fluid therein. The thermal conducting tube corresponds to a center of a CPU, so most of the heat from the CPU is able to be dissipated quickly to keep the CPU in a normal operating temperature range.



Inventors:
Lin, Yu-shen (Taipei Hsien, TW)
Application Number:
09/976951
Publication Date:
04/17/2003
Filing Date:
10/12/2001
Assignee:
LIN YU-SHEN
Primary Class:
Other Classes:
257/E23.088, 165/104.33
International Classes:
H01L23/427; (IPC1-7): F28D15/00
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Primary Examiner:
ATKINSON, CHRISTOPHER MARK
Attorney, Agent or Firm:
Alan D. Kamrath (Minneapolis, MN, US)
Claims:

What is claimed is:



1. A heat sink module, comprising: a base adapted to be mounted on a CPU; a thermal conducting body secured to the base, which is hollow and airtight and has a vacuum chamber, wherein cooling fluid is put into the vacuum chamber to dissipate heat from the CPU quickly.

2. The heat sink module as claimed in claim 1, wherein a hole corresponding to a center of the CPU is defined in the base, and the thermal conducting body is retained in the hole and corresponds to the center of the CPU.

3. The heat sink module as claimed in claim 1, wherein conducting plates are stacked together on the base and each connects to the thermal conducting body.

4. The heat sink module as claimed in claim 1, wherein a through hole is defined in each of the conducting plates to pass around the thermal conducting body.

5. The heat sink module as claimed in claim 3, wherein each conducting plate is U shape, when stacked together a gap is defined between two adjacent conducting plates.

6. The heat sink module as claimed in claim 1, wherein combinations of the thermal conducting body comprise a thermal conducting tube having an open end and a cover sealed on the open end.

7. The heat sink module as claimed in claim 6, wherein the tube further comprises a rough inner face.

8. The heat sink module as claimed in claim 1, further comprising a fan connecting to the base and corresponds to the thermal conducting body.

9. The heat sink module as claimed in claim 3, further comprising a fan connecting to the base and corresponds to the thermal conducting body.

Description:

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a heat sink module and more particularly to a heat sink module that is adapted to be retained on a CPU with a fast computing speed and effectively carries heat away from the CPU.

[0003] 2. Description of Related Art

[0004] As semiconductor technology has developed, CPUs with giga-Hz computing speeds have denser integrated circuitry with an accompanying high heat problem when the CPU is operating.

[0005] Usually, a common heat sink with multiple fins and a fan was mounted on early CPU products so that heat was dissipated from the CPU in a timely manner. However, the common heat sink is not able to effectively dissipate the higher heat from the giga-Hz CPU. If that heat is not dispersed quickly the CPU will quickly overheat and malfunction thereby leading to considerable inconvenience and cost to the user. With the increasing popularity of CPUs with high computing speeds nowadays, a problem arises in that the CPUs generate more heat than the early CPU products.

[0006] The present invention provides a compact and efficient heat sink module to mitigate and obviate the aforementioned problems.

SUMMARY OF THE INVENTION

[0007] The objective of the present invention is to provide an effective heat sink module for quickly dispersing heat from a CPU having fast computing speeds. The invention uses a hollow and vacuum thermal conducting body corresponding to the center of the CPU.

[0008] Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG. 1 is an exploded perspective view of a first embodiment of the heat sink module in accordance with the present invention;

[0010] FIG. 2 is a perspective view of the heat sink module in FIG. 1;

[0011] FIG. 3 is a cross sectional side plan view of the heat sink module in FIG. 1 mounted on a CPU;

[0012] FIG. 4 is a perspective view of the heat sink module in FIG. 1 with a fan;

[0013] FIG. 5 is a perspective view of a second embodiment of the heat sink module in accordance with the present invention;

[0014] FIG. 6 is a cross sectional side plan view of the heat sink module in FIG. 5; and

[0015] FIG. 7 is a perspective view of the heat sink module in FIG. 5 with a fan.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0016] With reference to FIGS. 1, 2 and 3, a first embodiment of a heat sink module includes a base (10), a thermal conducting tube (11) and a cover (12). The base (10) is connected separably to a CPU (30). The thermal conducting tube (11) is hollow, has an open end and a closed end, a chamber (110) is defined in the thermal conducting tube (11) and is connected to the base (10). The cover (12) seals the open end of the thermal conducting tube (11) to make the chamber (110) airtight.

[0017] A hole (101) is defined in the base (10) to mount the thermal conducting tube (11). The thermal conducting tube (11) has a rough inner face of to provide a greater area of the thermal conducting tube (11) to dissipate heat. A cooling fluid (40) is put into the chamber (110) but does not fill the chamber (110). Then a vacuum is drawn on the remaining space in the chamber (110) to conduct the heat quickly to the cooling fluid (40).

[0018] When the base (10) is mounted on the CPU (30), the hole (101) corresponds to a center of the CPU (30). The temperature at the center of the CPU (30) is higher than any other portion of the CPU (30). Therefore the thermal conducting tube (11) is able to directly dissipate heat quickly from the CPU (30), and the temperature of the CPU (30) can be maintained in a normal range during operation of the CPU. With reference to FIG. 4, a fan (20) is mounted on the base (10) near the thermal conducting tube (11) to disperse heat from the thermal conducting tube (11).

[0019] With reference to FIG. 5, a second embodiment of the heat sink module comprises a base (10a), a thermal conducting tube (11a), a cover (12a) and multiple conducting plates (13). The base (10a), thermal conducting tube (11a) and cover (12a) are the same as the first embodiment of the heat sink module. The U shape conducting plates are stacked on the base (10a) and connected to the thermal conducting tube (11a).

[0020] With reference to FIG. 6, a through hole (131) is defined in each conducting plate (131) to fit around the thermal conducting tube (11a). Besides, because each conducting plate is U shape, when the conducting plates (13) are stacked together, a gap (132) is formed between adjacent conducting plates (13) to facilitate dispersing heat from the conducting plates (13).

[0021] With reference to FIG. 7, a fan (20a) mounted with the conducting plates (13) to quickly carry heat away from each of the conducting plate (13) through the gap (132).

[0022] Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.