Title:
Ductile grinding processing for the diamond or diamond film
Kind Code:
A1


Abstract:
The present invention is to provide a kind of a ductile grinding processing technique for the diamond material, wherein it comprises of: after giving a heat energy to heat the diamond material, there gives a force to the heated diamond material, and by giving a heat and a force it is able to proceed a ductile grinding processing technique for the diamond material; for the diamond film to proceed a ductile grinding processing technique comprises of: there gives a heat energy to heat the diamond film, and then grinds the heated diamond material with a grinding wheel, and by use of heating and grinding with a grinding wheel it is able to proceed a ductile grinding processing technique for the diamond material.



Inventors:
Tsai, Hung-yin (Hsin-chu, TW)
Lin, Hung-yi (Hsin-chu, TW)
Wu, Tung-chuan (Hsin-chu, TW)
Application Number:
09/929351
Publication Date:
02/20/2003
Filing Date:
08/15/2001
Assignee:
Industrial Technology Research Institute
Primary Class:
International Classes:
B24B1/00; B24B37/04; (IPC1-7): B24B1/00
View Patent Images:
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Primary Examiner:
NGUYEN, DUNG V
Attorney, Agent or Firm:
BACON & THOMAS, PLLC (Alexandria, VA, US)
Claims:

What is claimed is:



1. A kind of a ductile grinding processing for the diamond or diamond film, comprsing: provides a heat energy to heat the diamond film; grinds the heated diamond material with a grinding wheel; and by use of heating and grinding with a grinding wheel there proceeds a ductile grinding process for the diamond material.

2. A ductile grinding process for the diamond material of claim 1, wherein said the heat source can be a physical or chemical method.

3. A ductile grinding process for the diamond material of claim 1, wherein said the power produced by heating is 20W˜1000W.

4. A ductile grinding process for the diamond material of claim 1, wherein said the grinding feeding amount is 0.05˜5 μm.

5. A ductile grinding process for the diamond material of claim 1, wherein said the grinding feeding amount can be controlled by the computer program or the kinematic mechanism.

6. A ductile grinding process for the diamond material of claim 1, wherein said a grinding wheel is composed of the diamond catalyst and the abrasives.

7. A ductile grinding process for the diamond material of claim 6, wherein said the diamond catalyst is selected from iron and nickel.

8. A ductile grinding process for the diamond material of claim 6, wherein said an abrasive is selected from diamond and cBN hard materials.

9. A kind of a ductile grinding processing for the diamond material, comprsing: provides a heat energy to heat the diamond material; gives a force to the heated diamond material; and by giving a heat and a force there proceeds a ductile grinding process for the diamond material.

10. A ductile grinding process for the diamond material of claim 9, wherein said the heat source can be a physical or chemical method.

11. A ductile grinding process for the diamond material of claim 9, wherein said the power produced by heating is 20W˜1500W.

12. A ductile grinding process for the diamond material of claim 9, wherein said a giving force method can be hydraulic pressure, oil pressure, pneumatic pressure, and kinematic mechanism.

13. A ductile grinding process for the diamond material of claim 12, wherein said the kinematic mechanism method can be a grinding wheel processing.

14. A ductile grinding process for the diamond material of claim 13, wherein said the grinding feeding amount can be calculated and controlled by the computer program or the kinematic mechanism.

15. A ductile grinding process for the diamond material of claim 13, wherein said a grinding wheel is composed of the diamond catalyst and the abrasives.

16. A ductile grinding process for the diamond material of claim 15, wherein said the diamond catalyst is selected from iron and nickel.

17. A ductile grinding process for the diamond material of claim 15, wherein said an abrasive is selected from diamond and cBN hard materials.

Description:

BACKGROUND OF INVENTION

[0001] 1. Field of Invention

[0002] The present invention is to provide a kind of a ductile grinding processing technique for the diamond material, wherein by giving a heat and an appropriate force methods it is able to proceed a ductile grinding processing technique for the diamond material, and to reduce the cost as well as the possibility of the failure of process.

[0003] 2. Description of the Prior Art

[0004] At present, the mobile communication system is a modern property, for example: cellular phone, bluetooth module, mobile network browser, global position system (GPS), personal digital assistant (PDA), and B. B. Call, etc. are modern products in the mobile communication system, and they all have demands for high frequency and high electric endurance. According to this trend, therefore on the diamond film by using sputtering method or chemical vapor deposition (CVD) method it forms a polycrystal ZnO piezoelectric film, through the faster transporting rate of surface acoustic wave (SAW) it increases the minimum of line width of an electrode demand on the wave filter chip for the high frequency of SAW.

[0005] Traditional processing diamond proceeds with a lapping process method. Owing to the highest toughness of diamond, it belongs to an extremely difficult be processed material, by using this processing method it is necessary to employ an extremely high pressure and long time, therefore the processing cost is pretty high. Hence, there employs to use chemicals or to flow other gases to heat the apparatus, and the diamond molecular structure can be relatively damaged, but no matter of employing chemicals or gases it needs the repeatedly treatment processes and the complicated mechanical equipments, and also it causes the processing environment be poor and polluted, and increases the cost.

[0006] No matter of using a lapping method or using chemicals, gases, and heating methods process, it is still necessary to perform a lapping process for a diamond to make the diamond surface be smooth and flat. Not only there increases one more of the lapping process cost, but also after the first processing treatment the diamond film becomes much thinner and more fragile. Therefore, this process for the diamond surface being smooth and flat would increase the risk of the diamond film cracking.

[0007] In order to reduce the risk of the diamond film cracking, there employs plasma, ion beam, or excimer laser etc. to perform the processing treatment for the diamond film, however, the cost of the method be used is too high and also the energy is consumed very much.

SUMMARY OF THE INVENTION

[0008] Hence, the aim of the present invention is to solve the drawbacks described above. In order to avoid the presence of the drawbacks described above, the present invention is to provide a kind of a ductile grinding processing technique for the diamond material, wherein it can reduce the pressure needed of the manufacturing process.

[0009] The other aim of the present invention is to provide a kind of a ductile grinding processing technique for the diamond material, wherein it can reduce the time performed of the manufacturing process.

[0010] The other aim of the present invention is to provide a kind of a ductile grinding processing technique for the diamond material, wherein it can simplify the procedures of the manufacturing process.

[0011] The other aim of the present invention is to provide a kind of a ductile grinding processing technique for the diamond material, wherein it can reduce the pollution produced from the manufacturing process.

[0012] The other aim of the present invention is to provide a kind of a ductile grinding processing technique for the diamond material, wherein it can save the cost of the manufacturing process.

[0013] In order to obtain the aims described above, the present invention refers to using a heat energy to heat the diamond film and grinding the heated diamond material with a grinding wheel, through heating and grinding with a grinding wheel it is able to proceed a ductile grinding processing technique for the diamond material; for the diamond material after there gives a heat energy to heat the heated diamond material, there gives a force to its heated diamond material, through giving a heat and force there proceeds a ductile grinding process for the diamond material, it can reduce the pressure, time, and pollution of lapping, and simplify the grinding process to save the cost of manufacturing process.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] FIG. 1 illustrates the grinding process scheme of the present invention.

[0015] FIG. 2 illustrates the applied scheme of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] A ductile grinding processing technique for the diamond film refers to producing the heat of power with 20W˜1000W heat energy by using a physical or chemical method to heat the diamond film, and grinding the heated diamond material with a grinding wheel, which is composed of diamond catalyst (ex. iron or nickel) and diamond or cBN hard material abrasives, by using computer program or kinematic mechanism to control the calculated feeding amount of 0.05˜5 μm, through heating and grinding with a grinding wheel it is able to proceed a ductile grinding processing technique for the diamond material.

[0017] A ductile grinding processing technique for the diamond material comprises of: providing the heat of power with 20W˜1500W heat energy by using a physical or chemical method to heat the diamond material, and giving a force to the heated diamond material by using an appropriate method such as hydraulic pressure, oil pressure, pneumatic pressure, and kinematic mechanism etc., through giving a heat and a force it is able to proceed a ductile grinding processing technique for the diamond material.

[0018] FIG. 1 illustrates the grinding process scheme of the present invention. By using laser 3 there preheats the diamond film 11 and substrate 12 to increase the temperature, before entering into a ductile grinding region there obtains the much higher energy, after entering into a grinding wheel processing region, there utilizes a grinding wheel 2, which is composed of diamond catalyst (ex. iron or nickel) and diamond or cBN hard material abrasives, and controls the feeding amount of a grinding wheel 2 processing equipment, there controls an appropriate feeding amount in a ductile grinding region to prevent the fragile region of proceeding a ductile grinding for the diamond film, and to reduce the problems of the diamond cracking.

[0019] By using laser 3 there preheats the processed diamond film 11, it not only removes other impurities on the diamond film 11 surface with heat, but also after a ductile grinding processing the loosing structure of the diamond film 11 surface rearranges the arrays to recover its characteristic.

[0020] FIG. 2 illustrates the applied scheme of the present invention. For a large area of the diamond film 11 or a large volume of the diamond material there proceeds ductile grinding, which is by using one or plural groups of laser to proceed heating to prevent anisotropic heating due to area or volume, or to lose the heat energy rapidly.

[0021] The present invention specially discloses and describes selected the best examples. It is to be understood, however, that the present invention is not limited to the specific features shown and described. The invention is claimed in any forms or modifications within the spirit and the scope of the appended claims.