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[0002] In the course of integrated circuit manufacture, a semiconductor wafer typically undergoes numerous processing steps, including deposition, patterning, and etching steps. Additional details on how semiconductor wafers are manufactured can be found in the article “Abrasive Machining of Silicon” by Tonshoff, H. K.; Scheiden, W. V.; Inasaki, I.; Koning. W.; Spur, G. published in the Annals of the International Institution for Production Engineering Research Volume 39/2/1990, pages 621 to 635. At each step in the process, it is often desirable to achieve a pre-determined level of surface “planarity,” “uniformity,” and/or “roughness.” It is also desirable to minimize surface defects such as pits and scratches. Such surface irregularities may affect the performance of the final semiconductor device and/or create problems during subsequent processing steps.
[0003] One accepted method of reducing surface irregularities is to treat the wafer surface with a slurry containing a plurality of loose abrasive particles, dispersed in a liquid, and a polishing pad; this is commonly referred to as “planarizing” or “planarization”. The planarization process is typically a chemical-mechanical polishing (CMP) process. One problem with CMP slurries, however, is that the process must be carefully monitored in order to achieve the desired amount of planarization. It is important that the planarization process be stopped when the correct thickness of layer material has been removed; that is, when the proper endpoint has been reached. Removing too much of the layer results in loss of wafer yield, which could require redepositing of the circuitry, and not removing a sufficient amount of the layer may require continued planarization. Various methods have been used to attempt to detect the endpoint for stopping the CMP process. These methods include: straight timing, friction, optical results, acoustical results, and conductive characteristics. There have been references related to endpoint detection by chemical analysis; see for example, U.S. Pat. Nos. 6,021,679 and 6,066,564, and PCT Published application WO 99/56972. These references disclose detecting the endpoint by monitoring a chemical reaction product caused by the reaction of a component from the abrasive slurry and the wafer.
[0004] Additionally, there have been references that disclose using visual or optical techniques for in-situ monitoring of the CMP process; see for example, U.S. Pat. No. 6,068,538 which discloses using a polishing device having a moveable window positioned below the wafer being processed to view the wafer surface. During polishing, the window is removed from the wafer surface, but is moved to be adjacent the wafer during the visual inspection.
[0005] Improvements in real-time endpoint detection methods and processes for determining when the desired level of planarization of the wafers has been obtained, are desired.
[0006] The present disclosure is directed to fixed abrasive articles used for polishing or planarization of semiconductor wafers, and methods of using those abrasive articles for detection of the endpoint of the CMP process.
[0007] The abrasive article is a fixed abrasive article having an element or feature therein that allows monitoring of a wafer surface therethrough. By the term “fixed abrasive article”, it is meant that the abrasive article has an abrasive coating adhered to a backing or other carrier layer. The monitoring element allows monitoring of the wafer surface through a portion of the abrasive article; this monitoring element can be referred to as a “window”. This window may be an area free of abrasive coating, an area having a decreased amount of abrasive coating, or any other area that allows monitoring of the wafer surface through the abrasive article. The benefits of using a fixed abrasive article include the lack of freely moving abrasive particles, such as is encountered when using an abrasive slurry, which can interfere with the endpoint measurements through the monitoring element.
[0008] In one embodiment, the window allows transmission of radiation therethrough, the radiation having a decrease of no greater than about 50% as it passes through the window. The term “radiation” is intended to all types of radiation, including electromagnetic radiation, gamma rays, radio frequencies, microwaves, x-rays, infrared radiation, ultraviolet radiation, visible light, and the like. The radiation may be reflected by the wafer surface or may be emitted by the surface. In one embodiment, the window allows transmission of visible light therethrough, the transmission having a decrease no greater than about a 50% as it passes through the window.
[0009] In another embodiment, the window allows transmission of radiation therethrough, with the amount of radiation passing therethrough sufficient to allow for quantitative evaluation of changes of the wafer surface. That is, the amount of radiation lost during passing through the window of the abrasive article is irrelevant, as long as the level is sufficient to monitor changes in the wafer surface.
[0010] The surface of the wafer can be monitored for changes such as temperature, visible light spectrum patterns, radiation scattering effects, and the like.
[0011] The window, through which the wafer surface is monitored, can be continuous along an extended length of abrasive article; for example, the window can extend along the length of a roll of abrasive article. The window can be positioned in essentially the same position along the length of the abrasive article, or the position of the window can vary. In another embodiment, the window is a discrete window bounded by abrasive coating on all sides. Alternately, the abrasive article can have a specific shape and size, such as an abrasive disc; the window can extend from one edge of the abrasive disc to an opposite edge, or the window can be a discrete window bounded by abrasive coating on all sides.
[0012] The fixed abrasive article of the present disclosure can be, and preferably is, a textured or three-dimensional abrasive article. By the terms “textured” and “three-dimensional”, it is meant that the abrasive coating has a discernible surface pattern. The pattern or texture may be random or precisely placed on the backing. In some embodiments, the abrasive coating is a plurality of abrasive composites on the backing; the abrasive composites may be precisely or irregularly shaped. Preferably, the abrasive composites are precisely shaped. The abrasive composites, whether precisely or irregularly shaped, can be of any geometrical shape defined by a substantially distinct and discernible boundary; such shapes include pyramidal, truncated pyramidal, and the like.
[0013] The abrasive coating is a plurality of abrasive particles held to the backing by a binder. The binder can be any material, such as a metal or ceramic binder, but is generally and preferably an organic binder. In most embodiments, the binder is formed from a binder precursor. In the embodiments where the binder is an organic binder, the binder is formed by the curing or polymerization of the binder precursor.
[0014] In one preferred embodiment, the binder is formed by an addition polymerization, that is, a free-radical or cationic polymerization, of a binder precursor. Additionally, the binder precursor can be polymerized by exposure to radiation or radiant energy, along, if necessary, with an appropriate curing agent. Preferably, the binder precursor includes multi-functional acrylate resin(s), mono-functional acrylate resin(s), or mixtures thereof.
[0015] Methods of making an abrasive article having a window are disclosed. Generally, the abrasive article can be made by any method known for making abrasive articles, except that the present disclosure includes the addition of a window within the abrasive coating. The window can be formed by various methods, including: leaving a portion of the backing without the abrasive coating, eliminating the abrasive coating on a portion of the backing after the abrasive coating has been applied, modifying the abrasive coating to provide the desired transmission properties, or removing portions of the abrasive article and applying onto a carrier backing.
[0016] Methods of using the abrasive article to planarize the wafer and monitor the endpoint of the planarization process without removal of the abrasive article are also disclosed. The abrasive article is brought into contact with the wafer surface at a desired pressure, preferably in the presence of a coolant or lubricant, such as water or any aqueous or non-aqueous chemistry, and the abrasive article and wafer are moved in relation to each other. After a prescribed period of planarization, the surface of the wafer is optically examined through the window in the abrasive article. In another embodiment, the surface of the wafer can be continuous monitored through the window in the abrasive article.
[0017] Other features, advantages, and further methods of practicing the disclosure will be better understood from the following description of figures and the preferred embodiments of the present disclosure.
[0018]
[0019]
[0020]
[0021]
[0022]
[0023]
[0024]
[0025]
[0026]
[0027]
[0028]
[0029]
[0030]
[0031]
[0032]
[0033] Referring now to the drawings,
[0034] Process
[0035] In most embodiments wafer
[0036] In most embodiments, carrier
[0037] Platen
[0038] Sensor
[0039] In another embodiment, sensor
[0040] In some embodiments it is desired that sensor
[0041] Sensor
[0042] Abrasive Article Used for Polishing
[0043] In accordance with the present disclosure, the fixed abrasive article
[0044] The window area of abrasive article
[0045] Generally, the area of the window is no greater than about 50% of the area of the abrasive article used for the CMP process. In most embodiments, the area of the window is no greater than about 25% of the abrasive article area. In processes where the abrasive article has continuous longitudinal motion in respect to the wafer during the planarization process, the percentage of window area in contact with the wafer surface will generally remain relatively constant as the abrasive article is moved in relation to the wafer.
[0046] The monitoring element or window can be continuous along an extended length of abrasive article; for example, the window can extend along the length of a roll of abrasive article. The window can be positioned in essentially the same position along the length of the abrasive article, or the position of the window can vary in respect to an edge of the abrasive article. In an alternative embodiment, the window is a discrete window bounded by abrasive coating and does not extend the length of the abrasive article. Another embodiment is to have a window extend across the width of an abrasive article.
[0047] Referring now to
[0048] In
[0049] In
[0050] In
[0051] In
[0052]
[0053] Referring now to
[0054] The process according to the present invention may include one sensor
[0055] In
[0056] An abrasive article
[0057] In
[0058] In each of the embodiments shown in
[0059] The abrasive article of the present invention is preferably a textured or three-dimensional abrasive article; it is called a “three-dimensional” abrasive article because it has a three-dimensional abrasive coating generally formed by an array of individual abrasive composites each having abrasive particles dispersed in a binder system. It is preferred that the composites are three dimensional, having work surfaces which do not form part of an integral layer, thus providing portions of the abrasive coating that are recessed from the working surface. These recesses provide room for debris removal and provide room for fluid interaction between the abrasive article and wafer surface.
[0060] The abrasive article used in this disclosure may be a so called “structured abrasive article”. A structured abrasive article means an abrasive article having a plurality of individual shaped composites, such as precisely-shaped composites, positioned on a backing, each composite comprising abrasive particles dispersed in a binder.
[0061] Other examples of three-dimensional abrasive articles usable for the method of the present disclosure include: (1) “beaded-type abrasive articles” which have beads (generally spherical and usually hollow) of binder and abrasive particles; these beads are then bonded to a backing with a binder; (2) abrasive agglomerates bonded to a backing, where the abrasive agglomerates include abrasive particles bonded together with a first binder; these agglomerates are then bonded to a backing with a second binder; (3) abrasive coating applied by rotogravure roll or other embossed roll; (4) abrasive coating applied through screen to generate a pattern; (5) abrasive coating on a contoured or embossed backing. These examples are not limiting to the types of three-dimensional abrasive articles that can be used for the abrasive articles and the various methods of the present invention; rather, the list provided is merely a sampling of abrasive articles that have a three-dimensional or textured coating. Various other methods to provide abrasive coatings having a texture can used, and these abrasive articles can be used in the present planarization method.
[0062] Various three-dimensional, fixed, abrasive articles in accordance with the present invention will be described in detail in relation to
[0063] Abrasive article
[0064] Referring to
[0065] Abrasive article
[0066] Referring to
[0067] Abrasive article
[0068] The various embodiments of abrasive articles shown in
[0069] As understood, the abrasive article of the present invention is a fixed abrasive article, meaning that the abrasive coating is present on a backing. The backing used can be any backing material generally used for abrasive articles, such as polymeric film (including primed polymeric film), cloth, paper, nonwovens (including lofty nonwovens), treated versions thereof and combinations thereof. Generally, metal backings are not used because of their resistance to passage of radiation therethrough. The backing can have a treatment to improve the adhesion of the abrasive coating onto the backing. Paper and cloth backings can have a water proofing treatment so that the backing does not appreciably degrade during the planarization or polishing operation, as some water is used during the process. In one preferred embodiment, the backing is at least partially transparent to visible light, so that at least some amount of visible light is able to be transmitted through the backing.
[0070] The backing can have one half of an attachment system on its back surface to secure the abrasive article to the support pad or back-up pad. This attachment system half can be a pressure sensitive adhesive (PSA) or tape, a loop fabric for a hook and loop attachment, a hook structure for a hook and loop attachment, or an intermeshing attachment system.
[0071] The abrasive article can have any suitable shape, such as round, oval or rectangular depending on the particular shape of the lap pad (that is, the support pad) being employed. In many instances, the abrasive article will be slightly larger in size than the lap pad. In some embodiments, the abrasive article is provided as an extended length on a roll or reel. An abrasive article may be formed into an endless belt by conventional methods by splicing the abutted ends of an elongated strip of the sheet material. Additionally, the abrasive article may be die cut and/or slit to any desired configuration or shape.
[0072] The abrasive coating of the abrasive article includes abrasive particles dispersed in a binder. The abrasive particles are preferably aluminum oxide (alumina), silicon oxide (silica), cerium oxide (ceria), rare earth compounds, or mixtures thereof, although it is understood that any abrasive particle can be used. The particular abrasive particle used will generally depend on the material being polished or planarized. Examples of rare earth compounds suitable for planarization can be found in U.S. Pat. No. 4,529,410 (Khaladji et al.). It is believed that some abrasive particles may provide a chemo-mechanical element to the planarization procedure. As used herein, chemo-mechanical refers to a dual mechanism where corrosion chemistry and fracture mechanics both play a role in wafer polishing. In particular, it is believed that abrasive particles such as cerium oxide and zirconium oxide, for example, provide a chemical element to the polishing phenomenon for SiO
[0073] The abrasive particles may be uniformly dispersed in the binder or alternatively the abrasive particles may be non-uniformly dispersed. It is preferred that the abrasive particles are uniformly dispersed so that the resulting abrasive coating provides a consistent cutting/polishing ability.
[0074] The average size of the abrasive particles is at least about 0.001 micrometer; the average size is no greater than about 20 micrometers. Typically, the average size is about 0.01 to 10 micrometers. In some instances, the abrasive particles preferably have an average particle size less than 0.1 micrometer. In other instances, it is preferred that the particle size distribution results in no or relatively few abrasive particles that have a particle size greater than about 2 micrometers, preferably less than about 1 micrometer and more preferably less than about 0.75 micrometer. At these relatively small particle sizes, the abrasive particles may tend to aggregate by interparticle attraction forces. Thus, these aggregates may have a particle size greater than about 1 or 2 micrometers and even as high as 5 or 10 micrometers. It is then preferred to break up these aggregates to an average size of about 2 micrometers or less. In some instances, it is preferred that the particle size distribution be tightly controlled such that the resulting abrasive article provides a very consistent surface finish on the wafer surface.
[0075] To form an abrasive composite or coating, the abrasive particles are dispersed in a binder precursor to form an abrasive slurry, which is then exposed to an energy source to aid in the initiation of the polymerization or curing process of the binder precursor. Examples of energy sources include thermal energy and radiation energy, which includes electron beam, ultraviolet light, and visible light. The cured binder precursor forms the binder.
[0076] Examples of suitable binder precursors which are curable via an addition (chain reaction) mechanism include binder precursors that polymerize via a free radical mechanism or, alternatively, via a cationic mechanism. These binder precursors include acrylated urethanes, acrylated epoxies, ethylenically unsaturated compounds including acrylate monomer resin(s), aminoplast derivatives having pendant α, β-unsaturated carbonyl groups, isocyanurate derivatives having at least one pendant acrylate group, isocyanate derivatives having at least one pendant acrylate group, epoxy resins, vinyl ethers, and mixtures and combinations thereof. The term acrylate encompasses acrylates and methacrylates.
[0077] Various methods for producing abrasive articles having either precisely or irregularly shaped abrasive composites are taught, for example, in U.S. Pat. No. 5,152,917 (Pieper et al.), U.S. Pat. No. 5,435,816 (Spurgeon et al.), U.S. Pat. No. 5,667,541 (Klun et al.), U.S. Pat. Nos. 5,876,268 and 5,989,111 (Lamphere et al.), and U.S. Pat. No. 5,958,794 (Bruxvoort et al.), each of which is incorporated herein by reference.
[0078]
[0079] To obtain an abrasive composite with a precise shape, the binder precursor is solidified or cured while the abrasive slurry is present in cavities of a production tool. To form an abrasive composite which has an irregular shape, the production tool is removed from the binder precursor prior to curing, resulting in a slumped, irregular shape.
[0080] One method of producing a three dimensional abrasive article is illustrated in
[0081] After the production tool
[0082] In another variation of this first method, the abrasive slurry can be coated onto the backing rather than into the cavities of the production tool. The abrasive slurry coated backing is then brought into contact with the production tool such that the abrasive slurry flows into the cavities of the production tool. The remaining steps to make the abrasive article are the same as detailed above. Other variations include using a continuous belt or a drum as a production tool.
[0083] The cavities in the production tool provide the inverse shape of the three dimensional composites in the abrasive article. Additionally, the cavities provide a close approximation of the size of the abrasive composites. One example of a three-dimensional composite includes a truncated pyramid about 914 micrometers tall, about 2030 micrometers wide at the base, and about 635 micrometers wide at the distal end.
[0084] Additional details on the use of a production tool to make a three-dimensional abrasive article according to these methods are further described in U.S. Pat. No. 5,152,917 (Pieper et al.) and U.S. Pat. No. 5,435,816 (Spurgeon et al.), both of which are incorporated herein by reference.
[0085] The window in the abrasive article can be made by any number of methods. The window may be made by preventing application of the abrasive composites to the desired area, or removal of abrasive composites (or uncured or partially cured abrasive composites) from the desired area. Yet further, a window can be made by altering the composition of the composites in the desired window area.
[0086] In the first general method, either no or very little abrasive slurry is provided to the area where the eventual window is desired. In a first embodiment, the production tool may be void of cavities in the area where the window is desired, thus resulting in little or no abrasive slurry positioned in that area. Abrasive slurry would be coated over the expanse of tooling, including the area devoid of cavities. When the slurry coated tooling is contacted with the backing, no slurry or very little slurry transfers to the backing in that area devoid of cavities. It is understood that instead of having a backing that is devoid of cavities, it is also possible to have a portion of the cavities filled with a material so that the abrasive slurry cannot enter the cavities. The cavities can be permanently filled, for example with a material such as a epoxy, or can be temporarily filled, for example, with wax or a water soluble material.
[0087] In a variation of this first embodiment, abrasive slurry can be coated over the expanse of a backing. When the slurry coated backing is contacted with the production tooling and the cavities, the area devoid of cavities will not result in composites; rather, that area will have little or no abrasive slurry present. These methods can provide any or all of the abrasive articles of
[0088] In another embodiment, the production tool has cavities throughout, but no abrasive slurry is provided to the cavities in the desired window area. This may be done in any number of ways. For example, if it is desired that the window extend from one edge of the abrasive article to another edge, such as in abrasive article
[0089] In another embodiment, either the backing or the production tool, typically the backing, is treated with a surface coating or similar feature to minimize the amount of abrasive slurry that adheres thereto. Conversely, if a primer to improve the adhesion of the abrasive slurry to the backing is used, this primer can be removed or not applied to areas where a window is desired, thus minimizing the amount of abrasive slurry that adheres thereto.
[0090] In a second general method, the abrasive slurry is removed from the backing after the composites have been molded; the slurry can be removed either prior to being cured or after being at least partially cured. In a first embodiment, the abrasive slurry or abrasive composites can be scraped off from the backing after being shaped into composites. This may be done by a knife, blade, or any item that will remove the desired material. For example, a knife oscillating across the width of the coated backing as the backing is moving in its longitudinal direction will provide an abrasive article such as abrasive article
[0091] In another embodiment, the backing, prior to being coated with abrasive slurry, can have patches or stripes that are removable; a pressure-sensitive adhesive tape can be used as the patch or stripe material. After the composites are provided on the surface of the patches or stripes, they can be removed, thus also removing the composites.
[0092] In yet another embodiment, the desired window area can be masked after the composites are molded but before cured. The unmasked area can be exposed to conditions to cure the slurry. The masked, uncured area can be removed, for example, by a solvent, such as water if the uncured slurry is water soluble.
[0093] In a further embodiment, a continuous abrasive coating can be provided on the backing and cured to form an abrasive article. Prior to use in a planarization or polishing process, sections of the abrasive article, including both the backing and the abrasive coating thereon, can be removed, leaving a discontinuous abrasive article. This discontinuous abrasive article can be positioned, for example by lamination, on a carrier backing. The areas from which the sections were removed will be the window area of the abrasive article during the wafer processing. To clarify this embodiment, two detailed examples are provided. In the first example, an abrasive article having a continuous abrasive coating on a backing is slit to provide thin, elongate sections. These sections are positioned on a carrier backing so that the abrasive sections have non-abrasive sections therebetween. The areas where only the carrier backing is present are the monitoring elements or windows that provide transmission of radiation therethrough. These windows extend the length of the abrasive article. As a second example, an abrasive article having a continuous abrasive coating on a backing is die cut or punched to provide discrete areas void of abrasive article. That is, the abrasive article has holes or apertures therethrough. The abrasive article is positioned on a carrier backing, and the areas having the holes or apertures are the monitoring elements or windows that would provide transmission of radiation therethrough. With this process of making the windowed abrasive article, the abrasive article has two backings (i.e., the abrasive backing and the carrier backing) in the areas having the abrasive coating, and the areas of the monitoring element have one backing (i.e., the carrier backing).
[0094] Referring again to the figures, a monitoring element, such as window
[0095] In another example, an abrasive article can be made having a decreased density of abrasive composites in the monitoring element or window area. For example, the spacing between adjacent composites may be greater, or the shape of the composites may differ to allow more passage of radiation therethrough. In another embodiment, the height of the abrasive composites may be significantly less, almost to the point of resembling window
[0096] Although the majority of the description above has been directed to using a cavitied tool to make the abrasive composites, it is understood that other methods for making textured or three-dimensional coatings can be used. For example, gravure roll coating or other coating techniques can make abrasive articles having a monitoring element or window area. One skilled in the art of abrasive articles will derive additional methods for making abrasive articles having a monitoring element therein. No matter how constructed or manufactured, the abrasive article of the present invention includes an area through which processing of a workpiece, such as a wafer, can be monitored.
[0097] The complete disclosures of all patents, patent applications, and publications listed herein are incorporated by reference as if individually incorporated. Various modifications and alterations of this invention will become apparent to those skilled in the art without departing from the scope and spirit of this invention, and it should be understood that this invention is not to be unduly limited to the illustrative embodiments set forth herein.