[0001] This is a continuation-in-part of U.S. patent application Ser. No. 08/355,664, filed Dec. 14, 1994.
[0002] This invention relates generally to the fabrication of compact discs and more particularly to a cross flow metalization system for increasing yield and decreasing complexity while permitting in-line metalization in the compact disc fabrication process.
[0003] Compact discs or CDs are currently manufactured in a relatively complex process in which the information on the CD is first obtained for instance from a digital source. A premastering disc is created in a photo lithographic process which lays down the information in a spiral pattern. From the premastering disc, a master stamping disc is formed in an electroplating process. The master stamping disc is then used to hot stamp thermoplastic discs with the grooves or interstices which carry the information from the premastering disc.
[0004] Following the molding of the discs, the discs are “metalized” by placing them, via a vacuum lock, into a vacuum chamber where a thin coat of aluminum is deposited over the physical patterning on the surface of the disc (“substrate”) using a sputtering device comprising a magnetron. After metalization, the discs are spin coated to cover the metal with a protective coating such as lacquer. This is usually followed by an inspection step.
[0005] Compact discs were originally fabricated in a batch process in which individual discs were taken from station-to-station. Present processing requires continuous processing along an efficient flow path to take the discs from start to finish, so that more than 1,000 discs per hour can be manufactured.
[0006] The metalization step has caused significant throughput and quality problems in the past. Initially, the metalizer was located off-line (i.e., out of the main, direct line process flow) due to its size and complexity. These units simply could not conveniently be located in the flow path, but rather had to be located off to one side with resultant materials handling problems and complexity.
[0007] Metalizers can now be made part of the flow path and are currently available from Leybold in Germany and Balzers in Liechtenstein. The standard metalizers from these companies are similar in design and throughput performance. Both have rotational transport mechanisms which use a dial inside of a vacuum chamber for the transportation of a plurality of substrates (e.g., thermoplastic discs) under a single deposition source which includes a magnetron. Adjoining the vacuum chambers are external rotational transport mechanisms for bringing the substrates (discs) in and out of the vacuum chamber through a single vacuum lock. Internal and external transport mechanisms sequentially carry out the loading and unloading of the substrates.
[0008] These metalizers have permitted increased throughput by providing continuous processing. However, the continuous process permits only one title to be run at one time through the molding, metalizing, spin coating, and inspection process. This makes the overall investment for CD manufacturing very high because one metalizing machine must be assigned to each molding system.
[0009] It will be appreciated that for compact disc production, orders for compact discs are frequently in the hundreds as opposed to thousands or tens of thousands. Thus, it is very important to be able to either process different titles simultaneously or increase throughput speed to maintain the efficiency of the entire line.
[0010] Throughout speed is frequently increased by decreasing the dwell time under the sputtering device. This is accomplished by moving the magnetron closer to the substrate. However, this approach decreases overall quality of the disc and can render high density information discs unusable.
[0011] A different approach to increasing throughput speed and also permitting the simultaneous processing of multiple titles, has been developed by Leybold—a double magnetron, double vacuum lock system. Theoretically, this approach should increase disc throughput twofold. However, these machines require the disc to exit to the same vacuum lock it entered resulting in an inordinate amount of indexing complexity which significantly diminishes the theoretical increase.
[0012] Leybold's double lock machines have exceedingly large diameter dials, often greater than five feet. The sheer size of the vacuum deposition chamber to accommodate such large dials inhibits the insertion of this machine into the production line, to say nothing of the cost of the relatively large unit. With the use of this device a complicated process flow path is thus, inevitable.
[0013] The double magnetron machines also require a double index step in which “odd numbered” discs are processed by one magnetron and “even numbered” discs are processed by the second magnetron. However, with these machines, the both discs must pass under both magnetrons. It will be appreciated that with this approach, indexing errors rapidly become significant. When such errors occur during the processing of multiple CD titles, the titles become mixed up such that all of the mixed up discs must be discarded, as there is no way of identifying which disc was associated with which title.
[0014] More particularly, when multiple titles are to be processed, the discs of a single title are loaded onto discrete spindles, with an average of six spindles being utilized during a run. These spindles each typically hold as many as 200 CDs. If during the process indexing problems occur, then the entire lot may have to be discarded because the manufacturer must guarantee the discs loaded on a given spindle come out with the same titles.
[0015] Thus while the double magnetron, double vacuum lock system permits processing of multiple titles simultaneously, the potential indexing problems are so severe that such processing is generally not practical.
[0016] There is therefore a necessity for providing an in-line system with efficient metalizing in which indexing problems are reduced to a minimum while at the same time being able to process multiple titles, to accommodate short production runs.
[0017] The present invention is an improved metalizer which, rather than employing a single vacuum lock, single magnetron system or a multiple magnetron system with each vacuum lock handling the same disc on entry and exit, is directed to a system in which the vacuum locks through which discs are introduced into the vacuum chamber are different from the vacuum locks through which the discs exit the vacuum chamber. This approach permits not only the creation of a smaller metalizer which is capable of being interposed in a linear process flow path, but also eliminates the interleaving of discs during the metalization process and the associated, inevitable indexing problems. In one embodiment the present invention permits the use of a dial having as few as four disc carriers within the vacuum chamber, versus utilization of a more than twelve disc carrier dial within a vacuum chamber for a Leybold double magnetron metalizer.
[0018] In a preferred embodiment of the present invention the vacuum locks are diametrically opposed to each other on either side of the dial. Moreover, the magnetrons utilized to metalize the discs are also diametrically opposed to each other on opposite sides of the dial such that the flow of a disc from input lock to exit lock requires that the disc travel under only one magnetron. For purposes of carrying out the invention, the magnetrons need not be diametrically opposed but rather need only be on different sides of the dial. While it is preferable to have the input and exit locks diametrically opposed to be able to most efficiently operate with a linear flow of product, the vacuum locks may be offset one from the other as required. It should be noted, however, that a non-diametric arrangement of the input and exit locks expands the overall size of the equipment.
[0019] In operation, a disc having a first title enters the vacuum chamber from a first lock, is moved around the dial, is metalized, and exits at a second lock preferably located opposite the first lock. A second title enters the vacuum chamber via the second lock and is moved around with the dial in the opposite direction, horizontally speaking, from the direction of movement of the first-title, to produce a “cross flow”. After metalizing, the second title exits the vacuum chamber via the first lock. Thus, the flow of product in one direction is for one title, while the flow of product in the other direction is for the second title. This flow pattern guarantees title integrity as all product emerging from a given lock must be associated with one title. Thus, the present invention provides title integrity while also providing a substantially higher throughput with a better economy of machinery.
[0020] With the improved throughput, standard deposition rate sources may be employed at either increased spacing between the magnetron and the disc or at lower electric consumption rates to prevent pitting. Thus, one and a half times the production rate achievable with prior machines can be achieved without comprising product quality.
[0021] Additionally, if a single magnetron metalizer is made in accordance with the present invention it can be instantly ungraded in the field simply by adding a second magnetron at a second position. This is not possible with the majority of present metalizers since they have only a single vacuum lock, and would thus, have to be remanufactured to provide a second vacuum lock.
[0022] In summary, a cross flow system for metalizing compact discs, capable of being interposed in-line in the production of the CDs after premastering, mastering, electro-forming, and molding preferably includes diametrically opposed vacuum locks for a vacuum chamber and multiple metalization sources in the form of magnetrons, with a cross flow including, the introduction of a disc to be metalized through one lock and the exit of the metalized disc preferably through a diametrically opposite lock. The double vacuum lock, diametrically opposed cross flow system eliminates the problems of throughput limitations, high rate deposition, substrate pitting, and indexing software complexity which makes prior systems both costly and inefficient. The system also permits processing of more than one substrate or CD title such that multiple CD titles can be processed simultaneously.
[0023] These and other features of the subject invention will be better understood in conjunction with the Detailed Description taken in conjunction with the Drawings of which:
[0024]
[0025]
[0026]
[0027]
[0028]
[0029]
[0030]
[0031]
[0032]
[0033]
[0034] Referring now to
[0035] It will be appreciated that in the flow process illustrated in
[0036] In contradistinction as shown in
[0037] Referring to
[0038] Referring to
[0039] A two magnetron, two vacuum lock metalizer is shown in
[0040] In operation, discs of the first title, here labeled “1” are loaded into the vacuum chamber (not shown) at vacuum lock
[0041] Referring now to
[0042] The load lock manipulators
[0043] In one preferred embodiment of the present invention Disc “A” and Disc “B” are the same title being metalized via a cross flow pattern. In another embodiment, Disc “A” and Disc “B” represent different titles being simultaneously metalized and flowing in and out of the metalizer in different directions (i.e., in the cross flow pattern).
[0044] In yet another preferred embodiment of the present invention, the second magnetron
[0045] In still further embodiments of the present invention, the size of the dial
[0046] A further feature of the present invention is shown in
[0047] What has been achieved is a materials handling system which significantly improves the quality and speed with which compact discs or other articles can be manipulated through a vacuum chamber in a cross flow process in which, in a preferred embodiment, entrance and exit locks are diametrically opposed. The system is not only capable of handling compact discs which must be metalized but is also useful in semi-conductor processing in which various other substrates such as semiconductor wafers, ceramics, plastics and metals can be metalized via vacuum deposition or otherwise processed via the cross flow.
[0048] While reference has been made to certain preferred embodiments of the present invention, these are meant as illustrative only and it will occur to those skilled in the art that modifications can be made without departing from the spirit or intent of the invention.