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[0001] 1. Field of the Invention
[0002] The present invention generally relates to support structures for packaging, and more particularly, to a packaging support structure for use in containing, storing and transporting electronic components like liquid crystal modules.
[0003] 2. Description of the Background Art
[0004] Japanese Patent Laying-Open Nos. 8-175582 and 9-226867 disclose conventional support frames for packaging formed with synthetic resin foaming sheets. In each case, a bottom plate and upright side plates surely held in a specific upright state are provided to form a support frame, or support structure for packaging. Items to be packaged are held in slit-shaped insert grooves that are formed at portions of the bottom plate and the side plates.
[0005] A support structure conventionally used for packaging primarily liquid crystal modules has been of the type provided with a bottom plate and side plates formed of synthetic resin foaming sheets, wherein the side plates extend from opposed side edges of the bottom plate via hinges, where they are folded and erected. At the bottom and side plates, convex portions for partition are provided along the hinge extending direction, with prescribed spacing therebetween to receive respective items to be packaged.
[0006] The support structure of this type, however, has a structural disadvantage that the side plates may be folded inwards more than 90 degrees. It exhibits insufficient strength and shock-absorbing property against falling of the package, and a large shock is delivered to the packaged items. Thus, it was inappropriate for use in packaging electronic components, such as liquid crystal modules, which would require shock-absorbing property and safety of especially high levels.
[0007] Another disadvantage of the conventional support structure for packaging is that it lacks a function to suppress lateral movement or sinking of a top plate against the side plates that closely contact the packaged items in a normal supporting state. Thus, at the falling of the package, the top plate and the side plates supporting the packaged items would separately work to absorb the shock, so that a large shock may locally be delivered to the packaged items.
[0008] In addition, especially when a small number of items are to be packaged, the structure lacks capability to securely hold them in fixed positions. Therefore, it was inappropriate for use as a packaging member for electronic components like liquid crystal modules, for which especially high-level shock-absorbing property and secure, fixed positioning would be required.
[0009] The present invention has been made to solve the above-described problems. An object of the present invention is to provide an improved support structure for packaging that is increased in strength without decreasing its shock-absorbing property, to ensure excellent shock-absorbing property and safety. This support structure contains items in a package and is capable of reducing a shock to be delivered to the packaged items at falling of the package.
[0010] Another object of the present invention is to provide an improved support structure for packaging that facilitates a packaging operation and allows countermeasures to be taken against dust generation therefrom.
[0011] According to an aspect of the present invention, a support structure for packaging, formed of synthetic resin, for containing an electronic component is provided. The support structure for packaging is provided with a bottom plate and side plates. The bottom plate supports the electronic component from beneath. The first and second side plates respectively extend outwards from opposed sides of the bottom plate, and are erected so that they work as supporting members supporting the electronic component from the sides. End surfaces of the bottom plate each constitute a first inclined plane that is slanted at a first degree. End surfaces of the first and second side plates on the bottom plate sides each constitute a second inclined plane that is slanted at a second degree. The first degree and the second degree are selected such that, when the first and second side plates are erected to cause the first and second inclined planes to contact with each other, the first and second side plates are prevented from being folded inwards more than 90 degrees.
[0012] According to another aspect of the present invention, a support structure for packaging, formed of synthetic resin, for containing an electronic component is provided. The support structure for packaging is provided with a bottom plate, side plates and a top plate. The bottom plate supports the electronic component from beneath. The first and second side plates extend outwards from respective sides of the bottom plate, and are erected to form support members supporting the electronic component from the sides. The first side plate has an outer end surface that constitutes a first inclined plane. The second side plate has an outer end surface that constitutes a second inclined plane. The top plate works as a lid when the first and second side plates are erected. The top plate has a third inclined plane that closely contacts the first inclined plane, and a fourth inclined plane that closely contacts the second inclined plane. The first and third inclined planes are provided with concave and convex portions, respectively, so that they are connected by engagement of the pair of concave and convex portions. The second and fourth inclined planes are provided with concave and convex portions, respectively, so that they are connected by engagement of the pair of concave and convex portions.
[0013] The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
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[0027] The support structure for packaging according to a first embodiment of the present invention is formed of a solid or foaming sheet of synthetic resin, which may be polyolefin type resin including polystyrene type, polypropylene and polyethylene terephthalete, or any other synthetic resin having suitable rigidity and elasticity and a relatively strong force of restitution. This structure is provided with a stopper function at each end surface of the bottom plate that prevents a corresponding side plate, when folded and erected about a ruled line between itself and the bottom plate, from being bent inwards more than 90 degrees. The structure is configured, when assembled into a package form, to suppress delivery of a shock to packaged items at falling of the package. It ensures excellent shock-absorbing property and prevents falling off of the bottom.
[0028] The support structure for packaging according to a second embodiment of the present invention is provided with another stopper function, offered by concave portions formed on side plates, which contact packaged items in a normal supporting state, and convex portions formed on a top pate. This connects the top plate and the side plates closely together, hindering lateral movement or sinking of the top plate against the side plates. Accordingly, a shock at the falling of the package is prevented from being delivered to the packaged items.
[0029] The support structure for packaging according to these embodiments can be used for packaging electronic components like liquid crystal modules. Specifically, the side surfaces are erected, at 90 degrees, about the ruled lines between themselves and the bottom plate. The end surfaces of the bottom plate come to closely contact the corresponding end surfaces of the respective side plates, preventing bending of the side plates more than 90 degrees. In this state, the items to be packaged are inserted into slit-shaped insert grooves formed at portions of the side plates. Finally, the convex portions formed at the top plate are engaged with the concave portions formed at the side plates contacting the packaged items.
[0030] According to the support structure for packaging of the first embodiment, the end surfaces of the bottom plates closely contact the end surfaces of the side plates on the bottom plate sides. Thus, a strong structure is provided which prevents delivery of a shock to the packaged item at falling of the package. This structure exhibits excellent shock-absorbing property, and maintains sufficient receiving and supporting strength to endure repeated falling thereof, preventing delivery of excessive shocks to the packaged items.
[0031] According to the support structure for packaging of the second embodiment, concave portions are provided to the side plates that contact the packaged items in a normal supporting state of the structure, and convex portions are provided to the top plate, ensuring close engagement between the side and top plates. Accordingly, a shock at falling of the package can be absorbed evenly through the entire support structure, preventing local delivery of the shock to the packaged items.
[0032] Hereinafter, examples of the present invention will be described with reference to the drawings.
[0033]
[0034] The support structure for packaging is integrally formed of a solid sheet of synthetic resin, which may be polyolefin type resin including polystyrene type, polypropylene and polyethylene terephthalete, or any other synthetic resin having suitable rigidity and elasticity and a relatively strong force of restitution.
[0035] Referring to
[0036] The first degree and the second degree are selected such that, when first and second side plates
[0037] Bottom plate
[0038] This support structure for packaging is assembled into a package form by folding side plates
[0039]
[0040]
[0041] In the state where side plates
[0042]
[0043] Referring to
[0044] Third and fourth inclined planes
[0045] Referring to
[0046] According to the support structure for packaging of this example, top plate
[0047]
[0048] Referring to
[0049]
[0050] According to the support structure for packaging of the present invention, the bottom plate and the upright side plates at its respective sides are readily positioned and held in a fixed relationship with each other, so that it is possible to easily and safely insert and remove items being packaged.
[0051] Further, as the bottom plate and the side plates are formed as one piece, the parts count is low. As the items being packaged can be stacked one on another, transport cost of the packaged items is advantageously decreased. A bulk ratio of packaging space can also be set small, so that the storage efficiency is improved.
[0052] Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the spirit and scope of the present invention being limited only by the terms of the appended claims.