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DE102019102333A1 Housings for electrical and / or electronic components  
Housing 100 for on a first printed circuit board 110 equipped with electrical and / or electronic components 111, with at least one plastic plate 12, which has recesses 121 for accommodating the...
DE102019000575A1 Removing printed circuit boards  
A housing arrangement (2) for the avionics contains a housing (4), at least two circuit boards (10a-d) with electrical plug-in parts (14a, b), with two circuit boards (10a-d) having a fixed...
DE102018133434A1 Method for encapsulating at least one carrier substrate, electronic module and tool for encapsulating a carrier substrate  
A method for encapsulating at least one carrier substrate (10), in particular a carrier substrate (10) equipped with at least one electronic element (5), comprising - Positioning the at least one...
DE102018010352A1 Method for encapsulating at least one carrier substrate, electronic module and tool for encapsulating a carrier substrate  
A method for encapsulating at least one carrier substrate (10), in particular a carrier substrate (10) equipped with at least one electronic element (5), comprising - Positioning the at least one...
DE102018219037A1 Printed circuit board system, electrical energy storage and method for producing a printed circuit board system  
Printed circuit board system (1) comprising a printed circuit board (8) and a flat conductor (9), the printed circuit board (8) having a contact surface (3), the flat conductor (9) having a cover...
DE102018215672A1 Method of manufacturing a circuit board arrangement and circuit board arrangement  
The invention relates to a method for producing a printed circuit board arrangement (3), comprising the steps: - Providing a first circuit board substrate (1), - Providing a second printed circuit...
DE102018215534A1 PCB arrangement with an SMD connection contour  
The invention relates to a printed circuit board arrangement with at least two perpendicular printed circuit boards (1, 2), one being designed as a basic printed circuit board (1) and the other as...
DE102018121403A1 Method of making a stabilized board  
The present invention relates to a circuit board and a manufacturing method of a circuit board, in which at least one component is arranged on a first printed circuit board, which is extended to a...
DE102018212310A1 Heterogeneous printed circuit board and method for producing a heterogeneous printed circuit board  
A circuit board (101) for an electrical and / or electronic switching arrangement is described. The circuit board (101) comprises at least one electrically conductive layer (121) which is designed...
DE102016115373B4 Circuit arrangement with a connecting device and with a circuit board  
Circuit arrangement with a connecting device (3) and with a printed circuit board (1), which has a first (10) and a second main surface (16) opposite this, and a recess (2) extending from the...
DE102018115088A1 Connection arrangement of a rigid circuit board and a flexible circuit board  
In the case of a connection arrangement of a rigid printed circuit board and a flexible printed circuit board, the rigid printed circuit board sLP has a pocket-shaped receptacle A, into which a...
DE102018111554A1 Printed circuit board structure for receiving at least one semiconductor illuminant  
The invention relates to a printed circuit board assembly (100) for receiving at least one semiconductor illuminant (1), wherein the printed circuit board assembly (100) comprises a first printed...
DE19924198B4 Daughter board for insertion into a motherboard  
Arrangement of mother board (1) and daughter board (2), where there are solder connections between daughter board (2) and mother board (1), wherein the motherboard (1) and the daughterboard (2)...
DE102018200845A1 Assembly method for the production of an X-ray detector, X-ray detector and X-ray apparatus  
In a method according to the invention for producing an X-ray detector (1), according to the method a plurality of sensor surface elements (4) formed from an X-ray-sensitive material are...
DE102017223646A1 A method of manufacturing a circuit carrier assembly and circuit carrier assembly  
The invention relates to a method for producing a circuit carrier arrangement (30) having a first substrate (32), wherein on a first surface (34) of the first substrate (32) by conversion of...
DE102017131316A1 Modular printed circuit board assembly  
The invention relates to a modular printed circuit board assembly (33), the from a circuit board level positively interlocking and equipped with electrical components printed circuit boards (1, 2,...
DE102017222883A1 Contacting unit for electrically contacting at least one electronic segment of an electronic module and method  
The present invention relates to a contacting unit (100) for electrically contacting at least one electronic segment (502) of an electronic module (500). The contacting unit comprises a module...
DE102016101726B4 Power semiconductor device and method for producing a power semiconductor device  
Power semiconductor device (1 ') with a base plate (2), with power semiconductor switches (22), with a housing (8) having a recess (3) and with an electrically conductively connected to the power...
DE102014117536B4 Method for the lateral connection of two printed circuit boards and optoelectronic sensor with two angularly connected printed circuit boards  
Method for the lateral connection of two printed circuit boards (12, 14) arranged at an angle, wherein the printed circuit boards (12, 14) are laterally connected to one another via a connecting...
DE102017215846A1 Circuit board arrangement and method for its production  
The invention relates to a printed circuit board assembly (1) comprising a printed circuit board assembly (1) inverter (100) and a method for producing the printed circuit board assembly (1). The...
DE102017209366A1 Electrical component and method for its production  
The invention relates to an electronic component (20), in particular for a motor vehicle, which comprises at least one thick - film subassembly (10) with a substrate (12) on which a plurality of...
DE102017208772A1 Method and apparatus for making a printed circuit board sandwich and printed circuit board sandwich  
The present invention relates to a method of manufacturing a printed circuit board sandwich (100), characterized in that the method comprises a step of manufacturing, a step of potting, a step of...
DE102017208472A1 Method for producing an electronic component and electronic component  
The invention relates to a method for producing an electronic component (E) having a plurality of printed circuit boards (1.1 to 1.4), wherein at least two printed circuit boards (1.1 to 1.4) are...
DE112016005445T5 Vehicle mounted electronic module, card edge connector and connector  
There is a problem that an oxide film or a high-resistance abrasion powder is formed at a contact interface for micro-sliding abrasion in a high-temperature environment or a temperature cycle,...
DE102018104631A1 A method of forming a substrate structure for an electric component and apparatus for applying a pressure to a core substrate of a honeycomb electrically insulating laminate  
A method of forming a substrate structure for an electrical device includes placing an electrically insulating laminate on a substrate and applying a hot pressure with a heatable plate to the...
DE102018201911A1 Electrical connection method of a printed circuit and electrical connection structure of a printed circuit  
An electrical connection method for a printed circuit comprises overlapping a base material and a thin member in which a thin conductor is mounted, forming a through-hole that passes in overlap...
DE102017201135A1 Method for mechanical connection and arrangement of electronic components  
36) or the blind hole in the first direction (90) at least partially below the first passage opening (25, 26) is arranged; Introducing a potting compound (50) into the first through-opening (25,...
DE102015114521B4 Method for soldering an insulating substrate onto a carrier  
A method for soldering an insulating substrate (2) on a substrate mounting portion (32) of a carrier (3) by means of a predetermined solder (4), wherein the insulating substrate (2) has a...
DE112016004102T5 System, apparatus and method for connecting printed circuit boards  
In an embodiment, first and second circuit boards may be coupled together. The first circuit board may include a first track to electrically couple a first integrated circuit to a first via of the...
DE102016115373A1 Circuit arrangement with a connection device and with a printed circuit board  
The invention relates to a circuit arrangement which is designed with a connection device and with a printed circuit board which has a first and an opposing second main surface, and a recess...
DE102016213049A1 Arrangement and reduction of the vibration behavior of electronic components  
The invention relates to an arrangement comprising a first printed circuit board (1a), a second printed circuit board (1b) and a molded part (3) arranged between the first and the second printed...
DE102016211130A1 Establishing an electrical connection cable with several wires  
Provided a method is used for producing an electrical connecting line (1) having a plurality of electrical wires (3) and a plurality of electrical contacts (7), wherein the electric wires (3) with...
DE102016106900A1 A process for the positioning of circuit boards and printed circuit board assembly  
The invention relates to a method for positioning at least two circuit boards (1a, 1b) in a housing (2) of a field device of the automation equipment, wherein at least the surface of the housing...
DE102004038401B4 A method for connecting a flexible flat conductor to a printed circuit board  
A method for connecting a flexible flat conductor (2) to a printed circuit board (1), wherein a solder deposit (3) is applied to at least one electrically conductive contact zone (11) of the...
DE102004023189B4 Soluble electrical connection of three-dimensional injection-molded circuit carriers  
A three - dimensional injection - molded circuit carrier comprising a substrate (102), at least one electrical conductor track (104), and a connecting region (130) for detachably contacting the at...
DE112014006840T5 Liquid crystal display panel and a corresponding liquid crystal display  
Wherein the first through hole connected to the front COF packaging unit has a smaller contact area than the second through hole connected to the rear COF packaging unit. The present invention...
DE102015217802A1 Electronic assembly, in particular for a transmission control module and a method for producing such an electronic assembly  
(2) with a first side (3) and a second side (4) facing away from the first side (3), and a flexible printed circuit board (5) which comprises a first printed circuit board (1) (6) facing the...
DE102015114521A1 A method for soldering an insulating substrate onto a substrate  
The invention relates to a method for soldering an insulating substrate (2) onto a substrate mounting section (32) of a carrier (3) by means of a predetermined solder (4). The insulating substrate...
DE112015002027T5 Method for bonding flexible printed circuit boards  
A method of forming electrical connections between a first plurality of electrical conductors and a second plurality of electrical conductors, the method comprising: providing a first pad on a...
DE102015010682A1 Assembly arrangement  
A system comprising one or more electronic modules (3) arranged between housing surfaces (1) and one or more electrical connecting elements (6, 7, 8), characterized in that electrical connecting...
DE102015013838B3 Process for the production of mechanical-electrical joint connections between at least two electrically conductive connections of a composite system and a multifunctional composite system  
The invention relates to a method for the production of mechanical-electrical joining compounds (31) between at least two electrically conductive connections (2, 3) of a joining system (1) and a...
DE102015107645A1 Sensor housing for a radar sensor and radar sensor  
The housing (2) has a ventilation channel (9) for ventilating the sensor housing (1) and a press-in guide (10), the housing (2) and the printed circuit board (4) ) For receiving a positioning aid...
DE102016107999A1 Coil, non-contact current receptacle, and portable electronic device  
The first flexible plate 10 has a plurality of first electrodes 11 and a plurality of first conductors 12. Each of the first conductors 12 bridges and electrically connects one of the first...
DE102015004150A1 A process for producing a contact space transformer contact and space transformer  
The invention relates to a method of forming a contact space transformer (4) (Space Transformer), the electrical paths (10) forming electrical contacts (9) and in which a first contact distance of...
DE102015203592A1 Electronic unit with a plug assembly  
The approach presented here provides an electronic unit (110) comprising: - a connector assembly having at least one male member (230) comprising a connector body (231) having a plurality of...
DE102015203217A1 PCB arrangement in which a second circuit board by means of a first printed circuit board is at least cooled  
Printed circuit board assembly (10) comprising a first circuit board (12) and at least a second circuit board (14) which are at least one connector assembly (18) are electrically coupled or...
DE102014117536A1 Sensor with two connected angularly circuit boards and method for lateral connection of two printed circuit boards  
A sensor (10), in particular optoelectronic sensor (10), with at least one sensor element (16, 28) and at least a first circuit board (12) and a second circuit board (14) is provided, which are...
DE102014221973A1 Electric device for use in a contaminating medium, and methods for producing such  
The invention relates to an electrical device 1 for use in a contaminating medium, comprising a wiring substrate 2, having on at least one surface 21 of the conductor substrate 2 at least one...
DE102014115201A1 METHOD FOR SOLDERING A CIRCUIT CARRIER WITH A CARRIER PLATE  
One aspect of the invention relates to a method for soldering a circuit carrier (2) with a carrier plate (3). For this purpose, a support plate (3), a circuit carrier (2) and a solder (5) are...
DE102014211827A1 A method of manufacturing intermediate and an injection molded circuit carrier, and injection-molded circuit carrier  
The invention relates to a method and an intermediate for the preparation of an injection molded circuit carrier (30) and an injection molded circuit carrier (30). In order to easily produce the...