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9040420 Manufacturing method of semiconductor device including peeling layers from substrates by etching  
The present invention has an object to perform a peeling treatment in a short time. Peeling is performed while a peeling layer is exposed to an atmosphere of an etching gas. Alternatively, peeling...
9034758 Forming fence conductors using spacer etched trenches  
A spacer etching process produces ultra-narrow conductive lines in a plurality of semiconductor dice. Trenches are formed in a first dielectric then a sacrificial film is deposited onto the first...
8951426 Method of fabricating an implantable medical device that includes one or more thin film polymer support layers  
An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After...
8940585 Single layer BGA substrate process  
The present disclosure provides semiconductor packaging techniques that form a substrate using metal and insulating materials. The substrate includes a first surface that is bonded to a...
8927410 Methods of forming through substrate interconnects  
A method of forming a through substrate interconnect includes forming a via into a semiconductor substrate. The via extends into semiconductive material of the substrate. A liquid dielectric is...
8906718 Method for forming vapor deposition film, and method for producing display device  
On a surface of a substrate (3) on which surface a vapor-deposited film is to be formed, a photoresist (13) is formed so as to have an opening in a sealing region including a display region (R1)...
8906804 Composition including material, methods of depositing material, articles including same and systems for depositing materials  
Methods for depositing nanomaterial onto a substrate are disclosed. Also disclosed are compositions useful for depositing nanomaterial, methods of making devices including nanomaterials, and a...
8889543 Method of fabricating semiconductor device  
A method of fabricating a semiconductor device includes forming switching devices on a substrate. A lower structure is formed in the substrate having the switching devices. A lower conductive...
8865583 Manufacturing method of a semiconductor device and method for creating a layout thereof  
A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial...
8748313 Electroforming technique for mask formation  
A method for making a mask for semiconductor manufacturing. The method includes providing a base layer, forming a conductive layer on the base layer, and forming a photoresist layer on the...
8741737 Three-dimensional wafer stacking with vertical interconnects  
Described are three-dimensional stacked semiconductor structures having one or more vertical interconnects. Vertical stacking relies on vertical interconnects and wafer bonding using a patternable...
8728937 Method for producing semiconductor chips using thin film technology  
For semiconductor chips using thin film technology, an active layer sequence is applied to a growth substrate, on which a reflective electrically conductive contact material layer is then formed....
8716098 Selective removal method and structure of silver in resistive switching device for a non-volatile memory device  
A method for forming a non-volatile memory device includes providing a substrate having a surface region, forming a first wiring structure overlying the surface region, depositing a first...
8703611 Method for manufacturing a semiconductor structure  
A method for manufacturing a semiconductor structure is disclosed. The method comprises following steps. A substrate is provided. A sacrificial layer is formed on the substrate. The sacrificial...
8652965 Production method for thick film metal electrode and production method for thick film resist  
One object of the present invention is to provide a method for producing a thick film metal electrode that is able to form a positive-negative reverse type resist, which has a thickness of 7 μm or...
8603914 Liquid crystal display device and fabrication method thereof  
A method includes: forming a gate electrode and a gate line at a pixel part of a first substrate through a first masking process; forming a gate insulation film; forming an active pattern and...
8536056 Method of forming conductive pattern  
A method of forming conductive pattern is provided. A seeding layer is formed on an underlayer. By using an energy ray, an irradiation treatment is performed on a portion of a surface of the...
8450768 Semiconductor light-emitting element and process for production thereof  
The present invention provides a semiconductor light-emitting element comprising an electrode part excellent in ohmic contact and capable of emitting light from the whole surface. An electrode...
8415240 Mesoscale pyramids, hole arrays and methods of preparation  
Composite films comprising two-dimensional hole arrays, and related methods of preparing hole arrays.
8349737 Manufacturing method of array substrate using lift-off method  
A method of forming a pattern includes forming a photoresist pattern on a substrate, forming a first material layer on substantially an entire surface of the substrate including the photoresist...
8298928 Manufacturing method of a semiconductor device and method for creating a layout thereof  
A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial...
8247860 Nonvolatile semiconductor memory device and method for manufacturing same  
A nonvolatile semiconductor memory device includes: a substrate; a stacked body with a plurality of dielectric films and electrode films alternately stacked therein, the stacked body being...
8241992 Method for air gap interconnect integration using photo-patternable low k material  
Methods for producing air gap-containing metal-insulator interconnect structures for VLSI and ULSI devices using a photo-patternable low k material as well as the air gap-containing interconnect...
8236689 Method for applying a structure to a semiconductor element  
A method for applying a predetermined structure of a structural material to a semiconductor element. The method includes the following steps: A) partially covering a surface of the semiconductor...
8223330 Nanostructures and lithographic method for producing highly sensitive substrates for surface-enhanced spectroscopy  
A method for producing planar extended electrodes with nanoscale spacings that exhibit very large SERS signals, with each nanoscale gap having one well-defined hot spot. The resulting highly...
8178376 Method for fabricating LED chip comprising reduced mask count and lift-off processing  
A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a...
8178374 Thin film patterning method and method for manufacturing a liquid crystal display device  
A thin film patterning method comprising: depositing a first thin film and applying a photoresist layer on the first thin film; exposing and developing the photoresist layer to define first,...
8173465 Method for fabricating LED chip comprising reduced mask count and lift-off processing  
A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a...
8173466 Method for fabricating LED chip comprising reduced mask count and lift-off processing  
A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a...
8173467 Method for fabricating LED chip comprising reduced mask count and lift-off processing  
A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a...
8173468 Method for fabricating LED chip comprising reduced mask count and lift-off processing  
A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a...
8168537 Semiconductor component and assumbly with projecting electrode  
A semiconductor component has a substrate and a projecting electrode on the substrate. The projecting electrode is configured suitably for electrically and mechanically connecting the...
8153475 Back-end processes for substrates re-use  
A method for fabricating optical devices on a reusable handle substrate. The method includes providing a handle substrate having a surface region. The method also includes forming a plurality of...
8153507 Method of manufacturing high power array type semiconductor laser device  
A method of manufacturing an array type semiconductor laser device. The method includes forming first and second electrodes on lower and upper surfaces of a wafer comprising a plurality of...
8138059 Semiconductor device manufacturing method  
A semiconductor device manufacturing method includes: forming a core pattern on a foundation film, the core pattern containing a material generating acid by light exposure; selectively exposing...
8124523 Fabrication method of a semiconductor device and a semiconductor device  
A method for fabricating a semiconductor device includes the steps of (a) forming a plasma of a gas having carbon and fluorine, and forming an internal insulation film provided with a...
8076238 Electronic device and method for production  
An electronic device and method for production is disclosed. One embodiment provides an integrated component having a first layer which is composed of copper or a copper alloy or which contains...
8058112 Semiconductor device having carbon nanotubes and method for manufacturing the same  
A semiconductor device having good switching characteristics even metallic CNTs are included and a manufacturing method thereof are provided. The semiconductor device includes a source electrode;...
8048762 Manufacturing method of semiconductor device  
A manufacturing method for a semiconductor device includes: forming a first layer on a member to be etched; forming a first hard mask that includes a first hard mask pattern, in the first layer;...
8048777 Method for manufacturing semiconductor device  
An object is to suppress discharge due to static electricity generated by peeling, when an element formation layer including a semiconductor element is peeled from a substrate. Over the substrate,...
8048789 Mesoscale pyramids, arrays and methods of preparation  
Ordered, two-dimensional arrays of pyramidal particulates and related methods of preparation.
8021935 Thin film device fabrication process using 3D template  
A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and...
7994052 High-density patterning  
Methods for patterning high-density features are described herein. Embodiments of the present invention provide a method comprising patterning a first subset of a pattern, the first subset...
7981798 Method of manufacturing substrate  
The present disclosure relates to a method of manufacturing a substrate. The method includes: (a) forming through holes by applying an anisotropic etching to a silicon substrate from a first...
7977235 Method for manufacturing a semiconductor device with metal-containing cap layers  
A method for integrating metal-containing cap layers into copper (Cu) metallization of semiconductor devices. In one embodiment, the method includes providing a patterned substrate containing Cu...
7927901 Method for fabricating LED chip comprising reduced mask count and lift-off processing  
A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a...
7902015 Array of nanoscopic MOSFET transistors and fabrication methods  
A nanoscopic transistor is made by forming an oxide layer on a semiconductor substrate, applying resist, patterning the resist using imprint lithography to form a pattern aligned along a first...
7888193 Semiconductor device with mushroom electrode and manufacture method thereof  
A semiconductor device has: a semiconductor substrate having a pair of current input/output regions via which current flows; an insulating film formed on the semiconductor substrate and having a...
7858412 Thin-film transistor substrate and method of fabricating the same  
A thin-film transistor (“TFT”) substrate and a method of fabricating the same include: an insulating substrate; gate wiring which is disposed on the insulating substrate and includes a gate line...
7855146 Photo-focus modulation method for forming transistor gates and related transistor devices  
A method for forming a transistor gate includes performing a first exposure of a photo-resist material on a semiconductor device. The first exposure defines a line pattern in the photo-resist...

Matches 1 - 50 out of 226 1 2 3 4 5 >