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Match Document Document Title
8927054 Conductive substrate and process for producing same  
Provided are a conductive substrate which can be produced from inexpensive materials at a lower temperature than those for conventional substrates, and a process for producing the conductive...
8911608 Flexible circuit formation  
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is...
8815333 Manufacturing method of metal structure in multi-layer substrate  
Disclosed is a manufacturing method of metal structure in multi-layer substrate. The manufacturing method includes following steps: coating at least one photoresist layer on a surface of a...
8802183 Communication system with enhanced partial power source and method of manufacturing same  
The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a...
8753748 Process for forming metal film, and product equipped with metal film  
The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an...
8575021 Substrate processing including a masking layer  
Methods for substrate processing are described. The methods include forming a material layer on a substrate. The methods include selecting constituents of a molecular masking layer (MML) to remove...
8551560 Methods for improving selectivity of electroless deposition processes  
Methods for improving selective deposition of a capping layer on a patterned substrate are presented, the method including: receiving the patterned substrate, the patterned substrate including a...
8475666 Method for making toughening agent materials  
A toughening agent composition for increasing the hydrophobicity of an organosilicate glass dielectric film when applied to said film. It includes a component capable of alkylating or arylating...
8404124 Alternating self-assembling morphologies of diblock copolymers controlled by variations in surfaces  
Methods for fabricating sublithographic, nanoscale microstructures arrays including openings and linear microchannels utilizing self-assembling block copolymers, and films and devices formed from...
8323739 Method for forming a metal pattern on a substrate  
A method for forming a metal pattern on a substrate via printing and electroless plating is disclosed, which includes printing a pattern on the substrate with an ink composition, drying the...
8318254 Metallization on a surface and in through-holes of a substrate and a catalyst used therein  
A copolymer deposited with particles of catalytic metal is disclosed in the present invention, which is formed from an ethylenically unsaturated monomer and a hydrophilic monomer, and the...
8277901 Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board  
In the condition where a nozzle for applying a coating liquid is disposed on the lower side of a substrate and a substrate surface controlled in wettability is faced down, the nozzle and the...
8231766 Method for producing printed wiring board  
A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed...
8202567 Method of manufacturing pattern-forming metal structures on a carrier substrate  
To improve the transmission properties of antennae manufactured with known methods, more specifically antennae for application in the UHF range, a method is proposed of producing pattern-forming...
8187664 Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same  
The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that...
8178156 Surface treatment process for circuit board  
A surface treatment process for a circuit board is provided. The circuit board includes a substrate, a first circuit layer disposed on an upper surface of the substrate, and a second circuit layer...
8114300 Multi-layer method for formation of registered arrays of cylindrical pores in polymer films  
Methods for fabricating sublithographic, nanoscale polymeric microstructures utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.
8105644 Manufacturing method of printed circuit board  
A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface...
8065798 Method of manufacturing printed circuit board  
A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for...
8003160 Wiring substrate  
A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises...
7921799 Pattern forming apparatus and manufacturing apparatus using the same  
A pattern forming apparatus comprises a surface treatment system and an ink jet system 14, where a solvent is sprayed from a solvent spray nozzle of the surface treatment system to surface of a...
7923059 Method of enabling selective area plating on a substrate  
A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first...
7858147 Interconnect structure and method of fabricating the same  
A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or...
7790219 Printed component circuit with fluidic template  
A method forms a plurality of pillars, the pillars arranged such that positions of the pillars control flow of a liquid, the plurality of pillars forming a fluidic template, the method dispenses...
7767099 Sub-lithographic interconnect patterning using self-assembling polymers  
The present invention is directed to the formation of sublithographic features in a semiconductor structure using self-assembling polymers. The self-assembling polymers are formed in openings in a...
7748114 Method of forming conductive pattern  
The present invention discloses a method of forming a conductive pattern including the steps of a) printing a conductive pattern onto a surface of a base material having a liquid repellent...
7585540 Method for manufacturing wiring substrate  
A method for manufacturing a wiring substrate includes the steps of: (a) patterning a surface-active agent on a substrate having first and second areas to be remained on the first area; (b)...
7356921 Method for forming a conductive layer pattern  
A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the...
7279195 Method of forming metal fine particle pattern and method of forming electroconductive pattern  
A method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a...
7276267 Method for the manufacture of an injection molded conductor carrying means  
A method making possible the production of an injection molded conductor carrying means composed of a first supporting substrate and a second supporting substrate. The first supporting substrate...
7172789 Methods and apparatus for fluidic self assembly  
Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a...
7147795 Method for surface treatment  
A method for surface treatment includes: a first step in which a surface treatment apparatus 1 and a substrate 10 in a state where a front surface 102 of the substrate 10 faces the surface...
7125586 Kinetic spray application of coatings onto covered materials  
Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate covered in a plastic-type material without first removing the plastic-type material. In one use of...
7115507 Patterning method  
A substrate is patterned by forming an indent region 8 in the surface 10 of a substrate 4 and depositing a liquid material onto the surface 10 at selected locations adjacent to the indent region...
7063762 Circuitized substrate and method of making same  
A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to...
6887512 Method for fabricating printed-wiring substrate  
A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating...
6875260 Copper activator solution and method for semiconductor seed layer enhancement  
The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution...
6623803 Copper interconnect stamping  
A method of patterning a layer of copper on a material surface includes providing a stamp having a base and a stamping surface and providing a copper plating catalyst on the stamping surface. The...
6616967 Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process  
An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present...
6592943 Stencil and method for depositing solder  
A method of depositing solder on a conductive region of a substrate comprising providing a substrate having a substrate aperture and a coefficient of thermal expansion. A polymeric stencil is also...
6582767 Metal pattern forming method  
A method for forming a metal pattern by the micro-stamping process involves the steps of treating a substrate bearing a thin film of a reducing silicon polymer with a solution containing a salt of...
6560863 Method of producing wiring board  
A method of producing a wiring board having a plurality of wiring layers each being located on an electrical insulation layer, in which an electrical insulation layer is formed on a substrate...
6555170 Pre-plate treating system  
The invention relates in general to a method of electroplating substrates where at least a portion of the substrate is coated with a solution containing a film forming amine and sufficient acid to...
6551650 Dip formation of flip-chip solder bumps  
A process for fabricating a solder bump (113) includes providing an inorganic de-wetting substrate (102). In order to form a composite substrate (20), having the desired wetting/dewetting...
6548106 Method of applying corrosion inhibitor to parts mounted circuit board  
The invention greatly improves an efficiency of a whole parts mounting process. In a method of applying a corrosion inhibitor to a parts mounted circuit board, a recess portion surrounding a part...
6544584 Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate  
A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such...
6524663 Method for selective activation and metallization of materials  
An activated substrate surface suitable for electronics and microsystems preparation is prepare by contacting the surface with a surface activation compound, e.g. organometallic based on...
6521285 Method for printing a catalyst on substrates for electroless deposition  
Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the...
6517893 Method of manufacture of printed wiring boards having multi-purpose finish  
A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish...
6513239 Method of fabricating an alloy film on a face of a heat exchanger for an integrated circuit  
An alloy film is fabricated, on the face of a heat exchanger for an integrated circuit, by a process that dispenses various liquids onto the heat exchanger's face. To prevent those liquids from...

Matches 1 - 50 out of 269 1 2 3 4 5 6 >