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8916232 Method for barrier interface preparation of copper interconnect  
The embodiments fill the need of improving electromigration and reducing stress-induced voids of copper interconnect by enabling deposition of a thin and conformal barrier layer, and a copper...
8784931 ULSI wiring and method of manufacturing the same  
A method of manufacturing ULSI wiring in which wiring layers are separately formed via a diffusion prevention layer and an insulating interlayer portion made of SiO2. The method comprises the...
8703232 Method of forming a microstructure  
The present disclosure describes an article and a method of forming a microstructure. The method includes providing a substrate having a structured surface region comprising one or more recessed...
8431184 Methods of forming electrically conductive structures  
Some embodiments include methods of forming conductive material within high aspect ratio openings and low aspect ratio openings. Initially, the high aspect ratio openings may be filled with a...
8377506 Method of manufacturing a substrate structure  
A substrate structure is provided. The substrate structure includes a substrate, a first insulation layer, a conductive part, a second insulation layer, a seed layer and a conductive layer. The...
8313825 Curable resin films  
A curable resin with at least one electrically conductive metal region on its surface formed by depositing on the surface a composition comprising activator, contacting the activator with a...
8276270 Method for manufacturing printed circuit board  
The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are...
8241701 Processes and systems for engineering a barrier surface for copper deposition  
The embodiments fill the need to enhance electro-migration performance, provide lower metal resistivity, and improve metal-to-metal interfacial adhesion for copper interconnects by providing...
8187664 Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same  
The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that...
8163400 Plated article having metal thin film formed by electroless plating, and manufacturing method thereof  
The present invention provides a plated article that has a thin seed layer having a uniform thickness, formed by electroless plating and allowing formation of ultrafine wiring, and that avoids the...
7989029 Reduced porosity copper deposition  
A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at...
7968804 Methods of patterning a deposit metal on a substrate  
An article includes a polymeric film having a major surface, a discontinuous layer of a catalytic material on the major surface, and a metal pattern on the catalytic material. The discontinuous...
7951414 Methods of forming electrically conductive structures  
Some embodiments include methods of forming conductive material within high aspect ratio openings and low aspect ratio openings. Initially, the high aspect ratio openings may be filled with a...
7691433 Method for structured application of molecules to a strip conductor and molecular memory matrix  
The invention relates to a method for a structured application of molecules on a strip conductor and to a molecular memory matrix. The inventive method makes it possible, for the first time, to...
7597813 Element substrate and method of manufacturing the same  
A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; disposing...
7476412 Method for the metalization of an insulator and/or a dielectric  
The invention relates to a process for the metallization of an insulator and/or a dielectric, wherein the insulator is firstly activated, it is subsequently coated with another insulator and the...
7429401 Superconformal metal deposition using derivatized substrates  
The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second...
7410666 Metal nitride carbide deposition by ALD  
The present methods provide tools for growing conformal metal thin films, including metal nitride, metal carbide and metal nitride carbide thin films. In particular, methods are provided for...
7328506 Method for forming a plated microvia interconnect  
A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a surface of the substrate and is in direct mechanical contact with a conductive element...
7270845 Dielectric composition for forming dielectric layer for use in circuitized substrates  
A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a...
7262135 Methods of forming layers  
The invention includes methods of forming layers conformally over undulating surface topographies associated with semiconductor substrates. The undulating surface topographies can first be exposed...
7255782 Selective catalytic activation of non-conductive substrates  
A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles and for creating circuitry for smart cards, such as phone cards is provided....
6599563 Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals  
A method and apparatus for improving interfacial chemical reactions in electroless depositions of metals, in which the substrate to be plated is pre-heated prior to its immersion in the various...
6589593 Method for metal coating of substrates  
A process for coating substrates having polymer surfaces with metals in the manufacturing of printed circuit boards, in particular in the manufacturing of printed circuit boards having microscopic...
6555171 Cu/Sn/Pd activation of a barrier layer for electroless CU deposition  
Provided herein is a method of utilizing electroless copper deposition to form interconnects in a semiconductor device. An opening is formed in a dielectric layer in the form of a trench, via or...
6537608 Protection of a plated through hole from chemical attack  
A method of forming an electronic structure, including adhesively coupling a plated metallic layer (e.g. a copper layer) of a plated through hole (PTH) to holefill material (e.g., epoxy resin)...
6534117 Electroless plating method and electroless plating solution  
When a barrier layer formed on a surface of a contact hole is subjected to electroless plating of copper, a salt of a metal such as gold, nickel, palladium, cobalt or platinum is added as a...
6534116 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence  
The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed...
6495200 Method to deposit a seeding layer for electroless copper plating  
A method of for electroless copper deposition using a Pd/Pd acetate seeding layer formed in using only two components (Pd acetate and solvent) to form an interconnect for a semiconductor device....
6436803 Manufacturing computer systems with fine line circuitized substrates  
Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A...
6426011 Method of making a printed circuit board  
A method of making a printed circuit board whereby a fine wiring pattern can be formed. A through hole is formed in a substrate, both surfaces of the substrate being covered with copper foil. The...
6406750 Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film  
A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each...
6403146 Process for the manufacture of printed circuit boards  
The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is...
6376049 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole  
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin...
6303181 Direct metallization process employing a cationic conditioner and a binder  
A method of applying a conductive carbon coating to a nonconductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive...
6268016 Manufacturing computer systems with fine line circuitized substrates  
Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A...
6265020 Fluid delivery systems for electronic device manufacture  
The present invention relates to new methods for delivering solutions during electronic device manufacture. Methods of the invention include delivering metallization solutions to the device at an...
6264851 Selective seed and plate using permanent resist  
The present invention is for a method wherein a printed circuit board can be fabricated in an electroless process with a minimum number of manufacturing steps using mild etchant conditions on an...
6261637 Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication  
A method for making integrated circuit wafers wherein the wafer has vias or other openings in the wafer which openings have a barrier/adhesion or other metal layer which is metallized to form the...
6221440 Process for plating metal coating  
A process for depositing metal coatings on polyimide surfaces for producing conductor tracks includes depositing a first metal coating by decomposition of volatile metal compounds by a glow...
6214525 Printed circuit board with circuitized cavity and methods of producing same  
The invention relates to subtractive and additive processes for creating a circuitized cavity in a printed circuit board. Additionally, the invention includes a circuitized cavity and a printed...
6174647 Metallization process and component  
This invention is directed to a process for the selective metallization which utilizes multiple photoresist layers, using a buried palladium ligand which is then catalyzed using a PdBr selective...
6162365 Pd etch mask for copper circuitization  
A process for making a printed circuit board is provided. The process employs a noble metal as an etch mask for subtractive circuitization and as a seed layer for secondary finishing. In a...
6136693 Method for planarized interconnect vias using electroless plating and CMP  
An improved and new method for fabricating conducting vias between successive layers of conductive interconnection patterns in a semiconductor integrated circuit has been developed. The method...
6126989 Copper electroless deposition on a titanium-containing surface  
A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the...
6123984 Method and apparatus for plating a substrate  
A method and apparatus can produce a sound metal deposit inside fine cavities fabricated on a substrate such as a semiconductor wafer through pre-plating treatment process for smoothly filling the...
6054172 Copper electroless deposition on a titanium-containing surface  
A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the...
6046107 Electroless copper employing hypophosphite as a reducing agent  
Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths. All four preferred electroless baths use hypophosphite as a reducing agent. The 4...
6044550 Process for the manufacture of printed circuit boards  
The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is...
6037020 Ultrasonic mixing of through hole treating compositions  
A method for treating a non-conductive through hole surface of a printed wiring board is disclosed. A printed wiring board including through holes is cleaned, conditioned, and a conductive coating...

Matches 1 - 50 out of 179 1 2 3 4 >