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8986819 |
Palladium precursor composition
A non-catalytic palladium precursor composition is disclosed, including a palladium salt and an organoamine, wherein the composition is substantially free of water. The composition permits the use... |
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8961729 |
Method for manufacturing touch panel
A method of manufacturing a touch panel is disclosed. The method includes providing a plurality of substrates, each having a size, providing a carrier including a plurality of grooves each having... |
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8963019 |
Manufacturing method of circuit board
A circuit board and a manufacturing method thereof are provided. According to the method, a dielectric layer is formed on a dielectric substrate, and the dielectric layer contains active... |
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8864894 |
Resist underlayer film forming composition containing silicone having onium group
There is provided a resist underlayer film forming composition for lithography for forming a resist underlayer film capable of being used as a hard mask or a bottom anti-reflective coating, or a... |
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8846537 |
Method for forming fine pitch structures
A mold having an open interior volume is used to define patterns. The mold has a ceiling, floor and sidewalls that define the interior volume and inhibit deposition. One end of the mold is open... |
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8840967 |
Method for manufacturing printed circuit board including flame retardant insulation layer
The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits... |
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8815332 |
Connecting and bonding adjacent layers with nanostructures
An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two... |
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8802183 |
Communication system with enhanced partial power source and method of manufacturing same
The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a... |
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8623450 |
Method for producing a flexible circuit configuration
For a method for producing a flexible circuit configuration in the form of a layer sequence of at least one insulating layer and at least one conductive layer, typically multiple insulating layers... |
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8617656 |
Liquid processing apparatus, liquid processing method, and storage medium
A liquid processing apparatus processes an object to be processed W including a body part Wi and a plurality of projecting-shape parts Wm disposed on the body part Wi, with an inorganic film and a... |
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8609201 |
Infrared curing process for touch panel manufacturing
An infrared energy oxidizing and/or curing process includes an infrared oxidation zone having an infrared energy source operable to emit infrared energy that oxidizes a conductive thin film... |
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8597424 |
Composition and method for forming an aluminum film
A composition for forming an aluminum film, comprising a complex represented by the following formula (1) and a complex represented by the following formula (2), the molar ratio of the complex... |
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8574444 |
Fabricating method for multilayer printed circuit board
A method of fabricating a multilayer printed circuit board includes forming a first circuit-forming pattern and a via-forming pattern on a first carrier, and forming a first insulation layer;... |
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8475666 |
Method for making toughening agent materials
A toughening agent composition for increasing the hydrophobicity of an organosilicate glass dielectric film when applied to said film. It includes a component capable of alkylating or arylating... |
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8475885 |
Method of forming organic film, and organic film, nozzle plate, inkjet head and electronic device
The method of forming an organic film, includes: an organic film formation step of forming an organic film on a surface of a base member using a silane coupling agent; and a post-processing step... |
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8466582 |
Method and apparatus for applying an electric field to a photovoltaic element
A method and apparatus for applying an electric field to a photovoltaic element. In one embodiment, the apparatus comprises at least one photovoltaic (PV) cell having a P-N junction; and a voltage... |
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8431184 |
Methods of forming electrically conductive structures
Some embodiments include methods of forming conductive material within high aspect ratio openings and low aspect ratio openings. Initially, the high aspect ratio openings may be filled with a... |
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8318254 |
Metallization on a surface and in through-holes of a substrate and a catalyst used therein
A copolymer deposited with particles of catalytic metal is disclosed in the present invention, which is formed from an ethylenically unsaturated monomer and a hydrophilic monomer, and the... |
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8287943 |
Method for producing a multilayer piezoelectric microcomponent using sacrificial thick film technology
The invention relates to the preparation of multilayer microcomponents which comprise one or more films, each consisting of a material M selected from metals, metal alloys, glasses, ceramics and... |
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8237057 |
Wiring board and wiring board manufacturing method
A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an... |
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8176628 |
Protruding post substrate package structure and method
In accordance with one embodiment, a method of forming a protruding post substrate package includes applying a dielectric layer to a carrier. Via apertures are formed in the dielectric layer.... |
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8153186 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus
An advantage of the present invention is to suppress moisture infiltrating from a pad electrode portion from spreading over the surface of a wiring pattern and improve the reliability of a... |
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8025923 |
Method for manufacturing a structure
A method of manufacturing a structure, including forming a composite film composed of a coating film and an organic or inorganic film on top of a substrate by forming the coating film on the... |
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7951414 |
Methods of forming electrically conductive structures
Some embodiments include methods of forming conductive material within high aspect ratio openings and low aspect ratio openings. Initially, the high aspect ratio openings may be filled with a... |
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7897216 |
Method for manufacturing organic device and electronic apparatus
A method for manufacturing an organic device includes disposing a solution containing a conductive organic material in a first region on a substrate, drying the solution to form a conductive... |
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7765686 |
Multilayer wiring structure and method of manufacturing the same
A method of manufacturing a multilayer wiring structure is disclosed. The method comprises a step of forming a via post on a first metal wiring element, a step of printing an interlayer insulation... |
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7718216 |
Low temperature bumping process
A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive... |
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7713592 |
Nanolayer deposition process
A hybrid deposition process of CVD and ALD, called NanoLayer Deposition (NLD) is provided. The nanolayer deposition process is a cyclic sequential deposition process, comprising the first step of... |
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7662429 |
Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the same
A laminate comprising a polyimide and a conductor layer, which is obtained by forming at least one conductor layer directly on the surface of a thermoplastic polyimide, is thermally fused by... |
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7425346 |
Method for making hybrid dielectric film
A method of forming a hybrid inorganic/organic dielectric layer on a substrate for use in an integrated circuit is provided, wherein the method includes forming a first dielectric layer on the... |
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7399399 |
Method for manufacturing semiconductor package substrate
A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and... |
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7305761 |
Method for manufacturing wiring substrate
A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate;... |
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7261916 |
Method of manufacturing thin-film antenna
A method of manufacturing a thin-film antenna is disclosed. A substrate is provided and coated with an organic material layer. After both of the substrate and organic material layer have been... |
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6887512 |
Method for fabricating printed-wiring substrate
A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating... |
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6869637 |
Bath and method of electroless plating of silver on metal surfaces
Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces,... |
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6623803 |
Copper interconnect stamping
A method of patterning a layer of copper on a material surface includes providing a stamp having a base and a stamping surface and providing a copper plating catalyst on the stamping surface. The... |
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6616966 |
Method of making lithographic contact springs
A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a... |
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6607980 |
Rapid-temperature pulsing anneal method at low temperature for fabricating layered superlattice materials and making electronic devices including same
A liquid precursor for forming a layered superlattice material is applied to an integrated circuit substrate. The precursor coating is annealed in oxygen using a rapid temperature pulsing anneal... |
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6599583 |
Method for making segemented through holes in printed circuit boards
A method for forming segmented through holes in a printed circuit board. The segmented through holes comprise a plurality of electrically conductive pathways disposed on the walls of a single... |
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6589594 |
Method for filling a wafer through-via with a conductive material
A method for filling a via formed through a silicon wafer is disclosed. The method entails mounting the silicon wafer on a mounting substrate and depositing either molten or solid balls of a... |
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6582757 |
Method for tungsten deposition without fluorine-contaminated silicon substrate
A method for forming tungsten structures over silicon substrates, including the following steps. A silicon substrate is having a patterned dielectric layer formed thereon defining a tungsten... |
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6574860 |
Ball grid array module
The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip... |
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6576567 |
Film deposition method and apparatus for semiconductor devices
In a film deposition method of depositing a film by adhering an organometallic fluid onto a to-be-processed body such as a semiconductor wafer and causing a pyrolytic decomposition reaction to... |
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6571468 |
Traceless flip chip assembly and method
A method for forming a fine-pitch flip chip assembly interconnects fine pitch devices after they have been connected to a carrier substrate. A die having a plurality of conductive sections, such... |
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6555296 |
Fine pitch wafer bumping process
A fine pitch wafer bumping process comprises: providing a wafer that has a plurality of contact pads exposed by a passivation layer formed on the surface of the wafer, wherein an under bump metal... |
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6555914 |
Integrated circuit package via
A method of forming a via in a circuit, such that parasitic capacitance is reduced. The surface layers of the circuit are identified, to which continuity with the via is desired, and secondary... |
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6555158 |
Method and apparatus for plating, and plating structure
There is a method and apparatus for plating in which electroless copper plating is performed in a contact hole and an interconnect trench on a minute scale of a semiconductor integrated circuit... |
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6544584 |
Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate
A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such... |
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6539613 |
Method of forming trimmable resistors
A method of forming trimmable resistors, resistor ray be embedded into a substrate. A portion of the resistor may be exposed, by segmenting the substrate, so that the resistor may be trimmed to a... |
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6524490 |
Method for electroless copper deposition using a hypophosphite reducing agent
A method for improving the electrical conductivity and appearance of copper films produced by reduction of copper ions using hypophosphite, comprising exposure of the as-deposited copper film to a... |