Matches 1 - 50 out of 213 1 2 3 4 5 >


Match Document Document Title
8988888 Instrument device  
A meter device which can be mounted and removed easier than conventional meter devices. A meter device is provided with a display plate, a circuit board, a middle case which is disposed on the...
8913394 Electrical components coupled to circuit boards  
The present invention can facilitate the coupling between electrical components and a circuit board after the circuit board is inserted into a housing of an electronic device. An electrical...
8379391 Memory module with vertically accessed interposer assemblies  
A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first...
8169296 Switch matrix  
A switch matrix module (600) includes programmable stub breakers (508-512, 514-518) which can break off the bus and isolate unused portion of the switch matrix. Using three-way stub breakers...
8144475 Electrical components coupled to circuit boards  
The present invention can facilitate the coupling between electrical components and a circuit board after the circuit board is inserted into a housing of an electronic device. An electrical...
7936063 Carrier assembly for an integrated circuit  
A carrier assembly for an integrated circuit is disclosed. The carrier assembly has a retainer with electrical contacts for receiving the integrated circuit, and island defining portions arranged...
7892626 Substrate with plane patterns and display device using the same  
A substrate with plane patterns formed in a liquid process wherein the plane patterns are formed based on a combination of plane shapes by which a difference in internal pressure of a solution...
7838989 Semiconductor component and apparatus for production of a semiconductor component  
A semiconductor component for radio-frequency applications has at least one substrate and one chip, and with contact pads is disclosed. In one embodiment, bonding wires connect the contact pads on...
7764505 Thermally stable and liquid-tight joint between a first ceramic, metal, or plastic component and a second ceramic, metal or plastic component, and the use of one such joint  
The invention relates to a joint which can be subjected to the temperature influences of an external medium (20) and joins an especially ceramic component (2) to an especially metallic component...
7733668 Hybrid integrated circuit device and method for manufacturing same  
A hybrid integrated circuit device includes: an insulating substrate (1) having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a...
7705452 Carrier assembly for an integrated circuit  
A carrier assembly for an integrated circuit is described. The assembly includes a retainer for receiving the integrated circuit, and island defining portions surrounding the retainer. Each island...
7660127 Electrical components coupled to circuit boards  
The present invention can facilitate the coupling between electrical components and a circuit board after the circuit board is inserted into a housing of an electronic device. An electrical...
7479697 Resilient carrier assembly for an integrated circuit  
Provided is a carrier assembly for an integrated circuit. The assembly includes a carrier having a matrix of island contacts interconnected by respective serpentine members to allow resilient...
7445457 Techniques for connecting midplane connectors through a midplane  
A midplane has plated through holes (PTHs) which form a first profile and a second profile. The first profile has (i) an overlapping portion which overlaps at least part of the second profile and...
7411134 Hybrid ground grid for printed circuit board  
Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a...
7397001 Multi-strand substrate for ball-grid array assemblies and method  
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M...
7321497 Electronic circuit apparatus and method for stacking electronic circuit units  
The invention provides an electronic circuit apparatus having a plurality of electronic circuit units (101a-101n), a circuit board (102) and a connection unit (103), the circuit board (102) having...
7247941 Printed circuit board assembly with strain-alleviating structures  
A printed circuit board (PCB) assembly includes a PCB. An integrated circuit (IC) carrier defines a receiving zone to receive an IC. The carrier has a plurality of island portions about the...
7199306 Multi-strand substrate for ball-grid array assemblies and method  
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M...
7139648 Apparatus for actuating a control element for a heating or air-conditioning system in a motor vehicle  
The invention relates to an apparatus for actuating a control element, for example, an air flap, for a heating or air-conditioning system (34) in a motor vehicle, having an actuating drive (32),...
7031170 Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device  
An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip...
6831233 Chip package with degassing holes  
A semiconductor device package includes multiple built-up layers of metal sandwiching non-conductive layers. The metal layers have grids of degassing holes arranged in rows and columns. The rows...
6787984 Wiring substrate, manufacturing method therefor, and image display device  
A wiring substrate for a display panel having a plurality of wiring electrodes thereon includes an airtight container formed by disposing an opposing substrate through a frame member on the...
6710265 Multi-strand substrate for ball-grid array assemblies and method  
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M...
6542952 PCI computer system having a transition module and method of operation  
A PCI computer system includes component boards (130) adjacent to and coupled to a PCI bus (120), a controller board (310) coupled to the PCI bus, a transition module (140) coupled to the PCI bus,...
6535397 Interconnect structure for interconnecting electronic modules  
An interconnect structure interconnects electronic modules and includes a backplane assembly formed from a substantially rigid backplane plate that carries RF connectors and a digital motherboard...
6496377 Vehicle electric power distribution system  
A vehicle electric power distribution apparatus is provided which includes a plurality of vertically stacked conductive circuit layers, each layer including an array of contact pads, a layer of...
6485309 Virtual midplane to enhance card interconnections using a matrix of interconnecting assemblies  
The present invention is a method and apparatus for interconnection system. A first connector located on a first card provides first contacts for first signal traces on the first card. The first...
6445578 Data storage enclosure  
An enclosure for a data storage system comprises at least first and second cast magnesium parts joined by rivets, each of which is made of a suitable material that provides compressive strength...
6423909 Circuit board construction for differential bus distribution  
A circuit board including differential bus traces on or buried within both sides of the board, interconnecting electronic devices such as disk drives, processors, and connectors for external...
6388200 Electronic interconnection medium having offset electrical mesh plane  
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first...
6303871 Degassing hole design for olga trace impedance  
An organic land grid array having multiple built up layers of metal sandwiching non-conductive layers, having a staggered pattern of degassing holes in the metal layers. The staggered pattern...
6297460 Multichip module and method of forming same  
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first...
6255600 Electronic interconnection medium having offset electrical mesh plane  
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first...
6049043 Printed circuit board  
A printed circuit board has a plastic carrier plate and a one-piece pressed screen forming interconnects of the electrical circuit that are firmly mechanically connected to one another via...
6037677 Dual-pitch perimeter flip-chip footprint for high integration asics  
A connection array for a chip provides a substantial increase in numbers of signal connection locations and a power distribution arrangement of improved robustness and noise immunity while...
5956232 Chip support arrangement and chip support for the manufacture of a chip casing  
Chip-support arrangement (23) with a chip support (23) for the manufacture of a chip casing, said chip support being provided on a support foil (20) with conducting paths (21) which are connected...
5887158 Switching midplane and interconnecting system for interconnecting large numbers of signals  
A physical interconnection architecture for making connections between a plurality of first printed-circuit boards and a plurality of second printed-circuit boards includes a midplane...
5748450 BGA package using a dummy ball and a repairing method thereof  
In a BGA package having electrically connected active balls and electrically disconnected dummy balls, the active balls are positioned in a radial direction at intervals of 90° around the dummy...
5644115 Relay matrix switching assembly  
A matrix of three pole, high speed, low current relays for connecting test equipment to a device under test is provided with improved interconnect buses. The relays are mounted in rows and columns...
5640308 Field programmable circuit module  
The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customized pattern of bonding pads is...
5633479 Multilayer wiring structure for attaining high-speed signal propagation  
Signal wiring layers are formed between a power supply layer and a ground layer, which have conductor patterns each constituted by a plurality of parallel strip-shaped conductors. The above layers...
5585602 Structure for providing conductive paths  
A method for forming one or more conductive paths by providing a first pattern of pre-formed conductive elements and a second pattern of preformed conductive elements in a substrate and forming,...
5572409 Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board  
Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable socket adapter in one embodiment. The socket adapter can be used for interconnecting...
5512782 Semiconductor device for DC/AC converter  
A semiconductor device for converting DC input power to AC output power includes a package having a rectangular shape with four side edges and containing a plurality of semiconductor chips...
5481073 Modular broadband bidirectional programmable switch system with stacked modular switch arrangement  
The basic element of a modular, bidirectional broadband programmable switch system is a switch module having a thin rectangular housing with a single first connector preferably in the center of an...
5438166 Customizable circuitry  
A customizable circuit using a programmable interconnect and compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions...
5410107 Multichip module  
An electrical interconnection medium having first and second overlying interconnection layers, each interconnection layer including parallel conductors, the conductors of the first and second...
5390081 Fault-tolerant power distribution system for rack-mounted hardware  
Fault-tolerant power distribution system for back-mounted hardware in which a backplane arrangement delivers alternative sources of system power in a prioritized pattern to each of a plurality of...
5352123 Switching midplane and interconnection system for interconnecting large numbers of signals  
A physical interconnection architecture for making connections between a plurality of first printed-circuit boards and a plurality of second printed-circuit boards includes a midplane...

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