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Document Title |
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8988888 |
Instrument device
A meter device which can be mounted and removed easier than conventional meter devices. A meter device is provided with a display plate, a circuit board, a middle case which is disposed on the... |
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8913394 |
Electrical components coupled to circuit boards
The present invention can facilitate the coupling between electrical components and a circuit board after the circuit board is inserted into a housing of an electronic device. An electrical... |
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8379391 |
Memory module with vertically accessed interposer assemblies
A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first... |
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8169296 |
Switch matrix
A switch matrix module (600) includes programmable stub breakers (508-512, 514-518) which can break off the bus and isolate unused portion of the switch matrix. Using three-way stub breakers... |
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8144475 |
Electrical components coupled to circuit boards
The present invention can facilitate the coupling between electrical components and a circuit board after the circuit board is inserted into a housing of an electronic device. An electrical... |
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7936063 |
Carrier assembly for an integrated circuit
A carrier assembly for an integrated circuit is disclosed. The carrier assembly has a retainer with electrical contacts for receiving the integrated circuit, and island defining portions arranged... |
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7892626 |
Substrate with plane patterns and display device using the same
A substrate with plane patterns formed in a liquid process wherein the plane patterns are formed based on a combination of plane shapes by which a difference in internal pressure of a solution... |
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7838989 |
Semiconductor component and apparatus for production of a semiconductor component
A semiconductor component for radio-frequency applications has at least one substrate and one chip, and with contact pads is disclosed. In one embodiment, bonding wires connect the contact pads on... |
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7764505 |
Thermally stable and liquid-tight joint between a first ceramic, metal, or plastic component and a second ceramic, metal or plastic component, and the use of one such joint
The invention relates to a joint which can be subjected to the temperature influences of an external medium (20) and joins an especially ceramic component (2) to an especially metallic component... |
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7733668 |
Hybrid integrated circuit device and method for manufacturing same
A hybrid integrated circuit device includes: an insulating substrate (1) having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a... |
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7705452 |
Carrier assembly for an integrated circuit
A carrier assembly for an integrated circuit is described. The assembly includes a retainer for receiving the integrated circuit, and island defining portions surrounding the retainer. Each island... |
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7660127 |
Electrical components coupled to circuit boards
The present invention can facilitate the coupling between electrical components and a circuit board after the circuit board is inserted into a housing of an electronic device. An electrical... |
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7479697 |
Resilient carrier assembly for an integrated circuit
Provided is a carrier assembly for an integrated circuit. The assembly includes a carrier having a matrix of island contacts interconnected by respective serpentine members to allow resilient... |
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7445457 |
Techniques for connecting midplane connectors through a midplane
A midplane has plated through holes (PTHs) which form a first profile and a second profile. The first profile has (i) an overlapping portion which overlaps at least part of the second profile and... |
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7411134 |
Hybrid ground grid for printed circuit board
Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a... |
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7397001 |
Multi-strand substrate for ball-grid array assemblies and method
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M... |
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7321497 |
Electronic circuit apparatus and method for stacking electronic circuit units
The invention provides an electronic circuit apparatus having a plurality of electronic circuit units (101a-101n), a circuit board (102) and a connection unit (103), the circuit board (102) having... |
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7247941 |
Printed circuit board assembly with strain-alleviating structures
A printed circuit board (PCB) assembly includes a PCB. An integrated circuit (IC) carrier defines a receiving zone to receive an IC. The carrier has a plurality of island portions about the... |
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7199306 |
Multi-strand substrate for ball-grid array assemblies and method
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M... |
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7139648 |
Apparatus for actuating a control element for a heating or air-conditioning system in a motor vehicle
The invention relates to an apparatus for actuating a control element, for example, an air flap, for a heating or air-conditioning system (34) in a motor vehicle, having an actuating drive (32),... |
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7031170 |
Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device
An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip... |
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6831233 |
Chip package with degassing holes
A semiconductor device package includes multiple built-up layers of metal sandwiching non-conductive layers. The metal layers have grids of degassing holes arranged in rows and columns. The rows... |
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6787984 |
Wiring substrate, manufacturing method therefor, and image display device
A wiring substrate for a display panel having a plurality of wiring electrodes thereon includes an airtight container formed by disposing an opposing substrate through a frame member on the... |
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6710265 |
Multi-strand substrate for ball-grid array assemblies and method
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M... |
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6542952 |
PCI computer system having a transition module and method of operation
A PCI computer system includes component boards (130) adjacent to and coupled to a PCI bus (120), a controller board (310) coupled to the PCI bus, a transition module (140) coupled to the PCI bus,... |
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6535397 |
Interconnect structure for interconnecting electronic modules
An interconnect structure interconnects electronic modules and includes a backplane assembly formed from a substantially rigid backplane plate that carries RF connectors and a digital motherboard... |
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6496377 |
Vehicle electric power distribution system
A vehicle electric power distribution apparatus is provided which includes a plurality of vertically stacked conductive circuit layers, each layer including an array of contact pads, a layer of... |
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6485309 |
Virtual midplane to enhance card interconnections using a matrix of interconnecting assemblies
The present invention is a method and apparatus for interconnection system. A first connector located on a first card provides first contacts for first signal traces on the first card. The first... |
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6445578 |
Data storage enclosure
An enclosure for a data storage system comprises at least first and second cast magnesium parts joined by rivets, each of which is made of a suitable material that provides compressive strength... |
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6423909 |
Circuit board construction for differential bus distribution
A circuit board including differential bus traces on or buried within both sides of the board, interconnecting electronic devices such as disk drives, processors, and connectors for external... |
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6388200 |
Electronic interconnection medium having offset electrical mesh plane
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first... |
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6303871 |
Degassing hole design for olga trace impedance
An organic land grid array having multiple built up layers of metal sandwiching non-conductive layers, having a staggered pattern of degassing holes in the metal layers. The staggered pattern... |
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6297460 |
Multichip module and method of forming same
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first... |
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6255600 |
Electronic interconnection medium having offset electrical mesh plane
An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first... |
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6049043 |
Printed circuit board
A printed circuit board has a plastic carrier plate and a one-piece pressed screen forming interconnects of the electrical circuit that are firmly mechanically connected to one another via... |
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6037677 |
Dual-pitch perimeter flip-chip footprint for high integration asics
A connection array for a chip provides a substantial increase in numbers of signal connection locations and a power distribution arrangement of improved robustness and noise immunity while... |
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5956232 |
Chip support arrangement and chip support for the manufacture of a chip casing
Chip-support arrangement (23) with a chip support (23) for the manufacture of a chip casing, said chip support being provided on a support foil (20) with conducting paths (21) which are connected... |
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5887158 |
Switching midplane and interconnecting system for interconnecting large numbers of signals
A physical interconnection architecture for making connections between a plurality of first printed-circuit boards and a plurality of second printed-circuit boards includes a midplane... |
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5748450 |
BGA package using a dummy ball and a repairing method thereof
In a BGA package having electrically connected active balls and electrically disconnected dummy balls, the active balls are positioned in a radial direction at intervals of 90° around the dummy... |
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5644115 |
Relay matrix switching assembly
A matrix of three pole, high speed, low current relays for connecting test equipment to a device under test is provided with improved interconnect buses. The relays are mounted in rows and columns... |
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5640308 |
Field programmable circuit module
The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customized pattern of bonding pads is... |
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5633479 |
Multilayer wiring structure for attaining high-speed signal propagation
Signal wiring layers are formed between a power supply layer and a ground layer, which have conductor patterns each constituted by a plurality of parallel strip-shaped conductors. The above layers... |
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5585602 |
Structure for providing conductive paths
A method for forming one or more conductive paths by providing a first pattern of pre-formed conductive elements and a second pattern of preformed conductive elements in a substrate and forming,... |
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5572409 |
Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board
Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable socket adapter in one embodiment. The socket adapter can be used for interconnecting... |
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5512782 |
Semiconductor device for DC/AC converter
A semiconductor device for converting DC input power to AC output power includes a package having a rectangular shape with four side edges and containing a plurality of semiconductor chips... |
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5481073 |
Modular broadband bidirectional programmable switch system with stacked modular switch arrangement
The basic element of a modular, bidirectional broadband programmable switch system is a switch module having a thin rectangular housing with a single first connector preferably in the center of an... |
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5438166 |
Customizable circuitry
A customizable circuit using a programmable interconnect and compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions... |
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5410107 |
Multichip module
An electrical interconnection medium having first and second overlying interconnection layers, each interconnection layer including parallel conductors, the conductors of the first and second... |
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5390081 |
Fault-tolerant power distribution system for rack-mounted hardware
Fault-tolerant power distribution system for back-mounted hardware in which a backplane arrangement delivers alternative sources of system power in a prioritized pattern to each of a plurality of... |
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5352123 |
Switching midplane and interconnection system for interconnecting large numbers of signals
A physical interconnection architecture for making connections between a plurality of first printed-circuit boards and a plurality of second printed-circuit boards includes a midplane... |