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Match Document Document Title
8952263 Micro-wire electrode pattern  
A micro-wire electrode includes a substrate and an anisotropically conductive electrode extending in a length direction formed over the substrate. The electrode includes a plurality of...
8923003 Flexible circuit connectors with reduced profiles  
An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact...
8867217 Tear-proof circuit  
A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to...
8854830 Semiconductor package substrate in particular for MEMS devices  
A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the...
8853559 Insulation circuit board, and power semiconductor device or inverter module using the same  
The invention relates to a high-voltage insulation circuit board which is used in an electric power apparatus such as an electric power converter or the like such as power semiconductor device,...
8847078 Printed wiring board and method for manufacturing printed wiring board  
A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple...
8797760 Substrate, electronic device, and electronic apparatus  
A substrate includes: a base; and a plurality of bonding terminals arranged on at least one surface of the base, wherein the plurality of bonding terminals include a first bonding terminal and a...
8780575 Printed circuit board  
A printed circuit board includes a board body having a routing-limited area. The routing-limited area is provided with at least one solder pad that is adapted for supporting a metal support...
8743557 Printed wiring board  
A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group...
8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate  
A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second...
8659143 Stub minimization for wirebond assemblies without windows  
A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending...
8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows  
A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the...
8659142 Stub minimization for wirebond assemblies without windows  
A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted...
8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate  
A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and second microelectronic packages each...
8653646 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows  
A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through...
8633399 Differential transmission circuit, optical module, and information processing system  
A differential transmission circuit includes a pair of transmission line conductors and a ground conductor layer, wherein the pair of transmission line conductors include a first straight line...
8629550 Printed wiring board with crossing wiring pattern  
A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer,...
8625297 Package structure with electronic component and method for manufacturing same  
A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the...
8456855 Printed circuit board  
A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a...
8450621 Wiring board and process for fabricating the same  
A process for fabricating a wiring board is provided. In the process, a wiring carrying substrate including a carry substrate and a wiring layer is formed. Next, at least one blind via is formed...
8446735 Semiconductor package  
Embodiments of the present invention provide a semiconductor package which includes: a semiconductor chip to which one end of each of a plurality of wires is connected; and a board on which the...
8406007 Magnetic circuit board connector component  
A magnetic component includes a bobbin structure adapted for attachment to a circuit board. The magnetic component may include a magnetically permeable core and a conductive winding. The bobbin...
8383952 Printed compatible designs and layout schemes for printed electronics  
Embodiments of the present invention relate to circuit layouts that are compatible with printing electronic inks, printed circuits formed by printing an electronic ink or a combination of printing...
8383949 Method to form lateral pad on edge of wafer  
Embodiments are directed to an apparatus and fabrication method to form pad arrays on the edge of a substrate wafer substrate. Embodiments of the invention make it possible for surface mount...
8367941 Filter, branching filter, communication module, and communication equipment  
A filter of the present invention is a filter including a substrate and a filter element mounted on the substrate, wherein the substrate is provided with a plurality of wiring layers including a...
8369099 Electronics device module  
Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a...
8273994 BGA footprint pattern for increasing number of routing channels per PCB layer  
A printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, where the circular shape...
8237262 Method and system for innovative substrate/package design for a high performance integrated circuit chipset  
Provided is a method and system for designing an integrated circuit (IC) substrate, the substrate being formed to include at least one die. The method includes providing at least portions of IC...
8179691 Wired circuit board  
A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first...
8154880 Method and apparatus for active line interface isolation  
A method and apparatus for active line interface isolation have been described.
8111521 Package-based filtering and matching solutions  
A microelectronic package having a radio frequency (RF) amplifier circuit and, incorporating harmonic rejection filters and matching circuits integrally formed in the package is disclosed. A...
8085549 Circuit device  
The circuit device includes a first transmitting inductor, a first insulating layer, a first receiving inductor, and a second receiving inductor. The first transmitting inductor is constituted of...
8081487 Signal transmission circuit, IC package, and mounting board  
Provided is a signal transmission circuit capable of realizing the same effects as those in a conventional manner that employs a complicated circuit by using no complicated circuit, that is, by a...
8071890 Electrically conductive structure of circuit board and circuit board using the same  
An electrically conductive structure includes a first conductive structure and a second conductive structure. Each has a conducting section at one end and a coupling section at the other end. The...
8063316 Split wave compensation for open stubs  
In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a...
8058557 Printed circuit board  
An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal...
8054643 Semiconductor module, wiring board, and wiring method  
A semiconductor module includes a plurality of rectangular shaped semiconductor devices which are arranged in two rows such that each pair of adjacent semiconductor devices is in orientations...
8035034 Printed circuit board  
A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid...
7990737 Memory systems with memory chips down and up  
In some embodiments, a system includes a memory controller chip, memory chips on a first substrate, and a module connector. A first group of conductors is included to provide read data signals...
7916497 Printed circuit board and differential signaling structure  
Provided is a system adopting a differential signaling system including a low frequency signaling line arranged to be adjacent to a pair of differential signaling lines in parallel to each other,...
7894204 Matrix board assembly  
An assembly of connected circuit boards includes at least one each of a matrix board, an input board and an output board. There are two types of input board, one for hydrophone cable input and one...
7876572 Wiring board and semiconductor apparatus  
A wiring board of the present invention includes a dummy wiring in a semiconductor-chip mount area on which a semiconductor chip is to be mounted. The dummy wiring is arranged in a manner such...
RE42035 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements  
A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability...
7867816 Method and system for innovative substrate/package design for a high performance integrated circuit chipset  
Provided is a method and system for designing an integrated circuit (IC) substrate, the substrate being formed to include at least one die. The method includes providing at least portions of IC...
7839135 System for and method of analyzing printed board carrying chassis, printed board carrying chassis structure, program, and recording medium  
A structure has a printed board carried by a metal chassis. A printed board carrying chassis analyzing system, a printed board carrying chassis analyzing method, a printed board carrying chassis...
7834274 Multi-layer printed circuit board and method for fabricating the same  
A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least...
7830669 Contact bank  
A contact bank, which can be terminated, or is terminated, at least one terminal module serving for signal communication and being adapted to allow telecommunications lines to be connected...
7701049 Integrated circuit packaging system for fine pitch substrates  
An integrated circuit packaging system comprising: forming a substrate including; patterning a bonding pad on the substrate, patterning a first signal trace coupled to the bonding pad, patterning...
7652895 Electrically insulating body, and electronic device  
The invention relates to an electric insulating body (2) provided with a conductor pattern (1) and an electronic device (10) comprising such a body (2) and at least one electronic element (30)....
7633766 Preferential via exit structures with triad configuration for printed circuit boards  
A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal...

Matches 1 - 50 out of 240 1 2 3 4 5 >