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9032614 Method for manufacturing an electrical bushing for an implantable medical device  
One aspect relates to an electrical bushing for use in a housing of an implantable medical device. The electrical bushing includes at least one electrically insulating base body and at least one...
9032613 Method for making circuit board  
A method for making a circuit board includes separating a plurality of versatile circuit boards from a collective board by cutting a connecting portion of the collective board, the plurality of...
9027226 Method for implementing prompt dose mitigating capacitor  
A method for implementing a prompt dose mitigating capacitor is disclosed. Initially, a flip chip is provided with multiple capacitors. The flip chip is then placed on top of a substrate having...
9027237 Method for producing optoelectronic components, and products produced thereby  
A method for producing optoelectronic components, the method comprising the steps of: providing optical components; picking up, by means of a robot arm, the optical components provided; subsequent...
9027238 Multilayered printed circuit board and method for manufacturing the same  
A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a...
9021692 Method for manufacturing a printed wiring board  
A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a...
9021689 Method of making a dual port pressure sensor  
A method of forming a dual port pressure sensor includes forming a first opening and a second opening in a flag of a lead frame. An encapsulant is molded to hold the lead frame in which the...
9024630 Magnetic field sensor and method for manufacturing a magnetic field sensor  
A magnetic field sensor includes: a circuit board having a first surface, a second surface opposite to the first surface, and a recess extending from the first surface to the second surface; a...
9021690 Method of manufacturing printed circuit board having buried solder bump  
A method of manufacturing a printed circuit board having a buried solder bump, including: preparing a carrier on which a circuit layer, a solder bump, and a circuit pattern formed on the solder...
9015934 Method for manufacturing probe card  
A method for manufacturing a probe card prepares a plurality of probes, each having a metal layer on an attaching portion, and hot-melt material covering the metal layer. Each probe is attached to...
9015932 Connecting method of electronic component  
It is to provide an electronic component connecting method capable of performing dehumidification within a short time without giving a thermal influence to an electronic component which has...
9015935 Method for manufacturing probe card  
A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip...
9009957 Method for placing a component on a substrate  
A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.
9009958 Systems and methods for encapsulating electronics in a mountable device  
A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having...
9013882 High-frequency module  
A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding,...
9003636 Method of manufacturing a control interface for motor vehicle  
The present invention relates to a method of manufacturing a control interface for motor vehicle comprising a touch pad exhibiting a front face, and a housing accommodating said touch pad, said...
9003649 Method of making a two-sided fluid cooled assembly  
A fluid cooled electrical assembly that includes a metal box, having a bottom wall, side walls and a top wall. A set of straight-edged pins, each smaller than 3 mm across in widest dimension,...
9001516 Electronic circuit unit to be mounted on automatic transmission for vehicle and manufacturing method thereof  
Provided is an electronic circuit unit to be mounted within a casing of an automatic transmission for a vehicle. An electronic circuit body including circuit-side terminals protruding in an...
8997340 Method of manufacturing and insulating sheet  
A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer...
8991043 Manufacturing method of a circuit board structure  
A circuit board structure includes a core circuit structure, a first and a second dielectric layers, a first and a second conductive blind via structures, a third and a fourth patterned circuit...
8987875 Balanced stress assembly for semiconductor devices  
An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the...
8988890 Component mounting structures with breakaway support tabs  
Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or...
8978245 Method of securing electronic devices within a sub-chassis  
A method includes securing a midplane to a bracket disposed between a first and second ends of a chassis, wherein a first surface of the midplane engages the bracket and faces the first end of the...
8981232 Conductive emissions protection  
A multi-layer substrate includes a ground structure, a plurality of dielectric layers on the ground structure and a plurality of conductive layers separating the plurality of dielectric layers....
8978247 TSV fabrication using a removable handling structure  
A method for forming an interconnection element having metalized structures includes forming metalized structures in an in-process unit that has a support material layer with first and second...
8973259 Method for manufacturing a multilayered circuit board  
A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a...
8967605 Carrier assembly apparatus  
[Problem] A carrier assembly apparatus which is able to be streamlined in structure is provided. [Solution] The carrier assembly apparatus 1 comprises: an assembly table 31 which supports a base...
8971049 Portable electronic device having integrated peripheral expansion module  
A portable electronic device, a peripheral expansion module and methods for assembling a peripheral expansion module onto a portable electronic device are provided herein. The portable electronic...
8966747 Method of forming an electrical contact  
A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut...
8966746 Method of fabricating cavity capacitor embedded in printed circuit board  
A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric...
8966748 Method for manufacturing an arrangement with a component on a carrier substrate and a method for manufacturing a semi-finished product  
The invention relates to a method for manufacturing an arrangement with a component on a carrier substrate, wherein the method encompasses the following steps: Manufacturing spacer elements on the...
8966749 Manufacturing method for protection circuit module of secondary battery  
A manufacturing method for a protection circuit module of a secondary battery is disclosed. The method includes mounting a die type circuit device to an FPCB. The mounting of the circuit device...
8959756 Method of manufacturing a printed circuit board having an embedded electronic component  
A method of manufacturing a core substrate having an electronic component, including providing a core substrate having a first surface and a second surface on an opposite side of the first...
8959758 Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device  
A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing...
8959759 Method for assembling computer modules small in thickness  
Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and...
8959762 Method of manufacturing an electronic module  
In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially...
8959757 Method of manufacturing an electronic module  
In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of...
8959733 Method of manufacturing liquid transporting apparatus  
There is provided a method of manufacturing liquid transporting apparatus including: providing a channel unit; providing a piezoelectric actuator having a first and second active portion...
8959761 Method of manufacturing polymer electrode and polymer actuator employing the polymer electrode  
A method of manufacturing a polymer electrode is provided. The method includes adhering a shadow mask onto a substrate, forming a hydrophilic electrode pattern on the substrate, coating the...
8955216 Method of making a compliant printed circuit peripheral lead semiconductor package  
A compliant printed circuit semiconductor package including a compliant printed circuit with at least a first dielectric layer selectively printed on a substrate with first recesses. A conductive...
8955215 High performance surface mount electrical interconnect  
A method of forming an interconnect assembly including forming a substrate with a plurality of through holes extending from a first major surface to a second major surface. A plurality of recesses...
8955218 Method for fabricating package substrate  
A package substrate includes a core layer, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface...
8950064 Component mounting device and component mounting method  
In a component mounting device (1) which has a first mounting lane (L1) and a second mounting lane (L2) and which is structured so as to be able to select either an independence mounting mode or...
8950068 Systems and methods for encapsulating electronics in a mountable device  
A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure has a first side defined by a first layer of...
8951379 Tape attaching device and tape attaching method  
In the tape attaching method of cutting a tape member into conductive tape pieces and attaching the conductive tape pieces onto a plurality of attachment regions which are formed at a side edge...
8950065 Weld gun part clamp device and method  
A combination component handling and connecting device connectable to a multi-axis robot for use in moving and connecting components and subassemblies includes a housing and an actuator fixedly...
8950067 Method for manufacturing electronic component device with a Ni—Bi alloy sealing frame  
An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of...
8950066 Method for manufacturing light emitting diode module  
A method for manufacturing an LED module includes following steps: providing a SMT apparatus having a CCD image sensor, providing a PCB having an LED mounted on, and fixing the PCB in the SMT...
8943684 Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board  
A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of...
8941016 Laminated wiring board and manufacturing method for same  
A laminated wiring board, includes: a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the...