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9041228 Molding compound including a carbon nano-tube dispersion  
A molding compound comprising a resin, a filler, and a carbon nano-tube dispersion is disclosed. The carbon nano-tube dispersion achieves a low average agglomeration size in the molding compound...
9040408 Techniques for wafer-level processing of QFN packages  
Semiconductor package devices, such as wafer-level package semiconductor devices, are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level...
9040352 Film-assist molded gel-fill cavity package with overflow reservoir  
A semiconductor device package having a cavity formed using film-assisted molding techniques is provided. Through the use of such techniques the cavity can be formed in specific locations in the...
9041220 Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device  
A semiconductor device includes a die coupled to a substrate, a first memory device coupled to a surface of the die opposite the substrate and a coupling device coupled between the surface of the...
9041200 Semiconductor devices having solder terminals spaced apart from mold layers and related methods  
A method of forming an electronic device may include providing a solder structure on a surface of a substrate, and a surface of the solder structure spaced apart from the substrate may be planar....
9041168 Overmolded semiconductor package with wirebonds for electromagnetic shielding  
According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the...
9041226 Chip arrangement and a method of manufacturing a chip arrangement  
In various embodiments, a chip arrangement is provided. The chip arrangement may include a chip carrier and a chip mounted on the chip carrier. The chip may include at least two chip contacts and...
9035473 Circuit device and method of manufacturing the same  
Provided are a thin circuit device with show-through of thin metal wires prevented and a method of manufacturing the circuit device. A circuit device mainly includes: a substrate including a first...
9033248 Semiconductor storage device  
According to one embodiment, a semiconductor storage device is provided with a memory chip including a storage circuit, a controller chip that controls a memory chip, and a substrate having a...
9035446 Power module  
Provided is a power module. The power module includes a power semiconductor chip. The power module further includes a case that accommodates the power semiconductor chip. A silicone gel seals the...
9034663 Sealed thin-film device, method of and system for repairing a sealing layer applied to a thin-film device  
The invention relates to a sealed thin-film device (10, 12, 14), to a method of repairing a sealing layer (20) applied to a thin-film device (30) to produce the sealed thin-film device, to a...
9035472 Semiconductor device  
In a semiconductor device, a conductor pattern is disposed in a position overlapped by a semiconductor chip in a thickness direction over the mounting surface (lower surface) of a wiring board. A...
9029198 Methods of manufacturing semiconductor devices including terminals with internal routing interconnections  
A method of fabricating a semiconductor package includes forming a plurality of terminals on a sheet carrier, molding the sheet carrier with a first molding compound, creating electrical paths for...
9029205 Integrated circuit packaging system having planar interconnect and method for manufacture thereof  
A method for manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a...
9029998 Semiconductor package device  
A semiconductor package device includes a lower package including a lower semiconductor chip mounted on the lower package substrate, a lower molding compound layer disposed on the lower package...
9024424 Stacked electronic component and manufacturing method thereof  
A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer...
9018751 Semiconductor module system having encapsulated through wire interconnect (TWI)  
A semiconductor module system includes a module substrate and a semiconductor substrate having a through wire interconnect bonded to an electrode on the module substrate. The through wire...
9018749 Stacked packages using laser direct structuring  
Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold...
9013035 Thermal improvement for hotspots on dies in integrated circuit packages  
Methods and apparatuses for improved integrated circuit (IC) packages are described herein. In an aspect, an IC device package includes an IC die having a contact pad, where the contact pad is...
9013047 Semiconductor device  
A semiconductor device includes a semiconductor element, a capacitor, a first resin, lead frames and a second resin. The first resin forms a resin molding which covers the semiconductor element...
9013048 Semiconductor device manufacturing method and semiconductor device  
A semiconductor device manufacturing method includes sealing a first surface of a semiconductor wafer with a resin, causing a resin-made warp suppression member to be adhered to a second surface...
9006904 Dual side package on package  
An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body....
9005736 Electronic component manufacturing method  
An electronic component manufacturing method that efficiently grinds a cover layer provided on a substrate even when the substrate is warped includes the step of forming first grooves at intervals...
9000595 Method of manufacturing semiconductor device and semiconductor device  
To provide a semiconductor device having a reduced size and thickness while suppressing deterioration in reliability. After a semiconductor wafer is ground at a back surface thereof with a...
9000587 Wafer-level thin chip integration  
A wafer-level package device and techniques for fabricating the device are described that include embedding a silicon chip onto an active device wafer or a passive device wafer, where the embedded...
9000584 Packaged semiconductor device with a molding compound and a method of forming the same  
The mechanisms of forming a molding compound on a semiconductor device substrate to enable fan-out structures in wafer-level packaging (WLP) are provided. The mechanisms involve covering portions...
8999763 Package including an interposer having at least one topological feature  
Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having an interposer including at least one topological feature, such as...
8994185 Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP  
A semiconductor device includes a semiconductor die. An encapsulant is deposited over the semiconductor die. A conductive micro via array is formed outside a footprint of the semiconductor die and...
8994161 Semiconductor device package and methods for producing same  
Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts extending upwardly from the substrate...
8994177 Far back end of the line stack encapsulation  
A method for far back end of the line (FBEOL) protection of a semiconductor device includes forming a patterned layer over a back end of the line (BEOL) stack, depositing a first conformal...
8987877 Semiconductor device  
A semiconductor device of the present invention comprises: an outer package; a first lead frame including a first relay lead, a first die pad with a power element mounted thereon, and a first...
8987853 Light emitting device and method of manufacturing the light emitting device  
A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose...
8987765 Reflective bank structure and method for integrating a light emitting device  
Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a...
8987894 Underfill process and materials for singulated heat spreader stiffener for thin core panel processing  
A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel...
8987063 Manufacturing method of semiconductor device  
A manufacturing method of a semiconductor device of a thin resin sealed multichip rectangular package having wire connection between the chips, wherein: at least one chip is fixed to a die pad...
8987881 Hybrid lead frame and ball grid array package  
A semiconductor device includes a first substrate having opposing first and second main surfaces, a first die disposed on the first main surface of the first substrate, a first bond wire coupled...
8987921 Multifunction sensor as PoP microwave PCB  
A method for producing a component with at least one micro-structured or nano-structured element includes applying at least one micro-structured or nano-structured element to a carrier. The...
8982577 Electronic component package having bleed channel structure and method  
A bleed channel electronic component package includes a substrate having an upper solder mask. To mount an electronic component to the substrate, an inactive surface of the electronic component is...
8982561 Lightweight audio system for automotive applications and method  
A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio...
8981575 Semiconductor package structure  
A semiconductor package structure includes: a dielectric layer; a metal layer disposed on the dielectric layer and having a die pad and traces, the traces each including a trace body, a bond pad...
8980697 Method of fabricating chip scale package  
A reconfigured wafer of resin-encapsulated semiconductor packages is obtained by supporting with a resin, thereafter, a grinding process is performed on top and backside surfaces to expose only a...
8975741 Process for forming package-on-package structures  
A device includes an inter-layer dielectric, a device die under the inter-layer dielectric; and a die-attach film under the inter-layer dielectric and over the device die, wherein the die-attach...
8970019 Semiconductor device with sealed semiconductor chip  
A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame...
8970028 Embedded heat spreader for package with multiple microelectronic elements and face-down connection  
A microelectronic package includes a substrate, first and second microelectronic elements, and a heat spreader. The substrate has terminals thereon configured for electrical connection with a...
8969132 Device package and methods for the fabrication thereof  
Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and...
8962357 Method for manufacturing organic light emitting diode display  
A method of manufacturing an organic light emitting diode (OLED) display according to an exemplary embodiment includes: forming a display unit displaying an image and a driver positioned near the...
8963314 Packaged semiconductor product and method for manufacture thereof  
Packaged semiconductor product (2) including a first semiconductor device (4A) and a packaging structure with a protective envelope (6) and a first and second external electrode (8,10). The first...
8963343 Ferroelectric memories with a stress buffer  
A device including a ferroelectric memory and methods of manufacturing the same are provided. In one embodiment, the device includes a semiconductor die with an integrated circuit fabricated...
8963315 Semiconductor device with surface electrodes  
A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a...
8963323 Heat-transfer structure  
An apparatus 100 comprising a first substrate 130 having a first surface 125, a second substrate 132 having a second surface 127 facing the first surface and an array 170 of metallic raised...