|
Match
|
Document |
Document Title |
|
|
9024420 |
Power quad flat no-lead (PQFN) package
Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One... |
|
|
9001527 |
Electronic package structure
The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive... |
|
|
8981401 |
Package for optical semiconductor device, optical semiconductor device using the package, and methods for producing same
The present invention is a package for optical semiconductor devices, and an optical semiconductor device using the package, which can prevent discoloration of a plating layer formed on a lead... |
|
|
8956919 |
Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof
The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern... |
|
|
8945990 |
Chip package and method of forming the same
Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip... |
|
|
8937378 |
Lead frame and semiconductor package including the same
A lead frame and a semiconductor package including the lead frame are provided. The lead frame includes: a base material; a first metal layer which is formed on at least one side of the base... |
|
|
8860196 |
Semiconductor package and method of fabricating the same
A semiconductor package and a method of manufacturing the same, and more particularly, to a package of a power module semiconductor and a method of manufacturing the same. The semiconductor... |
|
|
8766418 |
Semiconductor device
A semiconductor device includes a first semiconductor chip; an extension formed at a side surface of the first semiconductor chip; a connection terminal formed on the first semiconductor chip; a... |
|
|
8729683 |
Power module package and method for fabricating the same
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of... |
|
|
8680663 |
Methods and apparatus for package on package devices with reduced strain
Methods and apparatus for package on package structures. A structure includes a first integrated circuit package including at least one integrated circuit device mounted on a first substrate, a... |
|
|
8669581 |
Light emitting device package including UV light emitting diode
Provided is a light emitting device package, which includes a ceramic body, an ultraviolet light emitting diode, a support member, and a glass film. The ceramic body defines a cavity. The... |
|
|
8664745 |
Integrated inductor
The invention provides advances in the arts with useful and novel integrated packaging having inductor elements and adjacent magnetic material enhancing the inductance characteristics of the... |
|
|
8637892 |
LED package and method for manufacturing same
According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is... |
|
|
8624363 |
Method for semiconductor leadframes in low volume and rapid turnaround
An apparatus comprising a metallic leadframe including a pad and a plurality of leads. Each having a first and a parallel second surface and sidewalls normal to the surfaces. The pad and each lead... |
|
|
8587101 |
Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections
Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One... |
|
|
8581379 |
Lead frame and semiconductor device
A lead frame for a resin-seal type semiconductor device, which includes a semiconductor element having an electrode, a bonding wire connected to the electrode of the semiconductor element, and a... |
|
|
8564107 |
Lead frame and method for manufacturing the same
A lead frame comprises: a base metal layer; a copper plating layer, including one of a copper layer and an alloy layer including a copper, configured to plate the based metal layer to make a... |
|
|
8564114 |
Semiconductor package thermal tape window frame for heat sink attachment
The present invention is directed to a semiconductor packaging solution wherein a high K thermal material such as a grease or gel is placed in a controlled thin bond line between the semiconductor... |
|
|
8546923 |
Rigid power module suited for high-voltage applications
Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on... |
|
|
8541871 |
Multilayered lead frame for a semiconductor light-emitting device
A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such... |
|
|
8525307 |
Semiconductor device, lead frame assembly, and method for fabricating the same
A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and... |
|
|
8487424 |
Routable array metal integrated circuit package fabricated using partial etching process
An integrated circuit assembly is fabricated on a metal substrate strip in an array format that has raised circuitry pattern formed by photolithographic and metal etching processes. The circuitry... |
|
|
8421198 |
Integrated circuit package system with external interconnects at high density
An integrated circuit package system includes: connecting an integrated circuit die and external interconnects; forming an encapsulation over the integrated circuit die and a portion of the... |
|
|
8304886 |
Semiconductor device having integral structure of contact pad and conductive line
Provided are a semiconductor device and a method of forming a semiconductor device in which a plurality of patterns are simultaneously formed to have different widths and the pattern densities of... |
|
|
8304872 |
Lead frame, method for manufacturing the same and semiconductor device
A lead frame includes a lead frame body 21 having a die pad 24 to which a semiconductor chip 12 is bonded and a plurality of leads 25 arranged around the die pad 24 and made of Cu or an alloy... |
|
|
8264072 |
Electronic device
An electronic device is disclosed. In one embodiment, the electronic device includes a substrate, a plurality of conducting lines formed on a first conducting material that is disposed on the... |
|
|
8159055 |
Semiconductor device, lead-frame product used for the same and method for manufacturing the same
A semiconductor device includes a semiconductor element; a group of back-inner terminals coupled with the semiconductor element through bonding wires and arranged in an area array shape so as to... |
|
|
8133759 |
Leadframe
A leadframe includes a die paddle and leads, in which the back side of the die paddle has a fillister. The fillister defines a rim surrounding a recess, and the recess accommodates protrusion of... |
|
|
8124460 |
Integrated circuit package system employing an exposed thermally conductive coating
An integrated circuit package system includes providing a leadframe that is coplanar with a bottom surface of the integrated circuit package system to which is attached a device with a thermally... |
|
|
8120153 |
High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module
A cost-effective, ultra-compact, hybrid power module packaging system and method for making allows device operation in conventional and high temperature ranges over 300° C. Double metal leadframes... |
|
|
8120151 |
Optical semiconductor device and method for manufacturing the same
An optical semiconductor device can have a first lead for an optical semiconductor chip to be mounted on and a second lead for joining to a wire extending from the optical semiconductor chip. The... |
|
|
8110904 |
Lead frame for semiconductor device and method of manufacturing of the same
Provided are a semiconductor device lead frame and a method of manufacturing of the same that improve adhesive properties between plating layers when a plurality of plating layers are laminated,... |
|
|
8101962 |
Carrying structure of semiconductor
A carrying structure of semiconductor includes a carrier made of a plastic material with a heat conduction region, each surface of the carrier has an interface layer formed on, and an electrically... |
|
|
8063471 |
Copper alloy sheet for electric and electronic parts
A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is... |
|
|
8039934 |
Resin-encapsulated semiconductor device and its manufacturing method
A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device comprises a semiconductor chip including a... |
|
|
8030744 |
Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
An electrical connection arrangement between a semiconductor circuit arrangement and an external contact device, and to a method for producing the connection arrangement is disclosed. In one... |
|
|
7994616 |
Multilayered lead frame for a semiconductor light-emitting device
A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such... |
|
|
7956445 |
Packaged integrated circuit having gold removed from a lead frame
A method of packaging an integrated circuit, including providing a lead frame having lead fingers, where the lead frame has a gold layer thereon on a top surface and a bottom surface. An... |
|
|
7947534 |
Integrated circuit packaging system including a non-leaded package
An integrated circuit package system is provided including: forming a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads;... |
|
|
7944030 |
Lead frame and method of manufacturing the same
A lead frame includes a base material having a front surface for mounting of a semiconductor chip and a back surface for connection with an external board, and an Ni layer having a thick section... |
|
|
7932130 |
Method for forming an etched recess package on package system
An integrated circuit package system includes: providing a die attach paddle with interconnection pads connected to a bottom surface of the die attach paddle; connecting a first device to the... |
|
|
7911062 |
Electronic component with varying rigidity leads using Pb-free solder
The present invention proposes a semiconductor device including a semiconductor chip having a plurality of electrodes, a plurality of leads electrically connected to the plurality of electrodes of... |
|
|
7911041 |
Semiconductor device with gold coatings, and process for producing it
A semiconductor device (7) has gold coatings (1 to 5) which are applied to metallic or ceramic components (6) of the semiconductor device (7). The gold coatings (1 to 4) have a multifunctional... |
|
|
7879651 |
Packaging conductive structure and method for forming the same
A packaging conductive structure for a semiconductor substrate and a method for forming the structure are provided. The dielectric layer of the packaging conductive structure partially overlays... |
|
|
7868432 |
Multi-chip module for battery power control
A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first... |
|
|
7839003 |
Semiconductor device including a coupling conductor having a concave and convex
While a semiconductor device is provided with a plurality of element electrodes 5 formed on a semiconductor element 4 and a plurality of lead terminal electrodes 6 formed on a lead frame, the... |
|
|
7816770 |
Device and method for hermetically sealing a cavity in an electronic component
To hermetically seal a cavity in a microelectronic component, a cap located in a sealing device is positioned above the orifice opening into the cavity. The cap plastically deforms to seal the... |
|
|
7788800 |
Method for fabricating a leadframe
A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (402) and a plurality of lead segments (403). Covering the... |
|
|
7772681 |
Semiconductor die package and method for making the same
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an... |
|
|
7755194 |
Composite barrier layers with controlled copper interface surface roughness
A composite α-Ta/graded tantalum nitride/TaN barrier layer is formed in Cu interconnects with a controlled surface roughness for improved adhesion, electromigration resistance and reliability.... |