Patents in Class 257/503

Matches 1 - 50 out of 294

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Match	Document	Document Title
1	9035417	Parasitic inductance reduction for multilayered board layout designs with semiconductor devices A highly efficient, single sided circuit board layout design providing magnetic field self-cancellation and reduced parasitic inductance independent of board thickness. The low profile power loop...
2	9024407	Monitoring testkey used in semiconductor fabrication A monitoring testkey for a wafer is provided. The monitoring testkey includes a first metal oxide semiconductor (MOS) transistor having a channel extending in a first direction, a second MOS...
3	9013002	Iridium interfacial stack (IRIS) An iridium interfacial stack (“IrIS”) and a method for producing the same are provided. The IrIS may include ordered layers of TaSi2, platinum, iridium, and platinum, and may be placed on top of a...
4	8987883	Semiconductor package with multiple conductive clips One exemplary disclosed embodiment comprises a high power semiconductor package configured as a buck converter having a control transistor and a sync transistor disposed on a common leadframe pad,...
5	8981445	Analog floating-gate memory with N-channel and P-channel MOS transistors An analog floating-gate electrode in an integrated circuit, and method of fabricating the same, in which trapped charge can be stored for long durations. The analog floating-gate electrode is...
6	8963281	Simultaneous isolation trench and handle wafer contact formation Techniques are described to simultaneously form an isolation trench and a handle wafer contact without additional mask steps. In one or more implementations, an isolation trench and a handle wafer...
7	8957493	Semiconductor device A semiconductor device includes an active layer, at least one source electrode, at least one drain electrode, at least one gate electrode, a first insulating layer, a first source pad, a first...
8	8952750	Semiconductor power modules and devices An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a...
9	8946859	Device for detecting an attack in an integrated circuit chip An integrated circuit chip including a plurality of parallel wells of alternated conductivity types formed in the upper portion of a semiconductor substrate of a first conductivity type, and a...
10	8928109	Semiconductor device A semiconductor device is disclosed, which includes first and second power supply pads supplied with first and second power voltages, respectively, a first protection circuit coupled between the...
11	8907429	Semiconductor device, semiconductor integrated circuit, SRAM, and method for producing Dt-MOS transistor A semiconductor device includes a silicon substrate; an element isolation region; an element region including a first well; a contact region; a gate electrode extending from the element region to...
12	8896085	Semiconductor light-emitting element manufacturing method, lamp, electronic equipment, and mechanical apparatus A semiconductor light-emitting element manufacturing method including: a first step in which a first n-type semiconductor layer is laminated onto a substrate in a first organometallic chemical...
13	8890338	Method of identifying and/or programming an integrated circuit A chip and a method of fabricating the chip for low cost chip identification circuitry. In one embodiment, a method of manufacturing an integrated circuit includes formation of a multi-level...
14	8884396	Semiconductor device and manufacturing method thereof According to one embodiment, a first back surface of a first substrate and a second front surface of a second substrate are jointed together so as to connect a first conductor with a second...
15	8876312	Lighting device and apparatus with spectral converter within a casing In one embodiment, a light-emitting device having a substrate, a casing, a plurality of light source dies, a plurality of spectral converters and a plurality of optical structures is disclosed....
16	8872303	Chip pad resistant to antenna effect and method A chip pad structure of an integrated circuit (IC) and the method of forming are disclosed. The chip pad comprises a main pad portion and a ring pad portion. During a charging process involved in...
17	8853789	Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry A method of manufacturing a semiconductor structure includes: forming a trench in a back side of a substrate; depositing a dopant on surfaces of the trench; forming a shallow trench isolation...
18	8841754	Semiconductor devices with stress relief layers A semiconductor device having a via structure in a stress relief layer is provided. The semiconductor device may include an isolation layer on the circuit region, a stress relief layer on the via...
19	8836074	Semiconductor memory device A semiconductor memory device includes linear patterns disposed between isolation trenches extending in a first direction in a semiconductor device and having a first crystal direction the same as...
20	8835895	Memory device and fabrication process thereof A resistive-change memory element-containing memory device including: a first memory element that includes a first resistive-change layer and a first electrode connected to the first...
21	8803284	Thick on-chip high-performance wiring structures Methods for fabricating a back-end-of-line (BEOL) wiring structure, BEOL wiring structures, and design structures for a BEOL wiring structure. The BEOL wiring may be fabricated by forming a first...
22	8736015	Integrated circuit structure and method of forming the same An embodiment is an integrated circuit (IC) structure. The structure comprises a deep n well in a substrate, a first pickup device in the deep n well, a first signal device in the deep n well, a...
23	8729658	Integrated circuit devices having buried interconnect structures therein that increase interconnect density Integrated circuit devices include a semiconductor substrate having a plurality of trench isolation regions therein that define respective semiconductor active regions therebetween. A trench is...
24	8729640	Method and structure for radiation hardening a semiconductor device Semiconductor devices can be fabricated using conventional designs and process but including specialized structures to reduce or eliminate detrimental effects caused by various forms of radiation....
25	8692266	Circuit substrate structure A circuit substrate structure including a substrate, a dielectric stack layer, a first plating layer and a second plating layer is provided. The substrate has a pad. The dielectric stack layer is...
26	8671565	Blind via capture pad structure fabrication method A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture...
27	8669659	Semiconductor device and a method of manufacturing the same A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural electrode pads wherein occupation rates of...
28	8664050	Structure and method to improve ETSOI MOSFETS with back gate A structure and method to improve ETSOI MOSFET devices. A wafer is provided including regions with at least a first semiconductor layer overlying an oxide layer overlying a second semiconductor...
29	8664754	High power semiconductor package with multiple conductive clips One exemplary disclosed embodiment comprises a high power semiconductor package configured as a buck converter having a control transistor and a sync transistor disposed on a common leadframe pad,...
30	8659113	Embedded semiconductor die package and method of making the same using metal frame carrier An embedded semiconductor die package is made by mounting a frame carrier to a temporary carrier with an adhesive. The frame carrier includes die mounting sites each including a leadframe...
31	8648643	Semiconductor power modules and devices An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a...
32	8642986	Integrated circuit having microelectromechanical system device and method of fabricating the same An integrated circuit (IC) having a microelectromechanical system (MEMS) device buried therein is provided. The integrated circuit includes a substrate, a metal-oxide semiconductor (MOS) device, a...
33	8581361	Semiconductor apparatus A power supply wiring and a pad are arranged on a first wiring layer. Then, the power supply wiring and the pad are arranged so as not to be mutually overlapped. Signal wirings are arranged on a...
34	8552559	Very thick metal interconnection scheme in IC chips A new interconnection scheme is described, comprising both coarse and fine line interconnection schemes in an IC chip. The coarse metal interconnection, typically formed by selective...
35	8536677	Capacitor structure One or more embodiments relate to a capacitor structure comprising a first and second capacitor electrode. The first electrode may include a conductive strip having at least one wider portion and...
36	8530997	Double seal ring A double seal ring for an integrated circuit includes a first seal ring with a first opening. The first seal ring surrounds the integrated circuit. A second seal ring with a second opening...
37	8507358	Composite wafer semiconductor A composite wafer semiconductor device includes a first wafer and a second wafer. The first wafer has a first side and a second side, and the second side is substantially opposite the first side....
38	8503212	Semiconductor memory apparatus with power-meshed structure A semiconductor memory apparatus includes a plurality of banks each having a plurality of cell mats; a plurality of power lines disposed over predetermined portions of each of the plurality of...
39	8502338	Through-substrate via waveguides A device includes a semiconductor substrate of a first conductivity type, wherein the semiconductor substrate comprises a first surface and a second surface opposite the first surface. A...
40	8497573	High power semiconductor package with conductive clip on multiple transistors In one implementation, a high power semiconductor package is configured as a buck converter including a control transistor, a sync transistor, a driver integrated circuit (IC) for driving the...
41	8492868	Method, apparatus, and design structure for silicon-on-insulator high-bandwidth circuitry with reduced charge layer A method, integrated circuit and design structure includes a silicon substrate layer having trench structures and an ion impurity implant. An insulator layer is positioned on and contacts the...
42	8487400	High performance system-on-chip using post passivation process The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a...
43	8487397	Method for forming self-aligned contact An integrated circuit with a self-aligned contact includes a substrate with a transistor formed thereover, a dielectric spacer, a protection barrier, and a conductive layer. The transistor...
44	8476614	Memory device and fabrication process thereof A memory device that includes a resistive-change memory element, the memory device includes: a first memory element that includes a first resistive-change layer and a first electrode connected to...
45	8470705	Chip pad resistant to antenna effect and method A chip pad structure of an integrated circuit (IC) and the method of forming are disclosed. The chip pad comprises a main pad portion and a ring pad portion. During a charging process involved in...
46	8471324	Semiconductor device A semiconductor device is provided. The semiconductor device includes a memory device, and the memory device includes a substrate, two stacked gates, two spacers, an insulating layer, and a...
47	8470635	Keyhole-free sloped heater for phase change memory Subject matter disclosed herein relates to a method of manufacturing a semiconductor integrated circuit device, and more particularly to a method of fabricating a phase change memory device.
48	8466535	Galvanic isolation fuse and method of forming the fuse The spikes in current and voltage that result from the failure of a galvanic dielectric layer are safely contained by a galvanic isolation fuse that pops and forms and open circuit between a...
49	8432015	Semiconductor device and wire bonding method A semiconductor device (2) includes: a FLR (65) that is disposed on a semiconductor substrate so as to divide the semiconductor substrate into an inner region and an outer region; a first bonding...
50	8405185	Semiconductor device and semiconductor module including the same Integrated circuit devices include a semiconductor substrate having a plurality of trench isolation regions therein that define respective semiconductor active regions therebetween. A trench is...

Matches 1 - 50 out of 294

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