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9048162 CMOS image sensors and methods for forming the same  
A device includes a diode, which includes a first, a second, and a third doped region in a semiconductor substrate. The first doped region is of a first conductivity type, and has a first impurity...
9041133 BSI image sensor package with embedded absorber for even reception of different wavelengths  
A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face...
9040970 Hidden organic optoelectronic devices  
An optoelectronic device comprising at least one optoelectronic active region comprising at least a rear electrode and a front electrode between which an organic optoelectronic material is...
9042424 Silicon-based lens support structure and cooling package with passive alignment for compact heat-generating devices  
A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the...
9041134 Solid-state imaging device  
A solid-state imaging device includes a pixel chip, a logic chip and one or more shielding layers. The one or more shielding layers are arranged between or within the pixel chip and/or the logic...
9041047 Organic light emitting diode display and method for manufacturing the same  
An exemplary embodiment described technology relates generally to an organic light emitting diode (OLED) display and a manufacturing method thereof. The organic light emitting diode (OLED) display...
9041130 Magnetic memory device  
According to one embodiment, a magnetic memory device includes a semiconductor substrate, a memory cell array area on the semiconductor substrate, the memory cell array area including...
9041869 Sensor substrate, method of manufacturing the same and sensing display panel having the same  
A sensor substrate includes a blocking pattern disposed on a base substrate, a first electrode disposed on the base substrate and overlapping the blocking pattern, the first electrode including a...
9034763 Sloped structure, method for manufacturing sloped structure, and spectrum sensor  
A method for manufacturing a sloped structure is disclosed. The method includes the steps of: (a) forming a sacrificial film above a substrate; (b) forming a first film above the sacrificial film;...
9035346 Light source module  
The light source module includes a circuit board adapted to be placed on a mounting base of a light source holding member, and a power feeding attachment to supply power to a semiconductor light...
9035410 Avalanche photodiode detector  
An avalanche photodiode detector is provided. The avalanche photodiode detector comprises an absorber region having an absorption layer for receiving incident photons and generating charged...
9035407 Receiver module and device  
Provided is a receiver module, including: a semiconductor light receiving element including an electrode; and a sub-mount including: an electrical wiring joined to the electrode with solder; and a...
9035408 Nanometer-scale level structures and fabrication method for digital etching of nanometer-scale level structures  
A ramped etalon cavity structure and a method of fabricating same. A bi-layer stack is deposited on a substrate. The bi-layer stack includes a plurality of bi-layers. Each bi-layer of the...
9035406 Wafer level optical packaging system, and associated method of aligning optical wafers  
An optical system has a first relief-type diffraction grating fiducial, or alignment mark, on a transparent surface of a first optical wafer or plate, the grating arranged to deflect light away...
9029967 Solid-state image pickup device having waveguides in light-receiving and light-shielding areas  
A solid-state image pickup device includes a semiconductor substrate in which photoelectric conversion units are arranged. An insulator is disposed on the semiconductor substrate. The insulator...
9029176 Solid-state imaging device and method for manufacturing the same  
The present invention achieves an optical characteristic exhibiting excellent sensitivity or the like, by increasing the opening dimension of an optical waveguide without changing the...
9029785 Method of fabricating microlens, and depth sensor including microlens  
A method of fabricating a microlens includes forming layer of photoresist on a substrate, patterning the layer of photoresist, and then reflowing the photoresist pattern. The layer of photoresist...
9029968 Optical sensor device  
An optical sensor element is mounted in a package which includes a glass substrate having a cavity, and a glass lid substrate bonded to the other substrate to close the cavity. The glass substrate...
9030108 Gaussian surface lens quantum photon converter and methods of controlling LED colour and intensity  
This invention is a photon-interactive Gaussian surface lens method means that converts incident photons from a single or a plurality of wide band gap semiconductor class light emitting diode...
9029183 Method and apparatus for image sensor packaging  
Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a BSI sensor device with an application specific integrated circuit (ASIC) are disclosed. A bond pad array may be...
9024405 Solid-state image sensor  
A solid-state image sensor including an effective pixel portion in which a plurality of pixels including photodiodes formed on a semiconductor substrate are arranged, and a peripheral portion...
9024401 Photodetector, image sensor and method for manufacturing  
The finding that with a reasonable effort a layer thickness and/or refractive index variation may be acquired which realizes different internal optical path lengths for impinging radiation whereby...
9024404 Light sensors having dielectric optical coating filters  
Light sensors including dielectric optical coatings to shape their spectral responses, and methods for fabricating such light sensors in a manner that accelerates lift-off processes and increases...
9023681 Method of fabricating heterojunction battery  
The present invention discloses a method of fabricating a heterojunction battery, comprising the steps of: depositing a first amorphous silicon intrinsic layer on the front of an n-type silicon...
9024344 Surface passivation by quantum exclusion using multiple layers  
A semiconductor device has a multilayer doping to provide improved passivation by quantum exclusion. The multilayer doping includes at least two doped layers fabricated using MBE methods. The...
9024403 Image sensor package  
An image sensor package and image sensor chip capable of being slenderized while enhancing the reliability with respect to physical impact are provided. The image sensor package includes an image...
9025919 High voltage photo-switch package module having encapsulation with profiled metallized concavities  
A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces metalized with first metallic layers formed thereon, and...
9024249 Solid-state imaging device and method of manufacturing the same, and imaging apparatus  
A solid-state imaging device includes: a semiconductor substrate provided with an effective pixel region including a light receiving section that photoelectrically converts incident light; an...
9024402 Waveguide avalanche photodetectors  
Devices comprised of end-on waveguide-coupled photodetectors are described. In embodiments of the invention, the photodetectors are avalanche photodiodes coupled end-on to a waveguide. The...
9018589 Direct conversion X-ray detector  
The invention relates to a radiation detector (100) comprising a converter element (102) for converting incident high-energy radiation (X) into charge signals. A cathode (101) and an array (104)...
9018654 Semiconductor light emitting device and light emitting apparatus  
According to one embodiment, a semiconductor light emitting device includes a p-type semiconductor layer, an n-type semiconductor layer, a light emitting layer, a p-side electrode and an n-side...
9018725 Stepped package for image sensor and method of making same  
An image sensor package includes a crystalline handler having opposing first and second surfaces, and a cavity formed into the first surface. At least one step extends from a sidewall of the...
9018723 Infrared camera sensor  
The present disclosure is directed to an infrared sensor that includes a plurality of pairs of support structures positioned on the substrate, each pair including a first support structure...
9013017 Method for making image sensors using wafer-level processing and associated devices  
A method of making image sensor devices may include forming a sensor layer including image sensor ICs in an encapsulation material, bonding a spacer layer to the sensor layer, the spacer layer...
9012860 Dual-SPAD-based single-photon receiver  
A single-photon receiver is presented. The receiver comprises two SPADs that are monolithically integrated on the same semiconductor chip. Each SPAD is biased with a substantially identical gating...
9013013 Pressure sensor package having a stacked die arrangement  
A pressure sensor package includes a pressure sensor having a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts. A logic die stacked on the...
9012925 Solid state imaging device having a pair of charge holding films  
A solid-state imaging device according to embodiments of the present disclosure includes a light receiving unit, a first charge holding film, and a second charge holding film. The light receiving...
9006807 Solid-state image sensing device and camera  
According to one embodiment, a solid-state image sensing device includes a semiconductor substrate having a first and second surface, an insulating film covering an element on the first surface, a...
9006850 Motion sensing device  
A motion sensing device for sensing infrared rays includes a substrate; an optical module, including a first spacer layer, coupled to the substrate; a first glass layer, formed on the first spacer...
9006759 Light-emitting device  
A light-emitting device is provided that aims not to affect a service life and characteristics of light emission and includes two electrodes formed on the upper surface of a substrate with a gap...
9000548 Reflective secondary lens system and semiconductor assembly and also method for the production thereof  
The present invention relates to a reflective and/or refractive secondary lens system for focusing sunlight onto semiconductor elements, the secondary lens system being characterized according to...
9000541 Photoelectric conversion device and electronic apparatus  
A photoelectric conversion device includes circuit portions disposed on a substrate, a first electrode electrically connected to one of the circuit portions, an optically transparent second...
8994051 Light emission module, light emission module manufacturing method, and lamp unit  
In a light emission module (40), a light wavelength conversion ceramic (52) is formed in a sheet shape which converts the wavelength of the light emitted from a semiconductor light emission...
8994135 Photodiode and photodiode array  
A photodiode array PDA1 is provided with a substrate S wherein a plurality of photodetecting channels CH have an n-type semiconductor layer 32. The photodiode array PDA1 is provided with a p− type...
8994058 Light emitting device having an ohmic layer with a plurality of protruding contact portions  
Disclosed is a light emitting device including a conductive substrate, a first electrode layer disposed on the conductive substrate, a light emitting structure disposed on the first electrode...
8987852 Solid-state image pickup apparatus, image pickup system including solid-state image pickup apparatus, and method for manufacturing solid-state image pickup apparatus  
A method for manufacturing a solid-state image pickup device is provided. The image pickup apparatus includes a photoelectric conversion portion disposed on the semiconductor substrate, a first...
8987853 Light emitting device and method of manufacturing the light emitting device  
A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose...
8987751 Photodiode device based on wide bandgap material layer and back-side illumination (BSI) CMOS image sensor and solar cell including the photodiode device  
According to example embodiments, a photodiode system may include a substrate, and at least one photodiode in the substrate, and a wideband gap material layer on a first surface of the substrate....
8981513 Electrical circuit and method for producing an electrical circuit  
An electrical circuit includes a solar cell that has a photovoltaically active front side and a back side. An electronic or micromechanical component is arranged on the back side of the solar cell...
8981512 Optical shield in a pixel cell planarization layer for black level correction  
A pixel array includes a plurality of photodiodes disposed in a semiconductor layer and arranged in the pixel array. A color filter layer is disposed proximate to the semiconductor layer. Light is...