Match
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Document |
Document Title |
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9041008 |
Semiconductor device and method of manufacturing the same
A semiconductor device of an embodiment includes a first conductive type silicon carbide substrate having first and second main surfaces, a first conductive type silicon carbide layer formed on... |
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9041098 |
Semiconductor device
According to one embodiment, the semiconductor device is provided with a first semiconductor layer, a second semiconductor layer, a third semiconductor layer, a pair of first conductors, a pair of... |
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9041049 |
Power JFET
In general, in a semiconductor active element such as a normally-off JFET based on SiC in which an impurity diffusion speed is significantly lower than in silicon, gate regions are formed through... |
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9041057 |
Field effect transistor device with shaped conduction channel
A field effect transistor device includes a substrate, a silicon germanium (SiGe) layer disposed on the substrate, gate dielectric layer lining a surface of a cavity defined by the substrate and... |
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9041104 |
Semiconductor device
A memory includes a semiconductor layer, a gate insulating film on the semiconductor layer, and a gate electrode on the gate insulating film. A first channel region of a first conductivity type is... |
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9041097 |
Semiconductor device
A semiconductor device includes a channel layer formed on a substrate, an insulating layer formed in contact with the channel layer, an impurity-doped first semiconductor layer formed on an... |
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9041085 |
Semiconductor device and method of forming the same
A semiconductor device may include, but is not limited to, a semiconductor substrate having a first gate groove; a first fin structure underneath the first gate groove; a first diffusion region in... |
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9035375 |
Field-effect device and manufacturing method thereof
Embodiments relate to a field-effect device that includes a body region, a first source/drain region of a first conductivity type, a second source/drain region, and a pocket implant region... |
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9035366 |
Semiconductor device and manufacturing method therefor
A semiconductor electronic device structure includes an active area array disposed in a substrate, an isolation structure, a plurality of recessed gate structures, a plurality of word lines, and a... |
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9029930 |
FinFET device with epitaxial structure
A FinFET device includes a substrate, a fin, and isolation regions on either side of the fin. The device also includes sidewall spacers above the isolation regions and formed along the fin... |
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9029943 |
Semiconductor memory device and method of manufacturing the same
The semiconductor memory device includes a cell transistor having a gate insulating film deposited on an inner surface of a groove formed in an upper surface of the semiconductor substrate, a gate... |
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9029872 |
Semiconductor device and method for fabricating the same
The present inventive concept has been made in an effort to improve the breakdown voltage of a silicon carbide MOSFET using a trench gate. A semiconductor device according to the present inventive... |
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9029871 |
Semiconductor device
A semiconductor device includes a first semiconductor layer surrounding a bottom of the trench gate, a second semiconductor layer disposed along one of end portions of the trench gate in a... |
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9029870 |
Semiconductor device and manufacturing method thereof
A semiconductor device of the present invention includes a semiconductor layer composed of SiC, a metal layer directly bonded to one face of the semiconductor layer, and a high carbon... |
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9029941 |
Vertical transistor component
A vertical transistor component includes a semiconductor body with first and second surfaces, a drift region, and a source region and body region arranged between the drift region and the first... |
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9024383 |
Semiconductor device with a super junction structure with one, two or more pairs of compensation layers
A super junction semiconductor device comprises a semiconductor portion with mesa regions protruding from a base section. The mesa regions are spatially separated in a lateral direction parallel... |
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9024377 |
Semiconductor device capable of reducing influences of adjacent word lines or adjacent transistors and fabricating method thereof
A semiconductor device capable of reducing influences of adjacent word lines is provided in the present invention. The semiconductor device includes: a substrate, and a word line disposed in the... |
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9024378 |
Device structure and manufacturing method using HDP deposited source-body implant block
This invention discloses a semiconductor power device. The trenched semiconductor power device includes a trenched gate, opened from a top surface of a semiconductor substrate, surrounded by a... |
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9024330 |
Semiconductor device and manufacturing method thereof
A method of manufacturing a semiconductor device includes forming an ohmic electrode in a first area on one of main surfaces of a silicon carbide layer, siliciding the ohmic electrode, and forming... |
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9018698 |
Trench-based device with improved trench protection
A semiconductor device includes a semiconductor substrate having a first type of conductivity. A first layer is formed on the substrate having the first type of conductivity and is more lightly... |
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9018697 |
fin FET and method of fabricating same
A fin field effect transistor (fin FET) is formed using a bulk silicon substrate and sufficiently guarantees a top channel length formed under a gate, by forming a recess having a predetermined... |
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9018699 |
Silicon carbide semiconductor element and method for fabricating the same
A SiC semiconductor element includes: a SiC substrate which has a principal surface tilted with respect to a (0001) Si plane; a SiC layer arranged on the principal surface of the substrate; a... |
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9018700 |
Direct-drain trench FET with source and drain isolation
In a general aspect, an apparatus can include a semiconductor layer of a first conductivity type, the semiconductor layer having a top-side surface. The apparatus can also include a well region of... |
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9012982 |
Recessed transistor and method of manufacturing the same
A recessed transistor and a method of manufacturing the same are provided. The recessed transistor may include a substrate, an active pin, a gate pattern and source and drain regions. The... |
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9012961 |
Method of manufacturing a non-volatile memory
The disclosure relates to a method of manufacturing vertical gate transistors in a semiconductor substrate, comprising implanting, in the depth of the substrate, a doped isolation layer, to form a... |
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9012985 |
Semiconductor device having a trench whose upper width is wider than a lower width thereof, and a method for fabricating the same
A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes: a trench disposed within a substrate, the trench comprising an upper trench part that is... |
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9012986 |
Combination FinFET and planar FET semiconductor device and methods of making such a device
A device includes a plurality of trenches and fins defined in a substantially un-doped layer of semiconducting material, a gate insulation layer positioned on the fins and on the bottom of the... |
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9012980 |
Method of manufacturing a semiconductor device including proton irradiation and semiconductor device including charge compensation structure
A method of manufacturing a semiconductor device includes forming a charge compensation device structure in a semiconductor substrate. The method further includes measuring a value of an electric... |
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9012957 |
MOS transistor
A MOS transistor including a U-shaped channel-forming semiconductor region and source and drain regions having the same U shape located against the channel-forming region on either side thereof,... |
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9012983 |
Semiconductor device and method of forming the same
A semiconductor device includes the following elements. A semiconductor substrate has a device formation region. The device formation region is defined by first and second device isolation regions... |
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9012984 |
Field effect transistor devices with regrown p-layers
A transistor device includes a drift layer having a first conductivity type, a body layer on the drift layer, the body layer having a second conductivity type opposite the first conductivity type,... |
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9006820 |
Vertical DMOS transistor
A transistor includes a semiconductor body; a body region of a first conductivity type formed in the semiconductor body; a gate electrode formed partially overlapping the body region and insulated... |
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9006067 |
Semiconductor device and method of fabricationg the same
A method of fabricating a semiconductor device includes forming first gate patterns on a semiconductor substrate using an etch mask pattern, forming a trench in the semiconductor substrate between... |
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9006821 |
Electronic device comprising a conductive structure and an insulating layer within a trench
An electronic device can include a semiconductor layer overlying a substrate and having a primary surface and a thickness, wherein a trench extends through at least approximately 50% of the... |
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9006822 |
Trench-gate RESURF semiconductor device and manufacturing method
A trench-gate device with lateral RESURF pillars has an additional implant beneath the gate trench. The additional implant reduces the effective width of the semiconductor drift region between the... |
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9006798 |
Semiconductor device including trench transistor cell array and manufacturing method
A semiconductor device includes a trench transistor cell array in a silicon semiconductor body with a first main surface and a second main surface opposite to the first main surface. A main... |
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9006824 |
Power semiconductor device with reduced on-resistance and increased breakdown voltage
In one implementation, a power semiconductor device includes an active region and a termination region. A depletion trench finger extends from the active region and ends in the termination region.... |
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9006823 |
Semiconductor device and method of manufacturing semiconductor device
A semiconductor device includes: a semiconductor substrate formed with an element region; a first conductive type first region formed in the element region and located on a surface side of the... |
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9006839 |
Semiconductor device
In a semiconductor substrate of a semiconductor device, a drift layer, a body layer, an emitter layer, and a trench gate electrode are formed. When the semiconductor substrate is viewed in a plane... |
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9000538 |
Semiconductor device with equipotential ring contact at curved portion of equipotential ring electrode and method of manufacturing the same
A downsized semiconductor device having an excellent reverse characteristic, and a method of manufacturing the semiconductor device is sought to improve. The semiconductor device comprises a... |
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9000515 |
Super-junction trench MOSFETs with short terminations
A super-junction trench MOSFET with a short termination area is disclosed, wherein the short termination area comprising a charge balance region and a channel stop region formed near a top surface... |
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8999769 |
Integration of high voltage trench transistor with low voltage CMOS transistor
A method of forming a device is disclosed. A substrate defined with a device region is provided. A gate having an upper and a lower portion is formed in a trench in the substrate in the device... |
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9000514 |
Fabrication of trench DMOS device having thick bottom shielding oxide
Semiconductor device fabrication method and devices are disclosed. A device may be fabricated by forming in a semiconductor layer; filling the trench with an insulating material; removing selected... |
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RE45449 |
Power semiconductor having a lightly doped drift and buffer layer
A power semiconductor element having a lightly doped drift and buffer layer is disclosed. One embodiment has, underneath and between deep well regions of a first conductivity type, a lightly doped... |
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8994123 |
Variation resistant metal-oxide-semiconductor field effect transistor (MOSFET)
Variation resistant metal-oxide-semiconductor field effect transistors (MOSFETs) are manufactured using a high-K, metal-gate ‘channel-last’ process. A cavity is formed between spacers formed over... |
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8994023 |
Thin film transistor array substrate and method of fabricating the same
A thin film transistor array substrate capable of reducing degradation of a device due to degradation of an oxide semiconductor pattern and a method of fabricating the same are provided. The thin... |
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8994143 |
Semiconductor device with SEG film active region
A semiconductor device and a method for manufacturing the same are provided. A barrier film is formed in a device separating structure, and the device separating structure is etched at a... |
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8994101 |
Shielded gate trench MOS with improved source pickup layout
A method for fabricating a semiconductor device includes forming a plurality of trenches using a first mask. The trenches include source pickup trenches located in outside a termination area and... |
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8994100 |
Semiconductor device including source and drain offset regions
The present invention provides a semiconductor device designed to prevent an electric field from being concentrated in the vicinity of a groove portion. The semiconductor includes a semiconductor... |
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8994112 |
Fin field effect transistor (finFET)
A Fin FET whose fin (12) has an upper portion (30) doped with a first conductivity type and a lower portion (32) doped with a second conductivity type, wherein the junction (34) between the upper... |