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9040841 |
Axiocentric scrubbing land grid array contacts and methods for fabrication
A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier... |
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9031684 |
Multi-factor advanced process control method and system for integrated circuit fabrication
A method and system for integrated circuit fabrication is disclosed. In an example, the method includes determining a first process parameter of a wafer and a second process parameter of the... |
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9001031 |
Complex passive design with special via implementation
This disclosure provides systems, methods and apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first... |
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8999179 |
Conductive vias in a substrate
A method of forming a conductive via in a substrate includes forming a via hole covered by a dielectric layer followed by an annealing process. The dielectric layer can getter the mobile ions from... |
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8986555 |
Method of manufacturing printed circuit board having bump
A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to... |
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8970242 |
Method for manufacturing probe card, probe card, method for manufacturing semiconductor device, and method for forming probe
Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality... |
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8946903 |
Electrically conductive laminate structure containing graphene region
Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the... |
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8884516 |
Traveling wave electron device with membrane-supported slow wave circuit
A traveling wave device includes a slow wave circuit supported by a dielectric membrane. The dielectric membrane can have a thickness substantially smaller than a wavelength of operation of the... |
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8858808 |
Method of thin printed circuit board wet process consistency on the same carrier
A method of thin printed circuit board wet process consistency on the same carrier, and more particularly to a printed circuit board in the developing, copper plating, stripping, etching and other... |
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8846537 |
Method for forming fine pitch structures
A mold having an open interior volume is used to define patterns. The mold has a ceiling, floor and sidewalls that define the interior volume and inhibit deposition. One end of the mold is open... |
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8828152 |
Passivated metal core substrate and process for preparing the same
A substrate includes an iron-nickel alloy core or a cobalt-nickel ferrous alloy core, a chromium conversion coating on at least a portion of the core, and an insulating coating on the chromium... |
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8786792 |
Mother substrate for liquid crystal display device and method of fabricating the same
A mother substrate for a liquid crystal display device includes: a substrate; a plurality of unit array patterns on the substrate, each of the plurality of unit array patterns including a gate... |
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8778194 |
Component having a through-connection
A method is described for manufacturing a component having a through-connection. The method includes providing a substrate; forming a trench structure in the substrate, a substrate area which is... |
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8779598 |
Method and apparatuses for integrated circuit substrate manufacture
Embodiments described herein provide a method of manufacturing integrated circuit (IC) devices. The method includes coupling a first surface of a first intermediate substrate to a first surface of... |
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8756804 |
Method of manufacturing printed circuit board
Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a... |
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8734656 |
Capacitor forming methods
A capacitor forming method includes forming an electrically conductive support material over a substrate, forming an opening through at least the support material to the substrate, and, after... |
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8734657 |
Liquid barrier and method for making a liquid barrier
A method for making a liquid barrier includes forming a liquid barrier layer on a substrate, forming a mask layer on the liquid barrier layer such that part of the liquid barrier remains exposed,... |
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8721901 |
Methods of processing substrates and methods of forming conductive connections to substrates
Embodiments disclosed include methods of processing substrates, including methods of forming conductive connections to substrates. In one embodiment, a method of processing a substrate includes... |
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8696921 |
Method of manufacturing a semiconductor device
In a method of manufacturing a semiconductor device, a substrate is loaded to a process chamber having, unit process sections in which unit processes are performed, respectively. The unit... |
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8641914 |
Methods of improving long range order in self-assembly of block copolymer films with ionic liquids
Methods for fabricating arrays of nanoscaled alternating lamellae or cylinders in a polymer matrix having improved long range order utilizing self-assembling block copolymers, and films and... |
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8574444 |
Fabricating method for multilayer printed circuit board
A method of fabricating a multilayer printed circuit board includes forming a first circuit-forming pattern and a via-forming pattern on a first carrier, and forming a first insulation layer;... |
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8562847 |
Thin film support substrate for use in hydrogen production filter and production method of hydrogen production filter
In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a... |
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8535547 |
Printed circuit board manufacturing system and manufacturing method thereof
A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a... |
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8535546 |
Method of manufacturing multilayer wiring substrate
In order to provide a method of manufacturing a multilayer wiring substrate, a base member having a copper foil separably laminated thereon is prepared, and a solder resist layer is formed on the... |
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8506826 |
Method of manufacturing a switch system
A method for manufacturing a micro electro-mechanical system (MEMS) switch system (600, 700) includes etching each of a plurality of base circuit layers (425) and a plurality of passive component... |
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8501021 |
Process and system for quality management and analysis of via drilling
A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in... |
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8476167 |
Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus
The invention relates to a method of manufacturing an electrostatic clamp configured to electrostatically clamp an article to an article support in a lithographic apparatus. The method includes... |
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8465657 |
Post chemical mechanical polishing etch for improved time dependent dielectric breakdown reliability
Disclosed are a damascene and dual damascene processes both of which incorporate the use of a release layer to remove trace amounts of residual material between metal interconnect lines. The... |
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8454845 |
High speed interconnect and method of manufacture
Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up... |
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8398868 |
Directed self-assembly of block copolymers using segmented prepatterns
An opening in a substrate is formed, e.g., using optical lithography, with the opening having sidewalls whose cross section is given by segments that are contoured and convex. The cross section of... |
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8400781 |
Using interrupted through-silicon-vias in integrated circuits adapted for stacking
In an integrated circuit (IC) adapted for use in a stack of interconnected ICs, interrupted through-silicon-vias (TSVs) are provided in addition to uninterrupted TSVs. The interrupted TSVs provide... |
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8377317 |
Method for manufacturing printed circuit board with thick traces
A method for manufacturing printed circuit board includes steps below. A first electrically conductive layer including a first surface and a second surface at an opposite side thereof to the first... |
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8357570 |
Pixel structure and method for fabricating the same
A method for fabricating a pixel structure includes providing a substrate having a pixel area. A first metal layer, a gate insulator and a semiconductor layer are formed on the substrate and... |
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8334187 |
Hard mask for thin film resistor manufacture
Methods of fabricating an integrated circuit device, such as a thin film resistor, are disclosed. An exemplary method includes providing a semiconductor substrate; forming a resistive layer over... |
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8308963 |
Etchant for etching metal wiring layers and method for forming thin film transistor by using the same
The present invention discloses an etchant for etching at least two different metal layers, the etchant comprising hydrogen peroxide (H2O2) and one of carboxylic acid, carboxylate salt, and acetyl... |
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8294034 |
Circuit board and process for fabricating the same
A circuit board including a circuit substrate, a first dielectric layer, an antagonistic activation layer, a first conductive layer, a second conductive layer and a second dielectric layer is... |
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8282846 |
Metal interconnect structure with a side wall spacer that protects an ARC layer and a bond pad from corrosion and method of forming the metal interconnect structure
A metal interconnect structure, which includes a bond pad, an overlying anti-reflective coating layer, an overlying passivation layer, and an opening that exposes a top surface of the bond pad,... |
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8277668 |
Methods of preparing printed circuit boards and packaging substrates of integrated circuit
A method of forming printed circuit boards and packaging substrates. After blind vias are created in a dielectric layer, a first seed layer is provided in the vias and on the dielectric layer.... |
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8273256 |
Method for manufacturing wiring structure of wiring board
A method for manufacturing a wiring structure of a wiring board is provided. In the method, a substrate including an insulation layer and a film disposed on the insulation layer is provided. Next,... |
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8262917 |
Fabricating method for multilayer printed circuit board
A fabrication method for a multilayer printed circuit board includes: forming a first circuit-forming pattern and a first insulation layer, into which the first circuit-forming pattern is... |
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8252683 |
3D interconnection structure and method of manufacturing the same
Provided are a three-dimensional (3D) interconnection structure and a method of manufacturing the same. The 3D interconnection structure includes a wafer that has one side of an inverted V-shape... |
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8226835 |
Ultra-thin film formation using gas cluster ion beam processing
A method of preparing a thin film on a substrate is described. The method comprises forming an ultra-thin hermetic film over a portion of a substrate using a gas cluster ion beam (GCIB), wherein... |
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8220149 |
Method of manufacturing a printed circuit board
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include a first insulation layer, a second insulation layer stacked... |
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8207496 |
Multi-needle multi-parallel nanospray ionization source for mass spectrometry
An electrospray ion source for a mass spectrometer includes an electrode comprising at least a first plurality of protrusions protruding from a base, each protrusion of the at least a first... |
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8197702 |
Manufacturing method of printed circuit board
Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on... |
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8173033 |
Manufacturing method of a nano filter structure for breathing
In a nano filter structure for breathing and a manufacturing method of the nano filter structure, a semiconductor process technology is used for manufacturing a nano filter structure comprising a... |
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8166635 |
Manufacturing method of electrode, electric storage device, and intermediate laminate member
In a current collector laminating step, a current-collector laminate unit 30 composed of current-collector materials 31 and 32 and a film material 33 is formed. Resist layers 34 having a... |
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8156645 |
Method of manufacturing a multilayer printed wiring board with copper wrap plated hole
Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to... |
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8158521 |
Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties
A method of lowering the dielectric constant of an organosilicon low k dielectric layer while improving the hardness and thermal stability is provided. A deposited layer of carbon doped oxide,... |
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8128993 |
Anisotropic nanotube fabric layers and films and methods of forming same
Methods for forming anisotropic nanotube fabrics are disclosed. In one aspect, a nanotube application solution is rendered into a nematic state prior to its application over a substrate. In... |