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9040842 |
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced... |
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9040837 |
Wiring board and method for manufacturing the same
A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such... |
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9040841 |
Axiocentric scrubbing land grid array contacts and methods for fabrication
A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier... |
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9035195 |
Circuit board having tie bar buried therein and method of fabricating the same
Provided is a circuit board having a tie bar buried therein. The circuit board includes a dielectric stack, at least a first tie bar, at least a first gold finger and at least a first microvia.... |
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9035189 |
Circuit board with flexible region and method for production thereof
A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at... |
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9035196 |
Circuit board and method of manufacturing the same
Disclosed herein is a circuit board including: a core layer including a via hole; a metal film covering an inner wall of the via hole; a circuit pattern connected to the metal film on the core... |
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9036364 |
Circuit board with signal layers of different dimensions to communicate signals of different frequencies
Electronic devices to output signals at different frequencies are mounted to a circuit board that has a group of layers, where the group of layers include reference plane layers and signal layers... |
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9035193 |
Connecting member of electrical circuit
A connecting member such as a terminal base is used in connection with a printed circuit board unit in which circuit elements such as a power module are mounted on a printed circuit board. The... |
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9029712 |
Printed circuit board and method of manufacturing the same
Read wiring traces and write wiring traces are formed on an insulating layer that is formed on a support substrate. Connection terminals that are electrically connectable to external circuits are... |
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9030836 |
Apparatus capable of selectively using different types of connectors
An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector... |
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9029713 |
Printed wiring board and method for manufacturing the same
A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors... |
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9027238 |
Multilayered printed circuit board and method for manufacturing the same
A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a... |
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9018535 |
Touch panel and method for manufacturing a touch sensor layer of the touch panel
A touch panel includes a touch sensor layer including a first transparent electrode and a second transparent electrode, wherein an arrangement direction of the first transparent electrode can be... |
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9012789 |
Stackable via package and method
An electronic component assembly and a method for making an electronic component assembly. A non-limiting example electronic component assembly may, for example, comprise a lower component... |
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9013894 |
Printed circuit board and method for manufacturing the same
A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion... |
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9012788 |
Optronic window transparent to IR and reflecting RF
An optronic porthole comprises a substrate with two faces. It comprises on one of the faces of the substrate or on both faces, a stack of several hetero-structures, each hetero-structure being... |
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9012785 |
Flexible multilayer substrate
A flexible multilayer substrate includes a multilayer body including a plurality of laminated resin layers. The multilayer body includes an innermost surface, which is a surface on an inner side... |
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9012787 |
Electronic system for wave soldering
An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for... |
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9006586 |
Wiring substrate, its manufacturing method, and semiconductor device
One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of... |
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9004937 |
Surface mount/through-hole crimp piercing zipcord connector
A through-the-hole (TTH)/surface mount (SMT) insulation piercing connector includes one or two spaced electrical contacts. Each contact has a flat plate portion and integrally-formed legs. An... |
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9000306 |
Interconnect board and electronic apparatus
An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that... |
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8997341 |
Substrate for mounting semiconductor chip and method for producing same
It is an object of the invention to provide a method for producing a substrate for mounting a semiconductor chip, that can reduce bridging and allows excellent wire bondability and solder... |
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8999537 |
Battery pack
A battery pack configured to prevent excess solder material from flowing down onto a protective circuit module (PCM) is disclosed. According to some aspects, the battery pack includes at least one... |
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9000307 |
Structure, circuit board, and circuit board manufacturing method
The disclosed structure (10) is provided with: at least three conductors (111, 131, 151) which face one-another; a through-via (101) which passes through each of the conductors (111, 131, 151);... |
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9001521 |
Substrate assembly provided with capacitive interconnections, and manufacturing method thereof
An assembly including: a first substrate having a first surface and housing a first electrical-interconnection element and a second electrical-interconnection element in a position corresponding... |
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8993896 |
Lead electrode and preparation method thereof
A lead electrode and a preparation method thereof are provided. The lead electrode includes an inner terminal, a lead, and an outer terminal, which are sequentially connected. The lead includes:... |
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8987608 |
Circuit structure and manufacturing method thereof
A circuit structure includes an inner circuit layer, a first and a second dielectric layers, a first and a second conductive material layers, and a second and a third conductive layers. The first... |
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8981236 |
Printed circuit board
A printed circuit board includes a line intensive distribution area, a line sparse distribution area, a solder mask layer, and a signal layer. A first signal line is laid on the signal layer. The... |
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8982576 |
Printed wiring board, and method of supplying power and forming wiring for printed wiring board
Provided is a printed wiring board including a power source, a plurality of LSIs, and a planar power supply wiring for supplying power from the power source to the LSIs. A plurality of partial... |
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8975531 |
Composite copper wire interconnect structures and methods of forming
Various embodiments include interconnect structures and methods of forming such structures. The interconnect structures can include a composite copper wire which includes at least two distinct... |
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8973261 |
Manufacturing method of object having conductive line
A manufacturing method of an object having a conductive line includes the following steps. A hardening layer and a conductive line layer are formed in an in-mold roller (IMR) material in sequence.... |
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8975528 |
Electronic device, wiring substrate, and method for manufacturing electronic device
Even in an electronic device where electrodes are coupled electrically using a solder, sections to which electrodes of an electronic component are coupled are switched by a method other than... |
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8969736 |
Printed circuit board and method of manufacturing the same
A cover insulating layer is formed on a base insulating layer. One of write wiring traces includes first to third lines, and the other write wiring trace includes fourth to sixth lines. The one... |
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8969735 |
Flexible metal interconnect structure
A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated... |
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8969732 |
Printed wiring board
A printed wiring board includes a core insulation layer having via conductors through the core layer, a first structure including an interlayer insulation layer on first surface of the core layer... |
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8969730 |
Printed circuit solder connections
Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have... |
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8964409 |
Electronic module with EMI protection
An electronic module with EMI protection is disclosed. The electronic module comprises a component (1) with contact terminals (2) and conducting lines (4) in a first wiring layer (3). There is... |
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8963014 |
Touch panel and display device including the same
The present invention relates to a touch panel, comprising: a screen part comprising a first conductive pattern portion, and a router part comprising a second conductive pattern portion, in which... |
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8959760 |
Printed wiring board and method for manufacturing same
A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming... |
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8957322 |
Conductive films having low-visibility patterns and methods of producing the same
A patterned transparent conductor including a conductive layer coated on a substrate is described. More specifically, the transparent conductor has low-visibility patterns. |
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8957323 |
Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the same
An electrical connecting element, a method of fabricating the same, and an electrical connecting structure comprising the same are disclosed. The method of fabricating the electrical connecting... |
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8957320 |
Printed wiring board
A printed wiring board includes a substrate having an accommodation section having multiple opening portions, multiple electronic components accommodated in the opening portions, respectively, a... |
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8952266 |
Structural body and interconnect substrate
A structural body includes: a first conductor and a second conductor of which at least portions are opposite to each other; a third conductor, interposed between the first conductor and the second... |
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8952258 |
Implementing graphene interconnect for high conductivity applications
A method, and structures for implementing enhanced interconnects for high conductivity applications. An interconnect structure includes an electrically conductive interconnect member having a... |
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8952263 |
Micro-wire electrode pattern
A micro-wire electrode includes a substrate and an anisotropically conductive electrode extending in a length direction formed over the substrate. The electrode includes a plurality of... |
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8952269 |
Wiring substrate, multi-piece wiring substrate array, and manufacturing method therefor
Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main... |
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8953336 |
Surface metal wiring structure for an IC substrate
A surface metal wiring structure for a substrate includes one or more functional μbumps formed of a first metal and an electrical test pad formed of a second metal for receiving an electrical test... |
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8946892 |
Semiconductor package
A semiconductor package includes a package substrate including a first wiring embedded in the package substrate, a second wiring embedded in the package substrate, the second wiring electrically... |
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8941016 |
Laminated wiring board and manufacturing method for same
A laminated wiring board, includes: a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the... |
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8937255 |
Superconductive multi-chip module for high speed digital circuits
A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting... |