Matches 1 - 6 out of 6


Match Document Document Title
US20100330332 COVER FOR MICROSYSTEMS AND METHOD FOR PRODUCING A COVER  
The cover according to the invention serves to encapsulate microsystems, wherein the cover comprises or is made of one or more cover units, and at least one cover unit comprises at least one first...
US20130243663 DIRECT SEALING OF GLASS MICROSTRUCTURES  
Embodiments of methods for sealing a glass microstructure assembly comprise providing one or more side retainer members on a base plate adjacent the glass microstructure assembly, the side...
US20150194627 GLASS PACKAGING STRUCTURE AND GLASS PACKAGING METHOD OF UTILIZING THE SAME  
The present invention provides a glass packaging structure, comprising an active glass substrate and a packaging glass substrate. An active area is formed upon the active glass substrate. Glass...
US20060042316 Method of manufacturing hermetically sealed container and image display apparatus  
In a method of manufacturing a hermetically sealed container with a pair of substrates caused to undergo joining in an atmosphere of reduced pressure, one side of one substrate is introduced into...
US20150101841 HERMETIC CONDUCTIVE FEEDTHROUGHS FOR A SEMICONDUCTOR WAFER  
A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal...
US20150208539 METHOD FOR PRODUCING A HERMETIC HOUSING FOR AN ELECTRONIC DEVICE  
A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the...
Matches 1 - 6 out of 6