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US20150255303 HARD MASK REMOVAL SCHEME  
A method for hard mask layer removal includes dispensing a chemical on a hard mask layer, in which the chemical includes an acidic chemical. The chemical is drained from a chamber after hard mask...
US20140187051 Poly Removal for replacement gate with an APM mixture  
A method for removing poly-silicon dummy gate structures using an ammonium hydroxide-hydrogen peroxide-water (APM) solution with concentrations between 1:10:20 and 1:1:2 and at temperatures...
US20150018261 POST CHEMICAL-MECHANICAL-POLISHING (POST-CMP) CLEANING COMPOSITION COMPRISING A SPECIFIC SULFUR-CONTAINING COMPOUND AND A SUGAR ALCOHOL OR A POLYCARBOXYLIC ACID  
A post chemical-mechanical-polishing (post-CMP) cleaning composition comprising: (A) at least one compound comprising at least one thiol (—SH), thioether (—SR1) or thiocarbonyl (>C═S) group,...
US20140318584 FORMULATIONS FOR THE REMOVAL OF PARTICLES GENERATED BY CERIUM-CONTAINING SOLUTIONS  
Compositions and methods for removing lanthanoid-containing solids and/or species from the surface of a microelectronic device or microelectronic device fabrication hardware. Preferably, the...
US20120021961 COMPOSITION FOR POST CHEMICAL-MECHANICAL POLISHING CLEANING  
The present invention relates to a composition for post chemical-mechanical polishing (CMP) cleaning. The composition is alkaline, which can remove azole-type corrosion inhibitors on the wafer...
US20120094887 METHOD FOR SUPPLYING HYDROXYL RADICAL-CONTAINING WATER AND APPARATUS FOR SUPPLYING HYDROXYL RADICAL-CONTAINING WATER  
Disclosed is a method for supplying hydroxyl radical-containing water, which is highly convenient and with which water containing a relatively high concentration of hydroxyl radicals can be...
US20110160112 CLEANING COMPOSITION  
A cleaning composition including a polyamino carboxylic salt, an acid and water is provided. The content of the polyamino carboxylic salt is 0.01 wt % to 0.5 wt %. The content of the acid is 0.01...
US20080000502 COMPOSITIONS FOR CLEANING A PROBE CARD AND METHODS OF CLEANING A PROBE CARD USING THE SAME  
A composition for cleaning a probe card that may be a part of a semiconductor probe system and a method of cleaning the probe card using the composition is provided. In one embodiment, the...
US20140271917 CONTROLLED AND PREDICTABLE 2-PATH-WAY DECOMPOSITION OF THERMODYNAMICALLY DOUBLE UNSTABLE OXIDISING AGENTS  
Disclosed herein is a method comprising: obtaining characteristics of a cleaning or disinfection application; querying a database comprising experimental relationships, theoretical relationships...
US20090004608 Detergent For Lithography And Method Of Forming Resist Pattern With The Same  
Conventional detergents for lithography which contain a surfactant as an active ingredient should have a reduced surfactant concentration because heightened surfactant concentrations result in...
US20110061736 PHOTOVOLTAIC BACK CONTACT  
A method to preparing Cadmium telluride surface before forming metal back contact is disclosed. The method can include removing carbon from Cadmium telluride surface.
US20120167916 NEUTRALIZING/REDUCING AGENT, AND DESMEAR METHOD  
Disclosed is a neutralizing/reducing agent for neutralizing/reducing an oxidizing agent component that is adsorbed and remains on an object to be coated after the object is subjected to a desmear...
US20100029531 Nonflammable compositions comprising fluorinated compounds and use of these compositions  
The invention relates to non-flammable compositions comprising fluorinated compounds selected from the group consisting of hydrofluoroalkanes, hydrofluoroalkenes, partially or perfluorinated...
US20120172273 WAFER WASHING WATER AND WAFER WASHING METHOD  
The invention provides a wafer washing technique which does not require complicated operations and by which a wafer is washed with ultrapure water through relatively simple operations without...
US20110195887 AQUEOUS ACIDIC FORMULATIONS FOR COPPER OXIDE ETCH RESIDUE REMOVAL AND PREVENTION OF COPPER ELECTRODEPOSITION  
A highly aqueous acidic cleaning composition for copper oxide etch removal from Cu-dual damascene microelectronic structures and wherein that composition prevents or substantially eliminates...
US20140243250 POLISHING SLURRY FOR COBALT REMOVAL  
Provided herein are polishing compositions for removal of Co, for example, selectively over Cu, and methods of their use. A polishing composition comprising an abrasive and one or more Co...
US20060135386 Chemical composition for a fire retardant textile  
The present invention relates to methods and chemical compositions utilizing NPB (n-propyl bromide) also called 1-bromopropane or propyl bromide or 1-BP or N-Bromopropane as non-aqueous carrier...
US20130171829 Titanium-Nitride Removal  
A chemical solution that removes undesired metal hard mask yet remains selective to the device wiring metallurgy and dielectric materials. The present invention decreases aspect ratio by selective...
US20130130961 INHIBITING CORROSION AND SCALING OF SURFACES CONTACTED BY SULFUR-CONTAINING MATERIALS  
A method of treatment for inhibiting sulfur-based corrosion or scaling or for removing scaling from a surface including inhibiting corrosion caused by sulfur-containing materials, reducing...
US20130004435 AZEOTROPE-LIKE COMPOSITIONS COMPRISING 1-CHLORO-3,3,3-TRIFLUOROPROPENE  
The present invention relates, in part, to ternary azeotropic compositions and mixtures including chlorotrifluoropropene, methanol, and a third component selected from isohexane,...
US20070191243 REMOVAL OF SILICA BASED ETCH RESIDUE USING AQUEOUS CHEMISTRY  
Removal of silica-based etch residue is effected by use of an aqueous chemistry which eliminates hazard concerns in connection with electronic component fabrication tooling. The system employs a...
US20120244705 POST-TUNGSTEN CMP CLEANING SOLUTION AND METHOD OF USING THE SAME  
A post-W CMP cleaning solution consists of carboxylic acid and deionized water. The carboxylic acid may be selected from the group consisting of (1) monocarboxylic acids; (2) dicarboxylic acids;...
US20140243249 METAL STRIPPING ADDITIVE, COMPOSITION CONTAINING THE SAME, AND METHOD FOR STRIPPING METAL BY USING THE COMPOSITION  
The present invention provides a metal stripping additive, composition containing the same, and method for stripping metal by using the composition. The metal stripping additive comprises a...
US20080234162 SEMICONDUCTOR ETCH RESIDUE REMOVER AND CLEANSING COMPOSITIONS  
An aqueous and semi-aqueous formulation useful for removing post etch and ash residue from Cu low K dielectric semiconductor devices. The composition comprises a polycarboxylic acid buffering...
US20070225188 Remover solution composition and use thereof  
The invention provides a remover solution composition, comprising: (A) 0˜25% by weight of an alkaline compound;(B) 0.1˜20% by weight of an alcohol amine compound;(C) 0.5˜20% by weight of a...
US20130296215 WATER-RICH STRIPPING AND CLEANING FORMULATION AND METHOD FOR USING SAME  
The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line...
US20110212866 WATER-RICH STRIPPING AND CLEANING FORMULATION AND METHOD FOR USING SAME  
The present invention relates to water-rich formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, residues from Al back-end-of-the-line...
US20090301996 FORMULATIONS FOR REMOVING COOPER-CONTAINING POST-ETCH RESIDUE FROM MICROELECTRONIC DEVICES  
A method and composition for removing copper-containing post-etch and/or post-ash residue from patterned microelectronic devices is described. The removal composition includes a diluent, a solvent...
US20110253171 Chemical Composition and Methods for Removing Epoxy-Based Photoimageable Coatings Utilized In Microelectronic Fabrication  
The present invention is a chemical composition to remove epoxy-based photoimageable coatings that include a solvent system to dissolve and rinse away the coating, an acidic additive that...
US20070093400 DISHWASHING COMPOSITION  
This invention is related to a process for the controlled release into a cleaning environment of an active ingredient of a detergent or detergent additive composition wherein the cleaning...
US20120187336 CONDITIONING COMPOSITIONS FOR SOLAR CELLS  
Method of using improved compositions for conditioning silicon surfaces during the manufacture of photovoltaic devices. Used for removing particles, organic contamination, and unwanted metals from...
US20150136728 CLEANING COMPOSITION AND METHOD OF MANUFACTURING METAL WIRING USING THE SAME  
A cleaning composition includes about 0.01 to about 5 wt % of a chelating agent; about 0.01 to about 0.5 wt % of an organic acid; about 0.01 to about 1.0 wt % of an inorganic acid; about 0.01 to...
US20060172906 Aqueous based residue removers comprising fluoride  
A composition and method comprising same for selectively removing residues such as, for example, ashed photoresist and/or processing residues are disclosed herein. In one aspect, there is provided...
US20110212865 Gluconic acid containing photoresist cleaning composition for multi-metal device processing  
A microelectronic photoresist cleaning composition suitable for cleaning multi-metal microelectronic devices and to do so without any substantial or significant galvanic corrosion occurring when...
US20090068844 Etching Process  
Mixtures of fluorine and inert gases like nitrogen and/or argon can be used for etching of semiconductors, solar panels and flat panels (TFTs and LCDs), and for cleaning of semiconductor surfaces...
US20050065050 Selective silicon etch chemistries, methods of production and uses thereof  
Silicon etchants described herein are aqueous solutions that comprise at least one of potassium hydroxide or tetramethyl ammonium hydroxide; at least one additive, wherein the additive comprises...
US20080311752 Pore Sealing and Cleaning Porous Low Dielectric Constant Structures  
A micellar solution is used to seal pores exposed at the bottom and sidewall surfaces of a structure etched in or through a porous low dielectric constant material. The micellar solution is also...
US20050079984 Method for stripping cured paint from plastic, steel, aluminum, brass, magnesium and non-ferrous substrates with surfactants low in volatile organic compounds  
A method of stripping cured paint comprising: a) adding a stripping composition to a strip tank, said stripping composition consists of a mixture of, surfactants selected from the group...
US20080287332 Method for Removing Etch Residue and Chemistry Therefor  
A method for cleaning, especially by removing etch residue (e.g., polymers or particles) from a semiconductor structure, and a cleaning chemistry is described. The method of cleaning includes...
US20070254822 Method for Producing Quaternary Ammonium Compounds  
The present invention relates to a process for preparing quaternary ammonium compounds, which comprises reacting compounds comprising an sp3-hybridized nitrogen atom with a dialkyl sulfate or...
US20060014656 Composition for stripping and cleaning and use thereof  
A composition comprising one or more water soluble organic solvents comprising a glycol ether; water; a fluoride containing compound provided that if the fluoride containing compound is ammonium...
US20060189496 Method for stripping cured paint with synthetic surfactants low in volatile organic compounds  
A method of stripping cured paint from plastic, aluminum, brass, magnesium, galvanized steel, zinc die cast, and non-ferrous metal substrates, said method comprising: a) adding a stripping...
US20060046944 Composition for removing a photoresist residue and polymer residue, and residue removal process using same  
A composition for removing a photoresist residue and polymer residue to remove a photoresist residue and an ashing residue remaining after dry etching and after ashing of a semiconductor substrate...
US20090084406 Composition for stripping and stripping method  
The present invention provides a stripping composition and a stripping method capable of easily stripping a color resist or an organic insulating film formed on a substrate to reuse the substrate...
US20070232511 Cleaning solutions including preservative compounds for post CMP cleaning processes  
Post CMP cleaning solutions are provided including at least one cleaning agent comprising an organic acid compound, at least one preservative compound that substantially minimizes or prevents...
US20070072782 Unsaturated dicarboxylic acid and ethylene urea containing formulation for cleaning semiconductor and cleaning method  
A semiconductor wafer cleaning formulation comprising an unsaturated dicarboxylic acid and ethylene urea, and a cleaning method are provided. The formulation comprises an unsaturated dicarboxylic...
US20070219105 Ionic Additives to Solvent-Based Strippers  
In a removal solution for removing a residue from a substrate, a first interfacial tension exists between the residue and the substrate. The solution includes a polar solvent and an ionic salt....
US20060166846 Remover solution  
A cleaning (stripping) solution comprises a mixture of a first compound, a second compound and water. The cleaning solution can effectively remove metal oxides without damaging the surface of the...
US20140113818 SOPHOROLACTONE COMPOSITIONS AND USES THEREOF  
The present invention relates to a surfactant composition, consisting of 70 wt %-99.9 wt % sophorolactone, 0-1 wt % sophorolipid acid, less than 0.1% residual substrate, and remainder water. The...
US20070219103 Novel rinse solution to remove cross-contamination  
A composition for rinsing a substrate including deionized water, one or more carboxylate acid containing compounds, one or more surfactants, and one or more corrosion inhibitors and a method of...

Matches 1 - 50 out of 348 1 2 3 4 5 6 7 >