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US20160023322 |
POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN
Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove... |
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US20150004889 |
COATED ABRASIVE ARTICLE BASED ON A SUNFLOWER PATTERN
An abrasive article having a plurality of abrasive areas arranged in a non-uniform distribution pattern, wherein the pattern is spiral or phyllotactic, such as a spiral lattice, and in particular... |
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US20070175104 |
Polishing slurry for silicon oxide, additive liquid and polishing method
The polishing slurry of the invention is a polishing slurry for polishing a silicon oxide film on polysilicon, which contains an abrasive, polysilicon polishing inhibitor, and water. As the... |
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US20150174726 |
POLISHING PAD, COMPOSITION FOR THE MANUFACTURE THEREOF, AND METHOD OF MAKING AND USING
A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a... |
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US20130125473 |
POLYURETHANE COMPOSITION FOR CMP PADS AND METHOD OF MANUFACTURING SAME
Polyurethane composition based on a certain polyether and polyester prepolymer reaction mixture, wherein the composition is utilized in manufacturing chemical mechanical polishing/planarizing... |
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US20110209412 |
METHOD OF MAKING POLISHING PAD ASSEMBLY WITH GLASS OR CRYSTALLINE WINDOW
Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first... |
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US20090151267 |
Multifunction abrasive tool with hybrid bond
Abrasive tools and techniques are disclosed that can cut hard, brittle materials to relatively precise dimensions. The tools, which can include a hybrid bond of metal or metal alloy and a resin... |
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US20090035519 |
ABRASIVE ARTICLE WITH ANTI-SLIP POLYMERIC LAYER
An abrasive article includes a backing having first and second major surfaces, an abrasive layer overlying the first major surface, and a polymeric layer overlying the second major surface. The... |
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US20050097824 |
Backing and abrasive product made with the backing and method of making and using the backing and abrasive product
The invention provides a backing for an abrasive article comprising a sheet-like polymeric substrate having a first major surface including a pattern of non-abrasive raised areas and depressed... |
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US20050076577 |
Abrasive tools made with a self-avoiding abrasive grain array
Abrasive tools contain abrasive grains oriented in an array according to a non-uniform pattern having an exclusionary zone around each abrasive grain, and the exclusionary zone has a minimum... |
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US20050060941 |
Abrasive article and methods of making the same
An abrasive article and methods of making the same are disclosed. The abrasive article includes a backing and an array of features on the backing. Each feature includes a base and a body. The body... |
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US20150266162 |
ABRASIVE ARTICLE WITH ADHESION PROMOTING LAYER
An abrasive article includes a backing having first and second major surfaces, an abrasive layer overlying the first major surface, and a polymeric layer overlying the second major surface. The... |
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US20110171890 |
POLISHING PAD AND METHOD FOR MANUFACTURING THE POLISHING PAD
A polishing pad is disclosed which is less likely to cause scratches, and has an excellent planarization performance and polishing stability. In one aspect, the invention provides a polishing pad... |
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US20070169421 |
CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive
The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl... |
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US20070017160 |
Composite materials and method for making same
Certain non-limiting embodiments of the present disclosure comprise a family of composite materials targeting specific applications through a materials design approach involving; 1) a hard... |
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US20050126080 |
Semiconductor polishing compound, process for its production and polishing method
A semiconductor polishing compound comprising cerium oxide abrasive grains, water and an additive, wherein the additive is a water-soluble organic polymer such as ammonium polyacrylate or an... |
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US20150174735 |
HIGH POROSITY ABRASIVE ARTICLES AND METHODS OF MANUFACTURING SAME
An abrasive article includes a polymer matrix and abrasive grains dispersed in the polymer matrix, wherein the abrasive article has a void volume of at least 50%. The polymer matrix is polymerized... |
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US20090056231 |
Copper CMP composition containing ionic polyelectrolyte and method
The CMP compositions of the invention comprise not more than about 1 percent by weight of a particulate abrasive, a polyelectrolyte, which preferably has a weight average molecular weight of at... |
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US20060229000 |
Polishing pad
A polishing pad for planarizing the surface of a wafer has a planar main body of a non-foamed synthetic resin, having Shore D hardness of 66.0-78.5, preferably 70.0-78.5, or more preferably... |
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US20060049143 |
Polishing composition and polishing method using the same
A polishing composition includes an abrasive, at least one compound of azoles and derivatives thereof, and water. The polishing composition is used in applications for polishing surfaces of... |
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US20090242125 |
Carrier Head Membrane
A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is... |
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US20080200033 |
POLISHING COMPOUND, METHOD FOR POLISHING SURFACE TO BE POLISHED, AND PROCESS FOR PRODUCING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
To provide a polishing compound which is capable of polishing SiC at a high removal rate, or capable of suppressing polishing of silicon dioxide in an insulating layer on the other hand, while... |
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US20080053001 |
Polishing Composition and Polishing Method
In a polishing composition, the concentration of one of either sodium ions or acetate ions is 10 ppb or less, or the concentrations of sodium ions and acetate ions are 10 ppb or less. The... |
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US20100242374 |
Polishing Composition and Polishing Method
In a polishing composition, the concentration of one of either sodium ions or acetate ions is 10 ppb or less, or the concentrations of sodium ions and acetate ions are 10 ppb or less. The... |
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US20080102735 |
Concentrated abrasive slurry compositions, methods of production, and methods of use thereof
Concentrated slurry compositions for use in loose-abrasive machining processes, particularly concentrated abrasive slurries for use in wire saw processes. These concentrated slurry compositions... |
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US20060242910 |
Abrasive article having reaction activated chromophore
An abrasive article has a layer including an epoxy constituent, a cationic photointiator within the epoxy constituent, and a latent colorant configured to change color in response to activation of... |
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US20090000208 |
Composite Material
A composite material comprises a plurality of cores of material selected from the group comprising carbides, nitrides, carbonitrides, cemented carbides, cemented nitrides, cemented carbonitrides... |
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US20130237136 |
POLISHING PAD COMPRISING TRANSMISSIVE REGION
The invention provides a polishing pad comprising an optically transmissive region, wherein the polishing pad comprises a polishing pad body comprising an opaque first region and an optically... |
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US20080155903 |
Composite Polishing Pad
A polishing pad having an optically clear bottom layer and a closed cell top layer where the interface between the top and bottom layers is only a urethane to urethane interface. Grooves may be... |
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US20070093183 |
CERIUM OXIDE SLURRY, CERIUM OXIDE POLISHING SLURRY AND METHOD FOR POLISHING SUBSTRATE USING THE SAME
The present invention provides a cerium oxide slurry, a cerium oxide polishing slurry, and a method of polishing a substrate by using the same, wherein decrease of scratches and polish at high... |
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US20120083187 |
POLYURETHANE, COMPOSITION FOR FORMATION OF POLISHING LAYERS THAT CONTAINS SAME, PAD FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME
A polyurethane is produced by reacting a mixture including at least (A) a diisocyanate, (B) a polyol, and (C) a chain extender, the polyol (B) having the number average molecular weight of 400 to... |
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US20060162260 |
Cerium oxide abrasive and slurry containing the same
Disclosed are a cerium oxide abrasive for selectively polishing various SiO2 films and SiO2—Si3N4 films; and a slurry containing the same. The cerium oxide abrasive and the polishing slurry of the... |
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US20050189322 |
Compositions and methods for chemical mechanical polishing silica and silicon nitride
The present invention provides an aqueous composition useful for polishing silica and silicon nitride on a semiconductor wafer comprising by weight percent 0.01 to 5 zwitterionic compound, 0.01 to... |
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US20150360346 |
Resin Bonded Abrasive
A superabrasive resin product includes a superabrasive grain component, an oxide component, and a continuous phase defining a network of interconnected pores. The oxide component consists of an... |
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US20070173180 |
Antiloading compositions and methods of selecting same
An antiloading composition includes a first organic compound. The compound has a water contact angle criterion that is less than a water contact angle for zinc stearate. The first compound also... |
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US20050137078 |
Alumina-yttria particles and methods of making the same
Fused polycrystalline abrasive particles, and methods of making and using the same. For example, fused polycrystalline abrasive particles according to the present invention are useful, for as... |
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US20100227531 |
ACRYLATE COLOR-STABILIZED PHENOLIC BOUND ABRASIVE PRODUCTS AND METHODS FOR MAKING SAME
Described is a color-stable abrasive article that includes a phenolic resin binder; a color stabilizer, a colorant, and abrasive grains. The color stabilizer includes at least one acrylate. The... |
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US20080148649 |
Ruthenium-barrier polishing slurry
The polishing slurry is useful for removing ruthenium layers from patterned semiconductor substrates in the presence of at least one nonferrous interconnect metal and a dielectric. The polishing... |
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US20060213126 |
Method for preparing a polishing slurry having high dispersion stability
The present invention relates to an improved method for preparing a polishing slurry, comprising dispersing polishing particles and an anionic polymeric acid in water and then adding to the... |
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US20060026905 |
Preparation of coated abrasive disk
A coated abrasive disk having an improved dimensional stability, high adhesion strength and high breaking strength is prepared by combining together (A) a nonwoven fabric, (B) at least one textile... |
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US20090229189 |
METHOD FOR PREPARING A POLISHING SLURRY HAVING HIGH DISPERSION STABILITY
The present invention relates to an improved method for preparing a polishing slurry, comprising dispersing polishing particles and an anionic polymeric acid in water and then adding to the... |
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US20050120636 |
Preparation of coated abrasive disk
A coated abrasive disk having an improved dimensional stability and high breaking strength is prepared by combining a supporting substrate and a coated abrasive body comprised of a backsheet and a... |
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US20050055885 |
Polishing pad for chemical mechanical polishing
The present invention provides in one embodiment, a polishing pad 100 for chemical mechanical polishing. The polishing pad comprises a polishing body 110. The polishing body comprises a... |
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US20160016293 |
LINEAR GRINDING MEMBER, BRUSH-LIKE GRINDING STONE, AND METHOD FOR MANUFACTURING LINEAR GRINDING MEMBER
A brush-like grinding stone (1) includes a linear grinding member (11) obtained by stiffening, with a resin binder, a composite yarn including inorganic filaments. As the linear grinding member... |
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US20150027062 |
ABRASIVE ARTICLE AND METHOD OF MAKING
An abrasive article includes a bonded abrasive having a body made of abrasive grains contained within a composite bond material. The composite bond material can include an organic material and a... |
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US20140138305 |
ARTICLES INCLUDING MULTI-COMPONENT FIBERS AND PARTICLES AND METHODS OF MAKING AND USING THE SAME
An article including multi-component fibers and particles is disclosed. The multi-component fibers include at least a first polymeric composition and a second polymeric composition, are adhered... |
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US20120231707 |
SANDPAPER WITH NON-SLIP LAYER
The present invention provides an abrasive article, e.g. a sheet of sandpaper, comprising a backing layer having opposed first and second major surfaces, an adhesive make coat on the second major... |
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US20100107508 |
ACID-RESISTANT FILAMENTS FOR INDUSTRIAL APPLICATION AND BRUSH WITH SAME
The present invention relates to a brush filament for industrial applications and a brush made with the same. The brush filament comprises a matrix resin, a hydrolytic stabilizer and/or an... |
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US20150306731 |
CHEMICAL MECHANICAL POLISHING PAD
A chemical mechanical polishing pad is provided containing a polishing layer having a polishing surface, wherein the polishing layer comprises a reaction product of ingredients, including: an... |
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US20080127573 |
Slurry Composition for Final Polishing of Silicon Wafers and Method for Final Polishing of Silicon Wafers Using the Same
Disclosed is a slurry composition for final polishing of silicon wafers to achieve mirror surfaces of the wafers. The slurry composition can include deionized water, abrasive particles, a... |