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US20160023322 POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN  
Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove...
US20150004889 COATED ABRASIVE ARTICLE BASED ON A SUNFLOWER PATTERN  
An abrasive article having a plurality of abrasive areas arranged in a non-uniform distribution pattern, wherein the pattern is spiral or phyllotactic, such as a spiral lattice, and in particular...
US20070175104 Polishing slurry for silicon oxide, additive liquid and polishing method  
The polishing slurry of the invention is a polishing slurry for polishing a silicon oxide film on polysilicon, which contains an abrasive, polysilicon polishing inhibitor, and water. As the...
US20150174726 POLISHING PAD, COMPOSITION FOR THE MANUFACTURE THEREOF, AND METHOD OF MAKING AND USING  
A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a...
US20130125473 POLYURETHANE COMPOSITION FOR CMP PADS AND METHOD OF MANUFACTURING SAME  
Polyurethane composition based on a certain polyether and polyester prepolymer reaction mixture, wherein the composition is utilized in manufacturing chemical mechanical polishing/planarizing...
US20110209412 METHOD OF MAKING POLISHING PAD ASSEMBLY WITH GLASS OR CRYSTALLINE WINDOW  
Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first...
US20090151267 Multifunction abrasive tool with hybrid bond  
Abrasive tools and techniques are disclosed that can cut hard, brittle materials to relatively precise dimensions. The tools, which can include a hybrid bond of metal or metal alloy and a resin...
US20090035519 ABRASIVE ARTICLE WITH ANTI-SLIP POLYMERIC LAYER  
An abrasive article includes a backing having first and second major surfaces, an abrasive layer overlying the first major surface, and a polymeric layer overlying the second major surface. The...
US20050097824 Backing and abrasive product made with the backing and method of making and using the backing and abrasive product  
The invention provides a backing for an abrasive article comprising a sheet-like polymeric substrate having a first major surface including a pattern of non-abrasive raised areas and depressed...
US20050076577 Abrasive tools made with a self-avoiding abrasive grain array  
Abrasive tools contain abrasive grains oriented in an array according to a non-uniform pattern having an exclusionary zone around each abrasive grain, and the exclusionary zone has a minimum...
US20050060941 Abrasive article and methods of making the same  
An abrasive article and methods of making the same are disclosed. The abrasive article includes a backing and an array of features on the backing. Each feature includes a base and a body. The body...
US20150266162 ABRASIVE ARTICLE WITH ADHESION PROMOTING LAYER  
An abrasive article includes a backing having first and second major surfaces, an abrasive layer overlying the first major surface, and a polymeric layer overlying the second major surface. The...
US20110171890 POLISHING PAD AND METHOD FOR MANUFACTURING THE POLISHING PAD  
A polishing pad is disclosed which is less likely to cause scratches, and has an excellent planarization performance and polishing stability. In one aspect, the invention provides a polishing pad...
US20070169421 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive  
The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl...
US20070017160 Composite materials and method for making same  
Certain non-limiting embodiments of the present disclosure comprise a family of composite materials targeting specific applications through a materials design approach involving; 1) a hard...
US20050126080 Semiconductor polishing compound, process for its production and polishing method  
A semiconductor polishing compound comprising cerium oxide abrasive grains, water and an additive, wherein the additive is a water-soluble organic polymer such as ammonium polyacrylate or an...
US20150174735 HIGH POROSITY ABRASIVE ARTICLES AND METHODS OF MANUFACTURING SAME  
An abrasive article includes a polymer matrix and abrasive grains dispersed in the polymer matrix, wherein the abrasive article has a void volume of at least 50%. The polymer matrix is polymerized...
US20090056231 Copper CMP composition containing ionic polyelectrolyte and method  
The CMP compositions of the invention comprise not more than about 1 percent by weight of a particulate abrasive, a polyelectrolyte, which preferably has a weight average molecular weight of at...
US20060229000 Polishing pad  
A polishing pad for planarizing the surface of a wafer has a planar main body of a non-foamed synthetic resin, having Shore D hardness of 66.0-78.5, preferably 70.0-78.5, or more preferably...
US20060049143 Polishing composition and polishing method using the same  
A polishing composition includes an abrasive, at least one compound of azoles and derivatives thereof, and water. The polishing composition is used in applications for polishing surfaces of...
US20090242125 Carrier Head Membrane  
A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is...
US20080200033 POLISHING COMPOUND, METHOD FOR POLISHING SURFACE TO BE POLISHED, AND PROCESS FOR PRODUCING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE  
To provide a polishing compound which is capable of polishing SiC at a high removal rate, or capable of suppressing polishing of silicon dioxide in an insulating layer on the other hand, while...
US20080053001 Polishing Composition and Polishing Method  
In a polishing composition, the concentration of one of either sodium ions or acetate ions is 10 ppb or less, or the concentrations of sodium ions and acetate ions are 10 ppb or less. The...
US20100242374 Polishing Composition and Polishing Method  
In a polishing composition, the concentration of one of either sodium ions or acetate ions is 10 ppb or less, or the concentrations of sodium ions and acetate ions are 10 ppb or less. The...
US20080102735 Concentrated abrasive slurry compositions, methods of production, and methods of use thereof  
Concentrated slurry compositions for use in loose-abrasive machining processes, particularly concentrated abrasive slurries for use in wire saw processes. These concentrated slurry compositions...
US20060242910 Abrasive article having reaction activated chromophore  
An abrasive article has a layer including an epoxy constituent, a cationic photointiator within the epoxy constituent, and a latent colorant configured to change color in response to activation of...
US20090000208 Composite Material  
A composite material comprises a plurality of cores of material selected from the group comprising carbides, nitrides, carbonitrides, cemented carbides, cemented nitrides, cemented carbonitrides...
US20130237136 POLISHING PAD COMPRISING TRANSMISSIVE REGION  
The invention provides a polishing pad comprising an optically transmissive region, wherein the polishing pad comprises a polishing pad body comprising an opaque first region and an optically...
US20080155903 Composite Polishing Pad  
A polishing pad having an optically clear bottom layer and a closed cell top layer where the interface between the top and bottom layers is only a urethane to urethane interface. Grooves may be...
US20070093183 CERIUM OXIDE SLURRY, CERIUM OXIDE POLISHING SLURRY AND METHOD FOR POLISHING SUBSTRATE USING THE SAME  
The present invention provides a cerium oxide slurry, a cerium oxide polishing slurry, and a method of polishing a substrate by using the same, wherein decrease of scratches and polish at high...
US20120083187 POLYURETHANE, COMPOSITION FOR FORMATION OF POLISHING LAYERS THAT CONTAINS SAME, PAD FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME  
A polyurethane is produced by reacting a mixture including at least (A) a diisocyanate, (B) a polyol, and (C) a chain extender, the polyol (B) having the number average molecular weight of 400 to...
US20060162260 Cerium oxide abrasive and slurry containing the same  
Disclosed are a cerium oxide abrasive for selectively polishing various SiO2 films and SiO2—Si3N4 films; and a slurry containing the same. The cerium oxide abrasive and the polishing slurry of the...
US20050189322 Compositions and methods for chemical mechanical polishing silica and silicon nitride  
The present invention provides an aqueous composition useful for polishing silica and silicon nitride on a semiconductor wafer comprising by weight percent 0.01 to 5 zwitterionic compound, 0.01 to...
US20150360346 Resin Bonded Abrasive  
A superabrasive resin product includes a superabrasive grain component, an oxide component, and a continuous phase defining a network of interconnected pores. The oxide component consists of an...
US20070173180 Antiloading compositions and methods of selecting same  
An antiloading composition includes a first organic compound. The compound has a water contact angle criterion that is less than a water contact angle for zinc stearate. The first compound also...
US20050137078 Alumina-yttria particles and methods of making the same  
Fused polycrystalline abrasive particles, and methods of making and using the same. For example, fused polycrystalline abrasive particles according to the present invention are useful, for as...
US20100227531 ACRYLATE COLOR-STABILIZED PHENOLIC BOUND ABRASIVE PRODUCTS AND METHODS FOR MAKING SAME  
Described is a color-stable abrasive article that includes a phenolic resin binder; a color stabilizer, a colorant, and abrasive grains. The color stabilizer includes at least one acrylate. The...
US20080148649 Ruthenium-barrier polishing slurry  
The polishing slurry is useful for removing ruthenium layers from patterned semiconductor substrates in the presence of at least one nonferrous interconnect metal and a dielectric. The polishing...
US20060213126 Method for preparing a polishing slurry having high dispersion stability  
The present invention relates to an improved method for preparing a polishing slurry, comprising dispersing polishing particles and an anionic polymeric acid in water and then adding to the...
US20060026905 Preparation of coated abrasive disk  
A coated abrasive disk having an improved dimensional stability, high adhesion strength and high breaking strength is prepared by combining together (A) a nonwoven fabric, (B) at least one textile...
US20090229189 METHOD FOR PREPARING A POLISHING SLURRY HAVING HIGH DISPERSION STABILITY  
The present invention relates to an improved method for preparing a polishing slurry, comprising dispersing polishing particles and an anionic polymeric acid in water and then adding to the...
US20050120636 Preparation of coated abrasive disk  
A coated abrasive disk having an improved dimensional stability and high breaking strength is prepared by combining a supporting substrate and a coated abrasive body comprised of a backsheet and a...
US20050055885 Polishing pad for chemical mechanical polishing  
The present invention provides in one embodiment, a polishing pad 100 for chemical mechanical polishing. The polishing pad comprises a polishing body 110. The polishing body comprises a...
US20160016293 LINEAR GRINDING MEMBER, BRUSH-LIKE GRINDING STONE, AND METHOD FOR MANUFACTURING LINEAR GRINDING MEMBER  
A brush-like grinding stone (1) includes a linear grinding member (11) obtained by stiffening, with a resin binder, a composite yarn including inorganic filaments. As the linear grinding member...
US20150027062 ABRASIVE ARTICLE AND METHOD OF MAKING  
An abrasive article includes a bonded abrasive having a body made of abrasive grains contained within a composite bond material. The composite bond material can include an organic material and a...
US20140138305 ARTICLES INCLUDING MULTI-COMPONENT FIBERS AND PARTICLES AND METHODS OF MAKING AND USING THE SAME  
An article including multi-component fibers and particles is disclosed. The multi-component fibers include at least a first polymeric composition and a second polymeric composition, are adhered...
US20120231707 SANDPAPER WITH NON-SLIP LAYER  
The present invention provides an abrasive article, e.g. a sheet of sandpaper, comprising a backing layer having opposed first and second major surfaces, an adhesive make coat on the second major...
US20100107508 ACID-RESISTANT FILAMENTS FOR INDUSTRIAL APPLICATION AND BRUSH WITH SAME  
The present invention relates to a brush filament for industrial applications and a brush made with the same. The brush filament comprises a matrix resin, a hydrolytic stabilizer and/or an...
US20150306731 CHEMICAL MECHANICAL POLISHING PAD  
A chemical mechanical polishing pad is provided containing a polishing layer having a polishing surface, wherein the polishing layer comprises a reaction product of ingredients, including: an...
US20080127573 Slurry Composition for Final Polishing of Silicon Wafers and Method for Final Polishing of Silicon Wafers Using the Same  
Disclosed is a slurry composition for final polishing of silicon wafers to achieve mirror surfaces of the wafers. The slurry composition can include deionized water, abrasive particles, a...

Matches 1 - 50 out of 185 1 2 3 4 >