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US20140273753 POLISHING APPARATUS AND POLISHING METHOD  
A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus includes a polishing liquid supply nozzle...
US20100330879 LEAK PROOF PAD FOR CMP ENDPOINT DETECTION  
In one aspect, a polishing pad includes a homogeneous unitary polishing layer having a polishing surface, an opposed bottom surface, a recess in the polishing surface extending partially but not...
US20150079878 POLISHING PAD WITH APERTURE  
Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
US20130017764 POLISHING PAD WITH APERTURE  
Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
US20150196988 POLISH APPARATUS AND POLISH METHOD  
A polish apparatus including a polish pad including a polish surface configured to contact a polish object; and a coolant injector configured to inject a coolant to the polish surface and cool the...
US20080003923 POLISHING PAD WITH WINDOW HAVING MULTIPLE PORTIONS  
A polishing pad has an opaque polishing layer with an aperture therethrough and a polishing surface, and a solid light-transmissive window in the aperture. The solid light-transmissive window...
US20140256225 Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window and Method of Polishing Therewith  
A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis...
US20110130073 WAFER POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS  
The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table...
US20110300775 Control of Overpolishing of Multiple Substrates on the Same Platen in Chemical Mechanical Polishing  
A polishing method includes simultaneously polishing two substrates, a first substrate and a second substrate, on the same polishing pad. A default overpolishing time is stored and an in-situ...
US20100048099 PROBE POLISHING METHOD, PROGRAM THEREFOR, AND PROBE APPARATUS  
A probe polishing method is provided for polishing probes by brining a polishing member into slide-contact with probes through a mounting table having thereon the polishing member transferred from...
US20140256226 Broad spectrum, endpoint detection window chemical mechanical polishing pad and polishing method  
A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis...
US20120231702 METHOD OF PHASING THREADED GRINDING STONE, AS WELL AS GEAR GRINDING MACHINE  
A method of phasing a threaded grinding stone and a gear grinding machine are disclosed, wherein phasing of the threaded grinding stone with respect to a gear to be machined or to a dresser can be...
US20120164918 Chemical Mechanical Polish Process Control for Improvement in Within-Wafer Thickness Uniformity  
A method of performing chemical mechanical polish (CMP) processes on a wafer includes providing the wafer; determining a thickness profile of a feature on a surface of the wafer; and, after the...
US20150024659 Method of Controlling Polishing  
A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference...
US20110281501 FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLISHING  
A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best...
US20150183084 POLISHING END POINT DETECTION METHOD AND POLISHING END POINT DETECTION APPARATUS  
There is provided a polishing end point detection method of improving the accuracy of detecting a polishing end point. The polishing end point detection method emits light toward a polishing...
US20150031271 DOUBLE-SIDE POLISHING APPARATUS  
A wafer polishing apparatus configured to polish simultaneously both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat...
US20150258657 Grinding Wheel Design with Elongated Teeth Arrangement  
A grinding wheel includes a base disk, and a plurality of teeth protruding beyond a surface of the base disk. The plurality of teeth is aligned to an elongated ring encircling a center of the...
US20120100781 MULTIPLE MATCHING REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING  
A method of controlling polishing includes storing a plurality libraries, each library including a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light...
US20120289124 ENDPOINT DETECTION USING SPECTRUM FEATURE TRAJECTORIES  
A method of polishing includes polishing a substrate, making a sequence of measurements of light reflected from the substrate while the substrate is being polished, at least some of the...
US20120021672 Tracking Spectrum Features In Two Dimensions For Endpoint Detection  
A method of polishing includes polishing a substrate, receiving an identification of a selected spectral feature to monitor during polishing, measuring a sequence of spectra of light reflected...
US20130149938 METHOD OF MAKING DIAGRAM FOR USE IN SELECTION OF WAVELENGTH OF LIGHT FOR POLISHING ENDPOINT DETECTION, METHOD AND APPARATUS FOR SELECTING WAVELENGTH OF LIGHT FOR POLISHING ENDPOINT DETECTION, POLISHING ENDPOINT DETECTION METHOD, POLISHING ENDPOINT DETECTION APPARATUS, AND POLISHING MONITORING METHOD  
A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film...
US20140024294 POLISHING ENDPOINT DETECTION METHOD AND POLISHING ENDPOINT DETECTION APPARATUS  
Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the...
US20110081829 POLISHING ENDPOINT DETECTION METHOD AND POLISHING ENDPOINT DETECTION APPARATUS  
Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the...
US20150056891 MEASURING METHOD OF SURFACE ROUGHNESS OF POLISHING PAD  
There is disclosed a measuring method of a surface roughness of a polishing pad which can measure a surface roughness index of the polishing pad showing a strong relationship with polishing...
US20070010169 Polishing pad with window for planarization  
A polishing pad including a window can be useful for polishing articles and can be especially useful for chemical mechanical polishing or planarization of a microelectronic device, such as a...
US20090305610 MULTIPLE WINDOW PAD ASSEMBLY  
A method and apparatus for detecting and obtaining a metric indicative of a polishing process is described. The apparatus includes a polishing pad having an optically transparent region adapted to...
US20120264354 DISTANCE MONITORING DEVICE  
A distance monitoring device is provided. The device is suitable for a chemical mechanical polishing (CMP) apparatus. A polishing head of the CMP apparatus includes a frame and a membrane. The...
US20130084779 SCRIBING FOR POLISHING PROCESS VALIDATION  
The described embodiment relates generally to the polishing of a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. More...
US20090036027 Automated detection of characteristics of abrasive products during use  
A method of processing an article with a coated abrasive product, including a repeat of a single marking, comprises detecting at least two characteristics of the repeat of a single marking. The...
US20120034845 TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING  
A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during...
US20080125014 Sub-aperture deterministric finishing of high aspect ratio glass products  
The invention is directed to large LCD image masks having a final flatness of less than 40 nm and a method of making such LCD image masks by utilizing subaperture deterministic...
US20140329440 Dynamically Tracking Spectrum Features For Endpoint Detection  
A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the...
US20120164917 POLISHING APPARATUS AND POLISHING METHOD  
A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the...
US20110318992 Adaptively Tracking Spectrum Features For Endpoint Detection  
A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving...
US20070190898 STORAGE SYSTEM FOR GLASS OFFCUT  
The storage system is for use next to a glass processing line having a loading table, a glass cutting table and a breakout table. The storage system comprises a first tilt table and a second tilt...
US20120064801 Feedback Control of Polishing Using Optical Detection of Clearance  
A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an...
US20120034844 SPECTROGRAPHIC MONITORING USING INDEX TRACKING AFTER DETECTION OF LAYER CLEARING  
A method of controlling polishing includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index...
US20090130955 Loading Device of Chemical Mechanical Polishing Equipment for Semiconductor Wafers  
A loading device of chemical mechanical polishing (CMP) equipment for processing semiconductor wafers is provided. The loading device includes a loading cup having a cup-like bath, a cup plate...
US20140024291 Endpoint Detection During Polishing Using Integrated Differential Intensity  
A method of controlling a polishing operation includes polishing a substrate, during polishing obtaining a sequence over time of measured spectra from the substrate with an in-situ optical...
US20100184357 Polishing Pad and System with Window Support  
A polishing system includes a polishing pad having a solid light-transmissive window, an optical fiber having an end, and a spacer having a vertical aperture therethrough. A bottom surface of the...
US20150209931 DOUBLE-SIDE POLISHING METHOD  
The invention provides a double-side polishing method including first polishing at a high polishing rate, second polishing at a low polishing rate, dividing a straight line extending between the...
US20120077418 Chemical Mechanical Polishing Pad With Light Stable Polymeric Endpoint Detection Window And Method Of Polishing Therewith  
A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a light stable polymeric endpoint detection window, comprising: a polyurethane...
US20070037487 Polishing pad having a sealed pressure relief channel  
The present invention provides a chemical mechanical polishing pad comprising a window formed in the polishing pad, the window having a void provided on a side thereof. The invention further...
US20090280721 CONFIGURING OF LAPPING AND POLISHING MACHINES  
A lapping or polishing machine includes a material having a first finishing surface to process a surface of a work item, a measuring tool to measure a contour of the first finishing surface, and a...
US20090042480 POLISHING PAD AND POLISHING APPARATUS  
A polishing pad forms a planar surface on glass, semiconductors, dielectric material/metal composites and integrated circuits, as well as a polishing apparatus where it is difficult for the...
US20110177758 Creep-resistant polishing pad window  
The polishing pad is useful for polishing at least one of magnetic, optical and semiconductor substrates. The polishing pad includes a polishing layer having a polyurethane window. The...
US20140080232 PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING  
A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while...
US20130237126 System For Machining Seed Rods For Use In A Chemical Vapor Deposition Polysilicon Reactor  
A method for machining a profile into a silicon seed rod using a machine. The silicon seed rod is capable of being used in a chemical vapor deposition polysilicon reactor. The machine includes a...
US20140242880 OPTICAL MODEL WITH POLARIZATION DIRECTION EFFECTS FOR COMPARISON TO MEASURED SPECTRUM  
A method of controlling a polishing operation includes storing an optical model for a layer stack having a plurality of layers. The optical model has a plurality of input parameters, the plurality...

Matches 1 - 50 out of 176 1 2 3 4 >