Matches 1 - 50 out of 192 1 2 3 4 >


Match Document Document Title
US20070197132 Dechuck using subpad with recess  
A method is described. The method includes supporting a polishing sheet having a polishing surface on a subpad having a recess formed therein, applying a vacuum to the recess sufficient to pull...
US20060009128 Eddy current sensing of metal removal for chemical mechanical polishing  
A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The...
US20050026547 Semiconductor processor control systems, semiconductor processor systems, and systems configured to provide a semiconductor workpiece process fluid  
Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece...
US20060105678 Polishing apparatus and polishing method  
A polishing apparatus can supply a polishing liquid uniformly and efficiently to a surface to be polished of a workpiece. The polishing apparatus includes a polishing table having a polishing...
US20150017880 FILM-THICKNESS MEASURING APPARATUS, FILM-THICKNESS MEASURING METHOD, AND POLISHING APPARATUS HAVING THE FILM-THICKNESS MEASURING APPARATUS  
A film-thickness measuring apparatus and a film-thickness measuring method capable of improving an accuracy of the film-thickness measurement are disclosed. The film-thickness measuring apparatus...
US20160172221 SUBSTRATE PROCESSING APPARATUS  
A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary...
US20120190273 POLISHING METHOD AND POLISHING APPARATUS  
A polishing method polishes a surface (surface to be polished) of a substrate at a sufficient polishing rate and obtains a desired polishing profile while preventing an unpolished portion from...
US20080254713 PAD ASSEMBLIES FOR ELECTROCHEMICALLY ASSISTED PLANARIZATION  
In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface to contact the substrate during a polishing...
US20060246821 METHOD FOR CONTROLLING POLISHING FLUID DISTRIBUTION  
A method for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, a method for delivering a polishing fluid to a polishing surface of a chemical...
US20050112998 Polishing apparatus  
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat finish. The polishing apparatus includes a polishing tool having a polishing surface, a substrate...
US20130083457 SYSTEM AND METHOD FOR MANUFACTURING A DISPLAY PANEL OR OTHER PATTERNED DEVICE  
Systems and methods for manufacturing a display panel or other patterned device using outer resistive trace(s) patterned on the display panel or other patterned device are provided. Such a system,...
US20120034845 TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING  
A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during...
US20070238393 METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE  
Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the...
US20060246822 System and method for in-line metal profile measurement  
A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce...
US20090029629 METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE  
Methods for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and...
US20060205322 Chemical-mechanical planarization tool force calibration method and system  
The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and...
US20090275265 ENDPOINT DETECTION IN CHEMICAL MECHANICAL POLISHING USING MULTIPLE SPECTRA  
A computer implemented method includes obtaining at least one current spectrum with an in-situ optical monitoring system, comparing the current spectrum to a plurality of different reference...
US20070232203 Polishing method and polishing apparatus  
A polishing method can prevent scratches in a polished surface of a polishing object, caused by foreign matter adhering to a surface of a polishing member, thus preventing the attendant lowering...
US20110189925 High Sensitivity Real Time Profile Control Eddy Current Monitoring System  
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, and an eddy current monitoring system to generate an eddy current signal. The eddy...
US20050173259 Endpoint system for electro-chemical mechanical polishing  
An electrochemical mechanical polishing apparatus has a rotatable platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, and multiple sensors, e.g.,...
US20150111314 A METHOD OF POLISHING A SUBSTRATE HAVING A FILM ON A SURFACE OF THE SUBSTRATE FOR SEMICONDUCTOR MANUFACTURING  
A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type...
US20060009130 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device  
A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and...
US20060246820 EXTENDED KALMAN FILTER INCORPORATING OFFLINE METROLOGY  
An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter estimator. The inner control loop...
US20140329439 APPARATUS AND METHODS FOR ACOUSTICAL MONITORING AND CONTROL OF THROUGH-SILICON-VIA REVEAL PROCESSING  
A TSV (through silicon via) reveal process using CMP (chemical mechanical polishing) may be acoustically monitored and controlled to detect TSV breakage and automatically respond thereto. Acoustic...
US20110124269 EDDY CURRENT SENSOR AND POLISHING METHOD AND APPARATUS  
An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor includes a sensor coil...
US20050170750 Polish pad to change polish rate on wafer by adjusting groove width and density  
The present invention describes a method for creating a differential polish rate across a semiconductor wafer. The profile or topography of the semiconductor wafer is determined by locating the...
US20050026542 Detection system for chemical-mechanical planarization tool  
Methods and apparatus are provided for endpoint detection in a chemical mechanical planarization (CMP) process. Reflectance spectra data is taken periodically in different areas of a surface of a...
US20110189856 High Sensitivity Real Time Profile Control Eddy Current Monitoring System  
A method of chemical mechanical polishing a metal layer on a substrate includes polishing the metal layer on the substrate at first and second polishing stations, monitoring thickness of the metal...
US20160325400 ROBOT CELL  
A robot cell has a cell skeleton, a ceiling-suspended type robot installed inside of the cell skeleton and having a robot hand for holding a workpiece, and a processing device installed inside of...
US20150375390 ROBOTIC SYSTEM FOR APPLYING SURFACE FINISHES TO LARGE OBJECTS  
A robotic system for performing surface finishing processes on a large object, is provided, the system includes at least one platform having a connected robot, the robot performing a surface...
US20140051333 Methods and apparatus for nanolapping  
A lapping system for lapping portions of a workpiece. The lapping system includes, a lap that is defined by a surface. Portions of the surface are a lapping surface. The lapping surface has a...
US20060014475 Grindstone tool  
A grindstone tool forperformpredeterminedprocessing on a workpiece, wherein a radio IC tag from, and to, which information can be read, and written, without contact is embedded in the grindstone tool.
US20050191858 Substrate processing method and apparatus  
A substrate processing apparatus can process a substrate having a metal film formed thereon. The substrate processing apparatus has a process unit configured to remove a native oxide of a metal...
US20060228991 Polishing method and apparatus  
A chemical mechanical polishing method for polishing an oxide film and a protective film formed on a substrate having recesses comprises four steps. The first step planarizes the oxide film using...
US20110045739 Method and Apparatus for Roll Grinding  
In one aspect, a process for roll grinding employs a grinding wheel that is porous and permeable. In another aspect, a process for grinding mill rolls includes dressing the grinding wheel as the...
US20090305609 CMP PAD IDENTIFICATION AND LAYER RATIO MODELING  
The present invention relates to methods and apparatus for improving productivity of chemical mechanical polishing (CMP) processes and lowering operating costs of CMP systems. Embodiments of the...
US20070243796 METHOD AND APPARATUS FOR POLISHING A WAFER WITH A HIGHER IN-PLANE UNIFORMITY  
A wear thickness for a retainer ring is measured at a specified timing. The height of the retainer ring or the polishing condition of the polishing apparatus is changed in an amount greater than...
US20140335761 DETECTION APPARATUS AND METHOD OF CHEMICAL MECHANICAL POLISHING CONDITIONER  
The present invention relates to a detection apparatus of chemical mechanical polishing conditioner, comprising: a working platform with a working plane; a placement base disposed on the working...
US20090023361 CMP APPARATUS AND METHOD OF POLISHING WAFER USING CMP  
A CMP apparatus is provided with a replaceable polishing pad, a film thickness sensor, and a polishing control unit for switching polishing conditions in response to a fact that an output value...
US20080227366 COMBINED APPARATUS FOR MACHINING OF ARTICLES, IN PARTICULAR IN FORM OF SLABS  
An apparatus for machining an article (L) in the form of a slab or the like comprises—in addition to a rotary tool (24) associated with a spindle (22)—a nozzle (26) ejecting water at very high...
US20060252350 Chemical mechanical polishing system and process  
Chemical mechanical polishing (CMP) systems and methods are provided herein. One aspect of the present subject matter is a polishing system. One polishing system embodiment includes a platen...
US20060099885 Wear indication apparatus and method  
Apparatus and method for monitoring the wear of a downhole tool, and providing indication of the degree of wear to an operator at the well surface. A pressurized fluid path within the cutting...
US20110294400 Determining Physical Property of Substrate  
A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a...
US20110256803 FLUIDIZED WEB POLISHING APPARATUS AND METHOD USING CONTACT PRESSURE FEEDBACK  
An abrasive article with an abrasive element fabricated on a flexible foil suspended by a hydrostatic preloader, a gimball mechanism or a soft pad capable of selectively engaging with substrate to...
US20060199472 Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization  
Conditioning apparatuses and methods for conditioning polishing pads used for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one...
US20150353412 METHOD OF PROCESSING TEMPERED GLASS AND APPARATUS OF PROCESSING TEMPERED GLASS  
To provide a method of processing a tempered glass in a simple and appropriate manner while a degree of freedom of processing is secured. Vibration of the processing device is controlled in a...
US20080146119 Substrate Polishing Method and Apparatus  
A polishing apparatus is provided for optimizing a polishing profile in consideration of even such parameters as the temperature on the surface of an object to be polished, and the thickness of a...
US20070004316 Integrated system for processing semiconductor wafers  
An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and...
US20130122265 GLASS SUBSTRATE END SURFACE EVALUATION METHOD, GLASS SUBSTRATE END SURFACE PROCESSING METHOD, AND GLASS SUBSTRATE  
According to the invention, an image of the end surface Z, which is imaged by a laser microscope 14, is processed with white and black binarization to identify a recess present in the end surface...
US20100203806 SEMICONDUCTOR MANUFACTURING APPARATUS  
A semiconductor manufacturing apparatus comprising a platen holding a polishing pad; a polishing head including a pressurizing mechanism which presses a surface of a processing target substrate...

Matches 1 - 50 out of 192 1 2 3 4 >