Matches 1 - 38 out of 38


Match Document Document Title
US20100062696 RETRACTABLE WATER DISPENSER ARM FOR GRINDER/POLISHER  
A retractable water dispenser arm system for a grinder/polisher includes a flexible hose formed, in part in a loop and affixed at at least one location to a base of the grinder polisher. A spout...
US20110312254 METHOD AND APPARATUS FOR DRESSING POLISHING PAD  
The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life...
US20090247054 METHOD TO PREVENT SLURRY CAKING ON CMP CONDITIONER  
A method of planarizing a semiconductor structure comprises moving a conditioning element on a surface of a polishing member, rotating the semiconductor structure relative to the polishing member...
US20120309278 METHOD FOR REMOVING POLISHING BYPRODUCTS AND POLISHING DEVICE  
A method for removing polishing byproducts and a polishing device are provided. The method includes mounting a positive electrode on the center of a polishing platen and a negative electrode on an...
US20080254722 PAD CONDITIONER  
A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and...
US20080280537 SWEETENING AND CLEANING SYSTEM FOR LAPPING MACHINES  
A sweetening and cleaning system that is used with one or more lapping machines to sweeten a lapping compound in a sweetening mode, and to clean parts of the system itself and parts of the one or...
US20090036041 CMP PAD DRESSER AND CMP APPARATUS USING THE SAME  
A CMP pad dresser for dressing a polishing pad of a CMP apparatus is provided with a dressing pad having abrasive grains, a purified water supply unit provided to an external periphery of the...
US20130130597 GLASS TREATMENT APPARATUS AND METHODS OF TREATING GLASS  
A glass treatment apparatus, in one example, can include a fluid dispensing device configured to dispense a substantially laminar flow of a fluid film. In another example, a shroud substantially...
US20140154958 WAFER POLISHING APPARATUS  
The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric...
US20090275274 Polishing Pad Conditioner  
The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive...
US20100285723 POLISHING APPARATUS  
A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing...
US20060211350 Truing tool advancer jig  
A truing tool advancer jig is a unit comprising three parts: a jig body; a feed screw; and a clamping screw. The jig body is mounted on the universal support of a grinder and securely positioned...
US20060046624 Method for manufacturing grindstone corrector and grindstone, and grindstone corrector, and grindstone  
The present invention is to increase the flatness of the correcting surface of a grindstone corrector and the grinding surface of the grindstone, thereby enabling to give excellent sharpness to a...
US20090093195 CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods  
A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a...
US20100248597 EQUIPMENT AND METHOD FOR CLEANING POLISHING CLOTH  
The equipment for cleaning polishing cloth is capable of increasing pressure of washing water received by the polishing cloth, securely removing deposits from the polishing cloth and improving...
US20130023186 METHOD AND APPARATUS FOR POLISHING A SUBSTRATE  
A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of...
US20110081848 GRINDING TOOL AND METHOD OF MANUFACTURING THE GRINDING TOOL  
A manufacturing method for grinding tool includes following steps. Step 1 is providing a substrate. Step 2 is fixing diamond or abrasive grit in a predetermined position or base by DIAMAP (Diamond...
US20140323017 METHODS AND APPARATUS USING ENERGIZED FLUIDS TO CLEAN CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS  
Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the...
US20100035525 IN-SITU PERFORMANCE PREDICTION OF PAD CONDITIONING DISK BY CLOSED LOOP TORQUE MONITORING  
Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by...
US20150079885 DEVICE FOR CLEANING FIXED ABRASIVES POLISHING PAD  
A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning...
US20070232203 Polishing method and polishing apparatus  
A polishing method can prevent scratches in a polished surface of a polishing object, caused by foreign matter adhering to a surface of a polishing member, thus preventing the attendant lowering...
US20090239454 CMP CONDITIONER AND PROCESS FOR PRODUCING THE SAME  
A CMP conditioner having excellent corrosion resistance around abrasive grains includes a grindstone base having, formed on one side, an abrasive grain layer including abrasive grains fixed in a...
US20070066187 Chemical mechanical polishing device including a polishing pad and cleaning method thereof and method for planarization  
A chemical mechanical polishing device used to polish a wafer according to the present invention includes a polishing table, a polishing pad, a slurry supply device, a wafer carrier and a...
US20140099870 GRINDING APPARATUS FOR A SUBSTRATE  
A substrate grinding apparatus according to an exemplary embodiment of the present invention includes a grinding wheel grinding an object substrate, a nozzle unit spraying cooling water to the...
US20060141910 Methods and systems for conditioning polishing pads  
Methods for conditioning polishing pads that are to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization...
US20080202568 Cleaning cup system for chemical mechanical planarization apparatus  
The present invention is related to an improved cleaning cup arrangement for CMP systems that efficiently and effectively removes most, if not all, of any slurry material present on the abrasive...
US20080194182 Mechano-chemical polishing method for GaAs wafer  
A method of performing mechano-chemical polishing serving as a primary polishing operation for a GaAs wafer, by using a mechano-chemical polishing solution containing dichloroisocyanuric acid,...
US20080311834 System and Method for Cleaning a Conditioning Device  
A system for cleaning a conditioning device to improve the efficiency of the conditioning of a polishing pad using the conditioning device as part of a chemical-mechanical polishing process, the...
US20120167924 CLEANING DEVICE AND A CLEANING METHOD OF A FIXED ABRASIVES POLISHING PAD  
A device for cleaning a fixed abrasive polishing pad includes a main body having a surface facing the polishing pad, an inlet coupled to an end of the main body and configured to supply a cleaning...
US20080182490 METHOD AND SYSTEM FOR PAD CONDITIONING IN AN ECMP PROCESS  
A method and system for pad conditioning in an electrochemical mechanical planarization (eCMP) tool is disclosed. A polishing pad having a pad electrode is placed onto a platen of the eCMP tool. A...
US20080003931 SYSTEM AND METHOD FOR IN-SITU HEAD RINSE  
A carrier head and a method of cleaning the carrier head are disclosed. The carrier head may have one or more openings through a sidewall that extend into a cavity within the carrier head using a...
US20110143640 PAD CONDITIONER AND METHOD  
A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris....
US20160144478 APPARATUS FOR CLEANING A POLISHING SURFACE, POLISHING APPARATUS, AND METHOD OF MANUFACTURING AN APPARATUS FOR CLEANING A POLISHING SURFACE  
There is disclosed a polishing-surface cleaning apparatus to which a polishing liquid, such as slurry, is less likely to be attached. The polishing-surface cleaning apparatus includes an arm...
US20160114459 Polishing Pad Cleaning Systems Employing Fluid Outlets Oriented To Direct Fluid Under Spray Bodies And Towards Inlet Ports, And Related Methods  
Polishing pad cleaning systems employing fluid outlets orientated to direct fluid under spray bodies and towards inlet ports, and related methods are disclosed. A polishing pad in combination with...
US20160039067 SANDING DEVICE INCLUDING MEANS FOR CHANGING A SANDING DISK  
The invention relates to a sanding assembly including a sanding device (100) comprising a plate (110) for supporting a sanding disk (10) and motor-driven means (140) suitable for moving the...
US20160016283 VACUUM CLEANING SYSTEMS FOR POLISHING PADS, AND RELATED METHODS  
Vacuum cleaning systems and related methods are disclosed. A polishing pad in combination with a fluid, such as a slurry, contacts a substrate to planarize material at the surface thereof and...
US20150290767 SUBSTRATE PROCESSING APPARATUS  
A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit....
US20150290766 SUBSTRATE PROCESSING APPARATUS  
The CMP apparatus is provided with a polishing unit 3; a cleaning unit 4; a load/unload unit for transferring substrates to the polishing unit 3 and receiving substrates from the cleaning unit 4;...

Matches 1 - 38 out of 38