Matches 1 - 50 out of 64 1 2 >


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US20120244784 CHEMICAL-MECHANICAL POLISHING TOOL AND METHOD FOR PREHEATING THE SAME  
A chemical-mechanical polishing tool and a method for preheating the same are disclosed. The chemical-mechanical polishing tool includes: a polishing pad, a deionized water supply channel, a...
US20140273753 POLISHING APPARATUS AND POLISHING METHOD  
A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus includes a polishing liquid supply nozzle...
US20120238185 METHOD OF PHASING THREADED GRINDING STONE, AS WELL AS DEVICE THEREFOR  
Provided is a method of phasing a threaded grinding stone, as well as a device therefor, the aforementioned method and device being such that contact or non-contact of a threaded grinding stone...
US20140087627 METHOD OF DETECTING ABNORMALITY IN POLISHING OF A SUBSTRATE AND POLISHING APPARATUS  
A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to...
US20140162532 METHOD OF POLISHING ONE SIDE OF WAFER AND SINGLE SIDE POLISHING APPARATUS FOR WAFER  
A method of polishing one side of a wafer, which makes it possible to accurately realize the desired wafer edge shape without dependence on the period of use of a polishing cloth, is provided. In...
US20140154951 COMMON GROUND FOR ELECTRONIC LAPPING GUIDES  
Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller such that the number of wire bonds from the controller to a row of read heads is...
US20130196572 CONDITIONING A PAD IN A CLEANING MODULE  
A particle cleaning module includes a housing, a substrate holder, a pad holder, an actuator and a pad conditioner. The substrate holder is disposed in the housing, is configured to retain a...
US20150017745 POLISHING METHOD AND POLISHING APPARATUS  
A polishing method capable of preventing damage to a substrate is disclosed. The polishing method includes inspecting a periphery of a substrate for an abnormal portion, polishing the substrate if...
US20130189901 ANGLE GRINDER COMPRISING A YAW RATE SENSOR FOR MEASURING THE HOUSING ROTATION  
An angle grinder includes a housing, a drive unit configured to drive a usage tool, a sensor device configured to provide a rotation parameter, and a control unit configured to evaluate the...
US20120264354 DISTANCE MONITORING DEVICE  
A distance monitoring device is provided. The device is suitable for a chemical mechanical polishing (CMP) apparatus. A polishing head of the CMP apparatus includes a frame and a membrane. The...
US20140154952 WAFER GROUNDING DESIGN FOR SINGLE PAD LAPPING  
Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the...
US20140295737 POLISHING APPARATUS AND WEAR DETECTION METHOD  
There is provided a polishing apparatus capable of detecting uneven wear occurring on a polishing pad and detecting an appropriate replacement timing of the polishing pad. The polishing apparatus...
US20110312246 Multiple Airfoil Vanes  
A vane for a turbine assembly of a turbocharger includes a first airfoil that includes a length between a leading edge and a trailing edge, a second airfoil that includes a length between a...
US20140273745 X-RAY METROLOGY FOR CONTROL OF POLISHING  
A method of controlling a polishing operation includes receiving a first measurement of a first amount of metal on a substrate made by a first x-ray monitoring system after a first metal layer is...
US20120149279 ABRASIVE ARTICLE WITH ARRAY OF COMPOSITE POLISHING PADS  
An abrasive article for polishing a substrate surface. The abrasive article includes a holder pad assembly and an abrasive member held in place with respect to a holder pad. The abrasive member...
US20150017881 METHOD OF GRINDING SPRING ENDS AND SPRING END GRINDING MACHINE  
A method of grinding spring ends of helical compression springs is carried out using a numerically controlled spring end grinding machine having a grinding unit, a loading unit and a control unit...
US20140094091 BALANCING PROCESS AND DEVICE FOR A ROTATING BODY  
A balancing device for a rotating body is provided, comprising at least one unbalance detector apt to measure the unbalance of the rotating body; two balancing masses apt to be handled along a...
US20080051006 TANGENTIAL GRINDING RESISTANCE MEASURING METHOD AND APPARATUS, AND APPLICATIONS THEREOF TO GRINDING CONDITION DECISION AND WHEEL LIFE JUDGMENT  
A tangential grinding resistance measuring method comprises a section area obtaining step of obtaining an abrasive grain section area which is at a predetermined infeed depth from the highest top...
US20090108266 Friction Control in Apparatus Having Wide Bandgap Semiconductors  
Apparatus comprising, in use, a wide bandgap semiconductor, a conductor which is moveable relative to the semiconductor and means for applying a potential across the junction between a conductor...
US20130017761 METHOD FOR DETECTING AND/OR PREVENTING GRIND BURN  
The present invention provides a method of detecting and preventing grind burn from developing on a gear. The method includes performing acoustic emission testing while the gear is being ground...
US20100105287 COMPACT ELECTRIC GRINDING MACHINE  
The present invention particularly relates to a hand-held sanding machine with an outer housing (1), a tool shaft (2) and a brushless electric drive motor. In the present invention, the rotor of...
US20140015107 METHOD TO IMPROVE WITHIN WAFER UNIFORMITY OF CMP PROCESS  
Closed loop control may be used to improve uniformity of within wafer uniformity using chemical mechanical planarization. For example, closed loop control may be used to determine a control...
US20100203804 Powder Delivery Rate Control for Air Abrasive Instruments  
A micro-abrasive blasting device and method for perturbation control using a plurality of delivery conduits of various lengths and/or apertures. The user is able to individually open and close...
US20130337723 METHOD AND APPARATUS FOR POLISHING WORKPIECE  
In a polishing method of the present invention, the temperature of a carrier plate is measured, and the amount of polishing removal of a workpiece (workpiece) is accurately controlled based on...
US20140106647 MULTIFUNCTIONAL SUBSTRATE POLISHING AND BURNISHING DEVICE AND POLISHING AND BURNISHING METHOD THEREOF  
The invention, involving grinding and polishing flat processing and thinning processing of hard and brittle materials such as silicon wafer, sapphire substrate and the glass substrate, belongs to...
US20100330880 Machine Tools and Methods of Operation Thereof  
A machine tool is provided which comprises a machine base (10), a first support (20,100) mounted on a first rotational machine axis on the base, and a second support (22,102) mounted on a second...
US20140273746 CMP POLISHING PAD DETECTOR AND SYSTEM  
A chemical mechanical planarization apparatus includes a table, a polishing pad and a detector. The polishing pad is disposed at the table. The detector detects an abnormal condition of the...
US20110076922 METHOD FOR SURFACE TREATMENT OF METAL PLATE AND VEHICLE TREATED THEREBY  
When surface grinding finish for decoration or other purposes is performed by applying a film to the front surface of a metal plate that is welded linearly with penetration from the rear surface...
US20150044944 Surface Processing System for a Work Piece  
The present invention provides a surface processing system for a work piece in the mechanical technical field. The system comprises at least one group of polishing units. A manipulator and several...
US20140065928 EDGE GRINDING APPARATUS AND METHOD FOR GRINDING GLASS SUBSTRATE  
An edge grinding apparatus and method for grinding a glass substrate, with which a glass substrate can be ground by a fixed amount and the occurrence of defects can be minimized. The edge grinding...
US20130324012 POLISHING APPARATUS AND POLISHING METHOD  
A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding...
US20140187122 POLISHING APPARATUS  
A polishing apparatus includes: a pure water supply line configured to supply deaerated pure water into the polishing apparatus; a gas dissolving unit coupled to the pure water supply line and...
US20120238184 METHOD FOR PROVIDING AN EDGE PREPARATION ON A CUTTING EDGE OF A TOOL AND A CONTROL AND A PROCESSING MACHINE FOR CARRYING OUT THE METHOD  
A method for providing an edge preparation on a cutting edge of a tool by means of an edge processing operation includes clamping the tool in a processing machine for providing the edge...
US20120276813 Machine Tools And Methods Of Operation Thereof  
A machine tool is provided which comprises a machine base; a first support provided on a first rotational machine axis, the first rotational axis being mounted on the base in a fixed position...
US20150072593 APPARATUS INCLUDING ELECTRICAL LAPPING GUIDE AND METHODS OF USING THE SAME  
An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first...
US20130318762 Method For Profiling A Laid Rail And Processing Vehicle  
The invention relates to a method of profiling a running surface of a laid rail by means of a processing vehicle, in particular in the region of a switch, comprising placing a first copying probe...
US20080227374 POLISHING HEAD TESTING WITH MOVABLE PEDESTAL  
A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer...
US20140073223 METHOD AND APPARATUS FOR WAFER BACKGRINDING AND EDGE TRIMMING ON ONE MACHINE  
A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon, the turntable being configured to rotate about a turntable axis. Each...
US20110059679 METHOD FOR SLICING WORKPIECE  
The present invention is a method for slicing a workpiece into wafers by pressing a cylindrical workpiece held with a workpiece holder against a wire row formed by a wire spirally wound between a...
US20150111467 CMP HEAD STRUCTURE  
A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table; a head assembly for holding a wafer...
US20080166877 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND POLISHER USED IN THE METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE  
A method for manufacturing a semiconductor device, including depositing an interconnect material including Cu or Cu alloy over an insulating film, and polishing the interconnect material by CMP...
US20100248589 PRECISION GUIDANG DEVICE IN A MACHINE FOR MACHINING CYLINDRICAL COMPONENTS  
The part to be machined (2) is attached so that its axis lies in a position exactly determined relative to the base of the machine (1) and to the pedestal (3) due to the flanges (8) and the rear...
US20120122374 GRINDING DEVICE FOR ROLLERS  
A grinding device for the surface treatment of rolls, for example of rolls for machines producing, finishing and/or processing webs, such as paper, cardboard or tissue machines, includes...
US20110223833 METHOD AND APPARATUS FOR THE MEASUREMENT-AIDED FINE MACHINING OF WORKPIECE SURFACES, AND MEASURING SYSTEM  
In the case of a method for the material-removing fine machining of a workpiece surface of a workpiece, in particular for the honing or finishing of workpiece portions having substantially...
US20060166503 Polishing apparatus and polishing method  
A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The...
US20130237125 SHARPENING APPARATUS  
A portable sharpening apparatus is described. The sharpening apparatus includes a body portion and a cavity formed in the body portion for receiving an object to be sharpened. A rotatable abrasive...
US20140004628 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND POLISHING APPARATUS  
According to an embodiment, a method of manufacturing a semiconductor device includes forming a wiring groove on an insulating film; forming a barrier metal layer and a metal layer; polishing the...
US20120052771 Method For the Material-Removing Machining of Very Thin Work Pieces in a Double Sided Grinding Machine  
The invention relates to a method for machining by grinding or polishing of very thin work pieces which are releasably fastened each to thin carriers. The work pieces are arranged together with...
US20130183886 POLISHING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE EMPLOYING THIS POLISHING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURED BY THIS METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE  
While data that indicate a relationship between a dressing position P defined by a distance between a rotating shaft 11 of a polishing pad 13 and a rotating shaft 31 of a dresser 30 and shape...
US20130095661 CMP METHOD, CMP APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE  
According to one embodiment, a CMP method includes starting a polishing of a silicon oxide film by using a slurry including a silicon oxide abrasive and a polishing stopper film including a...

Matches 1 - 50 out of 64 1 2 >