Matches 1 - 50 out of 418 1 2 3 4 5 6 7 8 9 >

AcclaimIP-ad

Match Document Document Title
US20140339697 Solder Bump for Ball Grid Array  
A solder bump structure for a ball grid array (BGA) includes at least one under bump metal (UBM) layer and a solder bump formed over the at least one UBM layer. The solder bump has a bump width...
US20130127045 MECHANISMS FOR FORMING FINE-PITCH COPPER BUMP STRUCTURES  
The mechanisms of forming a copper post structures described enable formation of copper post structures on a flat conductive surface. In addition, the copper post structures are supported by a...
US20110304042 Copper Bump Structures Having Sidewall Protection Layers  
A work piece includes a copper bump having a top surface and sidewalls. A protection layer is formed on the sidewalls, and not on the top surface, of the copper bump. The protection layer includes...
US20140077359 Ladder Bump Structures and Methods of Making Same  
An embodiment ladder bump structure includes an under bump metallurgy (UBM) feature supported by a substrate, a copper pillar mounted on the UBM feature, the copper pillar having a tapering curved...
US20150228595 METHODS FOR ETCHING COPPER DURING THE FABRICATION OF INTEGRATED CIRCUITS  
Methods for etching copper in the fabrication of integrated circuits are disclosed. In one exemplary embodiment, a method for fabricating an integrated circuit includes providing an integrated...
US20140361432 Pillar Design for Conductive Bump  
A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive...
US20110244675 Structure and method of forming pillar bumps with controllable shape and size  
A structure and method of forming pillar bumps with controllable shape and size are provided, which use polishing planarization technology to eliminate shape difference among pillar bumps on a...
US20130154089 BUMP INCLUDING DIFFUSION BARRIER BI-LAYER AND MANUFACTURING METHOD THEREOF  
Provided herein is a bump including a diffusion barrier bi-layer, the bump having: a conductive layer; a first diffusion barrier layer formed on or above the conductive layer, and comprising an...
US20140113447 Electrical Connection for Chip Scale Packaging  
A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump...
US20140295619 BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRATE HAVING THE BUMP THEREON  
A two-layer structure bump including a first bump layer of a bulk body of a first conductive metal, which is any of gold, copper, and nickel, formed on a substrate and a second bump layer of a...
US20140363966 Pillar Bumps and Process for Making Same  
Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using...
US20120049346 Pillar Bumps and Process for Making Same  
Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using...
US20110101527 MECHANISMS FOR FORMING COPPER PILLAR BUMPS  
The mechanism of forming a metal bump structure described above resolves the delamination issues between a conductive layer on a substrate and a metal bump connected to the conductive layer. The...
US20060113667 Bond pad structure for gold wire bonding to copper low K dielectric silicon devices  
A bond pad structure which improves the reliability of the gold bonds, and thus, of the device. The bond pad structure allows for small gold bonds, which increases the density of the device. One...
US20150179592 SELF-ALIGNED UNDER BUMP METAL  
An integrated circuit including a self-aligned under bump metal pad formed on a top metal interconnect level in a connection opening in a dielectric layer, with a solder ball formed on the...
US20120091577 COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION  
An integrated circuit device includes a Cu pillar and a solder layer overlying the Cu pillar. A Co-containing metallization layer is formed to cover the Cu pillar and the solder layer, and then a...
US20130196499 METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT  
An exemplary method includes forming a vertical pillar overlying or laterally displaced from a bond pad overlying a semiconductor substrate, and applying a discrete solder sphere in combination...
US20110193218 Solder Interconnect with Non-Wettable Sidewall Pillars and Methods of Manufacture  
A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface....
US20120153460 BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF  
A manufacturing method of a bump structure is provided. A substrate having at least one pad and a passivation layer is provided. The passivation layer has at least one first opening exposing the...
US20140363965 DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BONDING  
Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly...
US20110285011 CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE  
An L-shaped sidewall protection process is used for Cu pillar bump technology. The L-shaped sidewall protection structure is formed of at least one of non-metal material layers, for example a...
US20150037936 Strength of Micro-Bump Joints  
A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer...
US20120202343 METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-DEPOSITED NICKEL COPPER ALLOY  
A metallic adhesion layer is formed on a last level metal plate exposed in an opening of a passivation layer. A Ni—Cu alloy in which the weight percentage of Ni is from about 50% to about 70% is...
US20120319271 BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME  
A bump structure comprises a first polymer block, a second polymer block, a first groove, an under bump metallurgy layer and a connection metal layer, wherein the first polymer block and the...
US20110111587 METHOD FOR FORMING POST BUMP  
Disclosed is a method for forming post bumps, the method including the steps of: forming a seed layer for metal plating on a substrate; forming a resist layer having openings provided as positions...
US20080014738 INTEGRATED CIRCUIT MOUNT SYSTEM WITH SOLDER MASK PAD  
An integrated circuit mount system includes an integrated circuit, a solder mask for the integrated circuit, and a solder mask pad on the substrate with the solder mask.
US20150171040 ELECTROPLATED SOLDER FOR HIGH-TEMPERATURE INTERCONNECT  
This chip package includes a substrate having a multilayer electroplated stack disposed on a surface of the substrate. The multilayer electroplated stack may include one or more instances of...
US20120280399 BUFFER PAD IN SOLDER BUMP CONNECTIONS AND METHODS OF MANUFACTURE  
Structures are provided with raised buffer pads for solder bumps. Methods are also provided for forming the raised buffer pads for solder bumps. The method includes forming a raised localized...
US20110079894 Template Process for Small Pitch Flip-Flop Interconnect Hybridization  
A process is disclosed for high density indium bumping of microchips by using an innovative template wafer upon which the bumps are initially fabricated. Once fabricated, these bumps are...
US20130270695 Second Level Interconnect Structures and Methods of Making the Same  
The various embodiments of the present invention provide a stress-relieving, second-level interconnect structure that is low-cost and accommodates TCE mismatch between low-TCE packages and PCBs....
US20110291273 CHIP BUMP STRUCTURE AND METHOD FOR FORMING THE SAME  
A chip bump structure is formed on a substrate. The substrate includes at least one contact pad and a dielectric layer. The dielectric layer has at least one opening. The at least one opening...
US20120040524 PROCESS FOR MAKING CONDUCTIVE POST WITH FOOTING PROFILE  
A process for making a copper post with footing profile employs dual photoresist films of different photosensitivities and thicknesses on an under-bump-metallurgy (UBM) layer. After an exposure...
US20120043654 MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES  
The mechanisms of preparing bump structures described by using patterned anodes may simplify bump-making process, reduce manufacturing cost, and improve thickness uniformity within die and across...
US20100041226 Process For Through Silicon Via Filing  
A semiconductor electroplating process deposits copper into the through silicon via hole to completely fill the through silicon via in a substantially void free is disclosed. The through silicon...
US20100032835 COMBINATION VIA AND PAD STRUCTURE FOR IMPROVED SOLDER BUMP ELECTROMIGRATION CHARACTERISTICS  
The invention generally relates to semiconductor devices, and more particularly to structures and methods for enhancing electromigration (EM) performance in solder bumps and related structures. A...
US20150221605 ETCHING OF UNDER BUMP METTALLIZATION LAYER AND RESULTING DEVICE  
Methods for wet etching a UBM layer and the resulting devices are disclosed. Embodiments may include patterning metal bumps on a wafer that has at least two metal layers thereon; exposing the...
US20100190332 Method of Forming a Copper Topped Interconnect Structure that has Thin and Thick Copper Traces  
A copper-topped interconnect structure allows the combination of high density design areas, which have low current requirements that can be met with tightly packed thin and narrow copper traces,...
US20110254151 METHOD FOR FABRICATING BUMP STRUCTURE WITHOUT UBM UNDERCUT  
A method for fabricating bump structure without UBM undercut uses an electroless Cu plating process to selectively form a Cu UBM layer on a Ti UBM layer within an opening of a photoresist layer....
US20150235978 ELECTROLESS NICKEL BUMP OF DIE PAD AND MANUFACTURING METHOD THEREOF  
Electroless nickel bumps of die pads and a method thereof are disclosed. A protection layer is formed on the top surface and a surrounding sidewall of each electroless nickel bump in turn or at...
US20140187034 INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS FOR FLEXIBLE C4 CONNECTIONS AND A METHOD OF FORMING THE INTEGRATED CIRCUIT CHIP  
Disclosed is a chip and method of forming the chip with improved conductive pads that allow for flexible C4 connections with a chip carrier or with another integrated circuit chip. The pads have a...
US20110140271 INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS FOR FLEXIBLE C4 CONNECTIONS AND A METHOD OF FORMING THE INTEGRATED CIRCUIT CHIP  
Disclosed is a chip and method of forming the chip with improved conductive pads that allow for flexible C4 connections with a chip carrier or with another integrated circuit chip. The pads have a...
US20150031200 Bump Pad Structure  
An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an...
US20130181347 Bump Pad Structure  
An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an...
US20110003470 METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT  
In wafer-level chip-scale packaging and flip-chip packaging and assemblies, a solder cap is formed on a vertical pillar. In one embodiment, the vertical pillar overlies a semiconductor substrate....
US20080251916 UBM structure for strengthening solder bumps  
A novel UBM structure for improving the strength and performance of individual UBM layers in a UBM structure is disclosed. In one aspect, a UBM structure for disposal onto an electrically...
US20120139113 UNDERCUT-REPAIR OF BARRIER LAYER METALLURGY FOR SOLDER BUMPS AND METHODS THEREOF  
A method of making a semiconductor structure includes patterning a barrier layer metallurgy (BLM) which forms an undercut beneath a solder material, and forming a repair material in the undercut...
US20070298602 Method for Applying Solder to Redistribution Lines  
In a method of making an electronic component, an electrically conductive redistribution line is formed on a surface of a semiconductor chip. The redistribution line includes a solder pad. A...
US20070141755 RIBBON BONDING IN AN ELECTRONIC PACKAGE  
A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits,...
US20080191346 Bump structure and manufacturing method thereof  
A bump structure comprises: a plurality of landing pads, a passive element, and a plurality of conductive bumps on a wafer. A method for manufacturing the bump comprises: providing a wafer with a...
US20120326298 BUMP STRUCTURE WITH BARRIER LAYER ON POST-PASSIVATION INTERCONNECT  
A semiconductor device includes a barrier layer between a solder bump and a post-passivation interconnect (PPI) layer. The barrier layer is formed of at least one of an electroless nickel (Ni)...
Matches 1 - 50 out of 418 1 2 3 4 5 6 7 8 9 >