Matches 1 - 50 out of 175 1 2 3 4 >


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US20090102013 FUSE BOX AND METHOD OF FORMING THE SAME  
A fuse box includes a fuse pattern having a rugged profile and an interlayer insulating film including a fuse blowing window to fill the fuse pattern.
US20100320561 Method for forming a one-time programmable metal fuse and related structure  
According to one exemplary embodiment, a method for forming a one-time programmable metal fuse structure includes forming a metal fuse structure over a substrate, the metal fuse structure...
US20120286390 ELECTRICAL FUSE STRUCTURE AND METHOD FOR FABRICATING THE SAME  
An electrical fuse structure includes a top fuse, a bottom fuse and a via conductive layer positioned between the top fuse and the bottom fuse for providing electric connection. The top fuse...
US20140065813 SIZE-FILTERED MULTIMETAL STRUCTURES  
A size-filtered metal interconnect structure allows formation of metal structures having different compositions. Trenches having different widths are formed in a dielectric material layer. A...
US20130082347 One Time Programmable Structure Using a Gate Last High-K Metal Gate Process  
An eFuse structure having a first metal layer serving as a fuse with a gate including an undoped polysilicon (poly), a second metal layer and a high-K dielectric layer all formed on a silicon...
US20140106559 SYSTEM AND METHOD FOR FORMING AN ALUMINUM FUSE FOR COMPATIBILITY WITH COPPER BEOL INTERCONNECT SCHEME  
A semiconductor fuse device and a method of fabricating the fuse device including a last metal interconnect layer including at least two discrete metal conductors, an inter-level dielectric layer...
US20130320488 SYSTEM AND METHOD FOR FORMING ALUMINUM FUSE FOR COMPATIBILITY WITH COPPER BEOL INTERCONNECT SCHEME  
A semiconductor fuse device and a method of fabricating the fuse device including a last metal interconnect layer including at least two discrete metal conductors, an inter-level dielectric layer...
US20080296726 Fuse Structure for Maintaining Passivation Integrity  
A fuse structure (106) includes a patterned conductor disposed over a passivation layer (302), which is disposed over a substrate (110), such as, for example, an inter-layer dielectric layer of an...
US20110147853 Method of Forming an Electrical Fuse and a Metal Gate Transistor and the Related Electrical Fuse  
The present invention provides a method of integrating an electrical fuse process into a high-k/metal gate process. The method simultaneously forms a dummy gate stack of a transistor and a dummy...
US20060163685 THERMO-MECHANICAL CLEAVABLE STRUCTURE  
A thermo-mechanical cleavable structure is provided and may be used as a programmable fuse for integrated circuits. As applied to a programmable fuse, the thermo-mechanical cleavable structure...
US20130071998 Electrical Fuse With Metal Line Migration  
An electrical fuse device is disclosed. A circuit apparatus can include the fuse device, a first circuit element and a second circuit element. The fuse includes a first contact that has a first...
US20150004781 FORMING BEOL LINE FUSE STRUCTURE  
In one embodiment, the invention provides a back-end-of-line (BEOL) line fuse structure. The BEOL line fuse structure includes: a line including a plurality of grains of conductive crystalline...
US20120146710 Fuse Device  
Implementations are presented herein that relate to a fuse device, an integrated circuit including a fuse device, a method of implementing a fuse device and a method of programming a fuse device.
US20140367826 MAKING AN EFUSE  
A wafer chip and a method of designing the chip is disclosed. A first fuse is formed having a first critical dimension and a second fuse having a second critical dimension are formed in a layer of...
US20140210040 ELECTRONIC FUSE LINE WITH MODIFIED CAP  
An electronic fuse structure having an Mx level including an Mx dielectric, a fuse line, an Mx cap dielectric above at least a portion of the Mx dielectric, and a modified portion of the Mx cap...
US20080036031 FUSE BOX FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME  
A fuse box for a semiconductor device is disclosed and includes a first fuse group comprising a plurality of first fuses, arranged in a first direction and having a first cutting axis, each first...
US20140021578 VERTICAL ELECTRONIC FUSE  
An electronic fuse structure including a first Mx metal comprising a conductive cap, an Mx+1 metal located above the Mx metal, wherein the Mx+1 metal does not comprise a conductive cap, and a via,...
US20140070362 E-FUSE STRUCTURES AND METHODS OF MANUFACTURE  
E-fuse structures in back end of the line (BEOL) interconnects and methods of manufacture are provided. The method includes forming an interconnect via in a substrate in alignment with a first...
US20120326269 E-FUSE STRUCTURES AND METHODS OF MANUFACTURE  
E-fuse structures in back end of the line (BEOL) interconnects and methods of manufacture are provided. The method includes forming an interconnect via in a substrate in alignment with a first...
US20130241031 PROGRAMMABLE FUSE STRUCTURE AND METHODS OF FORMING  
Methods of forming an electrically programmable fuse (e-fuse) structure and the e-fuse structure are disclosed. Various embodiments of forming the e-fuse structure include: forming a dummy poly...
US20080099877 DAMAGE PROPAGATION BARRIER AND METHOD OF FORMING  
A conductor-filled damage propagation barrier is formed extending into a low-k dielectric layer between a fuse and an adjacent circuit element for preventing propagation of damage during a fuse...
US20090267180 SEMICONDUCTOR DEVICE HAVING A REDUCED FUSE THICKNESS AND METHOD FOR MANUFACTURING THE SAME  
A semiconductor device that has a reduced fuse thickness without compromising the bondability of an associated pad and a method for manufacturing the same is described. The semiconductor device...
US20140183688 MODIFIED VIA BOTTOM FOR BEOL VIA EFUSE  
An electronic fuse structure including an Mx level including a first Mx metal, a second Mx metal, and an Mx cap dielectric above of the first and second Mx metal, an Mx+1 level above the Mx level,...
US20150048479 SELF-ALIGNED VIA FUSE  
A method including forming a first via opening in a substrate, the first via opening is self-aligned to a first trench in the substrate, forming a second via opening in the substrate, the second...
US20140077334 Electronic Fuse Vias in Interconnect Structures  
An electronic fuse and method for forming the same. Embodiments of the invention include e-fuses having a first metallization level including a metal structure, a second metallization level above...
US20080093705 SEMICONDUCTOR DEVICE PREVENTING BRIDGE BETWEEN FUSE PATTERN AND GUARD RING  
A semiconductor device having a fuse structure that can prevent a bridge between a fuse pattern and a guard ring, and a method of fabricating the same are provided. The fuse pattern formed on a...
US20140252538 ELECTRONIC FUSE WITH RESISTIVE HEATER  
A method of forming an electronic fuse including forming an Mx level including a first and a second Mx metal, forming a first Mx+1 dielectric above the Mx level, forming a conductive path on a...
US20080315354 FUSE FOR SEMICONDUCTOR DEVICE  
Embodiments relate to a fuse for a semiconductor device. To maintain a stable blowing characteristic with a minimized applied current, the fuse includes a fuse line having a blowing characteristic...
US20140061851 METAL-VIA FUSE  
The embodiments of methods and structures disclosed herein provide mechanisms of forming and programming a metal-via fuse. The metal-via fuse and a programming transistor form a one-time...
US20090045484 METHODS AND SYSTEMS INVOLVING ELECTRICALLY REPROGRAMMABLE FUSES  
An electrically reprogrammable fuse comprising an interconnect disposed in a dielectric material, a sensing wire disposed at a first end of the interconnect, a first programming wire disposed at a...
US20120074520 ELECTRICAL FUSE STRUCTURE AND METHOD OF FABRICATING SAME  
A high programming efficiency electrical fuse is provided utilizing a dual damascene structure located atop a metal layer. The dual damascene structure includes a patterned dielectric material...
US20070298547 Semiconductor device having a composite passivation layer and method of manufacturing the same  
A semiconductor device and a method of manufacturing the same are provided. The semiconductor device comprises a fuse bank with a fuse window, a pad area with a pad window, and a composite...
US20140124891 FUSE DEVICE  
A method of forming a device includes forming a silicon-containing line continuously extending between a first node and a second node. A first silicide-containing portion and a second...
US20110018091 FUSE LINK STRUCTURES USING FILM STRESS FOR PROGRAMMING AND METHODS OF MANUFACTURE  
A method of forming a programmable fuse structure includes forming at least one shallow trench isolation (STI) in a substrate, forming an e-fuse over the at least one STI and depositing an...
US20090250786 FUSE PART OF SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME  
A fuse part of a semiconductor device includes an insulation layer over a substrate, and a fuse over the insulation layer, wherein the fuse includes a plurality of blowing pads for irradiating a...
US20120257435 NON-SALICIDE POLYSILICON FUSE  
The embodiments of methods and structures disclosed herein provide mechanisms of forming and programming a non-salicided polysilicon fuse. The non-salicided polysilicon fuse and a programming...
US20120214301 STRUCTURE AND METHOD TO FORM E-FUSE WITH ENHANCED CURRENT CROWDING  
An e-fuse structure and method has an anode; a fuse link (a first end of the fuse link is connected to the anode); a cathode (a second end of the fuse link opposite the first end is connected to...
US20080020560 Method for manufacturing fuse box having vertically formed protective film  
A method for manufacturing a fuse box of a semiconductor device includes forming an interlayer dielectric film over a semiconductor substrate including a given lower structure; forming a metal...
US20090001506 DUAL STRESS LINER EFUSE  
A semiconductor fuse structure comprises an anode connected to a first end of a fuse link, a cathode connected to a second end of the fuse link opposite the first end of the fuse link, a...
US20090108398 Fuse of Semiconductor Device and Method for Forming the Same  
A fuse in a semiconductor device includes: first and second fuse patterns, each being in the shape of a bar, separated from each other in a blowing region; first and second contact plugs...
US20120261793 ELECTRICAL FUSE AND METHOD OF MAKING THE SAME  
An improved electrical-fuse (e-fuse) device including a dielectric layer having a first top surface, two conductive features embedded in the dielectric layer and a fuse element. Each conductive...
US20150028447 METHODS OF FORMING AN E-FUSE FOR AN INTEGRATED CIRCUIT PRODUCT AND THE RESULTING E-FUSE STRUCTURE  
An e-fuse device disclosed herein includes an anode and a cathode that are conductively coupled to the doped region formed in a substrate, wherein the anode includes a first metal silicide region...
US20090090993 SINGLE CRYSTAL FUSE ON AIR IN BULK SILICON  
An integrated eFUSE device is formed by forming a silicon “floating beam” on air, whereupon the fusible portion of the eFUSE device resides. This beam extends between two larger, supporting...
US20080290456 Electrical Fuse With Metal Silicide Pipe Under Gate Electrode  
An electrical fuse (eFuse) has a gate prepared from a conductive or partially conductive material such as polysilicon, a semiconductor substrate having a pipe region in proximity to the gate, and...
US20120289041 BALLASTED POLYCRYSTALLINE FUSE  
A polycrystalline fuse includes a first layer of polycrystalline material on a substrate and a second layer of a silicide material on the first layer. The first and second layers are shaped to...
US20140239440 Thin Beam Deposited Fuse  
A back-end-of-line thin ion beam deposited fuse (204) is deposited without etching to connect first and second last metal interconnect structures (110, 120) formed with last metal layers (LM) in a...
US20110256709 LEVEL POSTURE SENSING CHIP AND ITS MANUFACTURING METHOD, LEVEL POSTURE SENSOR  
The present invention discloses a gas pendulum style level posture sensing chip and its manufacturing method and a level posture sensor. The gas pendulum style level posture sensing chip includes:...
US20080032493 Semiconductor device  
A semiconductor device includes a fuse wire, a portion to be fused that overlies the fuse wire with an insulation film interposed therebetween, and a plug connecting the portion to be fused and...
US20150041950 CONDUCTOR WITH SUB-LITHOGRAPHIC SELF-ALIGNED 3D CONFINEMENT  
A three-dimensionally (3d) confined conductor advantageously used as an electronic fuse and self-aligned methods of forming the same. By non-conformal deposition of a dielectric film over raised...
US20070222029 Semiconductor device having a fuse element  
A portion to be melted of a fuse is surrounded by plates, so that heat to be generated in a meltdown portion of the fuse under current supply can be confined or accumulated in the vicinity of the...

Matches 1 - 50 out of 175 1 2 3 4 >