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US20120231556 ETCH TOOL PROCESS INDICATOR METHOD AND APPARATUS  
A method for providing a process indicator for an etching chamber is provided. A wafer with a blanket etch layer is provided into the etching chamber. A blanket etch is performed on the blanket...
US20050288815 Semiconductor device manufacturing information service system and server used in the same  
A semiconductor device manufacturing information service system comprises: step control servers, etc. that collect and store manufacturing data indicating the manufacturing result and/or quality...
US20140004626 TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING  
Methods for chemical mechanical polishing (CMP) of semiconductor substrates, and more particularly to temperature control during such chemical mechanical polishing are provided. In one aspect, the...
US20140170781 DOUBLE SIDE POLISHER WITH PLATEN PARALLELISM CONTROL  
A platen for polishing a surface of a wafer has a reaction plate, a polishing plate, and a bladder. The reaction plate has a top and bottom surface, and defines a longitudinal axis. The polishing...
US20140141536 Method and System for Providing a Target Design Displaying High Sensitivity to Scanner Focus Change  
A segmented mask includes a set of cell structures, wherein each cell structure includes a set of features having an unresolvable segmentation pitch along a first direction, wherein the...
US20120208301 Methods and Systems for Creating or Performing a Dynamic Sampling Scheme for a Process During Which Measurements Are Performed on Wafers  
Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic...
US20130069169 ECO LOGIC CELL AND DESIGN CHANGE METHOD USING ECO LOGIC CELL  
The function of logic cells may be changed by altering their metal routing. Logic cells altered in this manner may be used to correct, substitute, or otherwise alter the operation of logic blocks...
US20140377885 PROCESS FLOW FOR REPLACEMENT METAL GATE TRANSISTORS  
A replacement metal gate transistor and methods of forming replacement metal gate transistors are described. Various examples provide methods of manufacturing a replacement metal gate transistor...
US20150170917 SYSTEMS AND METHODS FOR INTELLIGENT DISPATCHING FOR WAFER PROCESSING  
Systems and methods are provided for ion implantation. For example, ion implantation is performed using a first ion implant tool. At least one condition parameter associated with the first ion...
US20070266365 Integrated Circuit Design Meethod, Design Assistance Program and Integrated Circuit Design System Using Such Integrated Circuit Design Method  
[PROBLEMS] To provide an integrated circuit design method realized as a photomask/photomaskless fusion method wherein a photomask trial method and a photomaskless trial method are fused with each...
US20140141537 PRODUCTION OF HIGH PRECIPITATE DENSITY WAFERS BY ACTIVATION OF INACTIVE OXYGEN PRECIPITATE NUCLEI  
Processes for the treatment of silicon wafers to form a high density non-uniform distribution of oxygen precipitate nuclei therein such that, upon being subjected to the heat treatment cycles of...
US20140342471 Variable Doping Of Solar Cells  
A system and method for determining the edge or region where a saw first enters a silicon brick, and using this information to process this region differently is disclosed. This region, referred...
US20150050752 METHODS FOR CLEANING A WAFER EDGE INCLUDING A NOTCH  
In a method for removing metal at the edge of a wafer, including from a notch in the edge of the wafer, water is dripped or otherwise supplied onto the up-facing metal-plated front side of the...
US20150072444 Reducing Wafer Bonding Misalignment By Varying Thermal Treatment Prior To Bonding  
A bonding layer of the first wafer article is thermally treated and a bonding layer of a second wafer article is thermally treated in accordance with first and second process parameters,...
US20120231555 ADAPTIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICAL POLISHING  
The present disclosure provides a semiconductor manufacturing method. The method includes defining a plurality of time regions of pad life for a polishing pad in a chemical mechanical polishing...
US20140273293 Portable Wireless Sensor  
The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a portable device. The portable device includes first and second sensors that...
US20130210171 METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL MISALIGNMENT  
A method for bonding a first wafer on a second wafer by molecular adhesion, where the wafers have an initial radial misalignment between them. The method includes bringing the two wafers into...
US20120115256 METHOD AND DEVICE FOR SELECTIVELY ADDING TIMING MARGIN IN AN INTEGRATED CIRCUIT  
A method, system, and integrated circuit including selectively added timing margin. The method, for integrating statistical timing and automatic test pattern generation (ATPG) to selectively add...
US20110229987 METHOD FOR LOW TEMPERATURE ION IMPLANTATION  
Techniques for low temperature ion implantation are provided to improve throughput. Specifically, the pressure of the backside gas may temporarily, continually or continuously increase before the...
US20140356981 WAFER BONDING MISALIGNMENT REDUCTION  
A method for wafer bonding includes measuring grid distortion for a mated pairing of wafers to be bonded to determine if misalignment exists between the wafers. During processing of subsequent...
US20150170968 PACKAGE BOARD DIVISION METHOD  
A package board division method including: a step of detecting an index size between each two adjacent scheduled division lines from position coordinates of each of scheduled division lines, a...
US20110177623 Active Tribology Management of CMP Polishing Material  
An arrangement and method for managing the tribology associated with a chemical mechanical planarization (CMP) process continuously monitors and modifies the properties of a polishing slurry in...
US20140323035 RANDOM DELAY GENERATION FOR THIN-FILM TRANSISTOR BASED CIRCUITS  
Circuits and circuit elements configured to generate a random delay, a monostable oscillator, circuits configured to broadcasting repetitive messages wireless systems, and methods for forming such...
US20130026567 FINFET DRIVE STRENGTH MODIFICATION  
A method and circuit in which the drive strength of a FinFET transistor can be selectively modified, and in particular can be selectively reduced, by omitting the LDD extension formation in the...
US20130196454 VAPOR DEPOSITION METHOD, VAPOR DEPOSITION DEVICE AND ORGANIC EL DISPLAY DEVICE  
A coating film (90) is formed by causing vapor deposition particles (91) discharged from a vapor deposition source opening (61) of a vapor deposition source (60) to pass through a space between a...
US20080001097 Electron beam drawing apparatus, electron beam drawing method, and a semiconductor device manufacturing method  
An electron beam drawing apparatus includes an acquisition unit which acquires a position data of an Nth drawing area, an acquisition unit which acquires a stage position and speed, a prediction...
US20080176343 Method For Smart Dummy Insertion To Reduce Run Time And Dummy Count  
A method involves providing a circuit pattern, generating a density report for the circuit pattern that identifies a feasible area for dummy insertion, simulating a planarization process with the...
US20100279435 TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING  
A chemical mechanical polishing apparatus including a platen for holding a pad having a polishing surface, a subsystem for holding a substrate and the polishing surface together during a polishing...
US20120252141 Adaptive Recipe Selector  
The invention provides a method of processing a wafer using Ion Energy (IE)-related multilayer process sequences and Ion Energy Controlled Multi-Input/Multi-Output (IEC-MIMO) models and libraries...
US20130273669 Method for improving Uniformity of Chemical-Mechanical Planarization Process  
The invention provides a method for improving uniformity of chemical-mechanical planarization process, comprising the steps of: forming features on a substrate; forming a first dielectric...
US20150235858 WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT DEVICE MANUFACTURING PROCESSES  
A wafer polishing process includes polishing a central area on the back side of a wafer, polishing a peripheral area on the back side of the wafer, buffing the central area, and buffing the...
US20140073067 WAFER PROCESSING METHOD  
A wafer processing method divides a wafer along a plurality of crossing streets formed on the front side of the wafer to thereby partition a plurality of regions where a plurality of devices are...
US20120129275 DUAL-BULB LAMPHEAD CONTROL METHODOLOGY  
The present invention generally relates to methods of controlling UV lamp output to increase irradiance uniformity. The methods generally include determining a baseline irradiance within a...
US20140138823 VARIABLE-SIZE SOLDER BUMP STRUCTURES FOR INTEGRATED CIRCUIT PACKAGING  
One embodiment of the present invention sets forth an integrated circuit package including a substrate, an integrated circuit die, a first plurality of solder bump structures, and a first...
US20130011936 SELECTIVE ETCHING BATH METHODS  
An etching method. The method includes etching a first plurality of silicon wafers in a first enchant, each silicon wafer having SiO2 and Si3N4 deposited thereon, where the etching includes...
US20140332931 Compensation Devices  
Methods, apparatuses and devices related to the manufacturing of compensation devices are provided. In some cases, an n/p-codoped layer is deposited for calibration purposes to minimize a net...
US20120253497 Contact Processing Using Multi-Input/Multi-Output (MIMO) Models  
The invention provides a systems and methods for creating Double Pattern (DP) structures on a patterned wafer in real-time using Dual Pattern Contact-Etch (DPCE) processing sequences and...
US20150255356 SUBSTRATE BAKING DEVICE AND TEMPERATURE ADJUSTING METHOD THEREOF  
The present disclosure discloses a substrate baking device and a method for adjusting temperatures thereof. The substrate baking device comprises a baking device body having a hot plate composed...
US20090162950 DRY ETCHING EQUIPMENT AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE  
A dry etching equipment includes a topography simulator and a control section. The topography simulator controls an amount of deposition species incident upon a sidewall to be processed in...
US20140024142 SPECTRAL REFLECTOMETRY WINDOW HEATER  
A plasma processing tool for fabricating a semiconductor device on a semiconductor wafer includes an optical window disposed on a plasma chamber, remotely from a plasma region. The window is...
US20150198782 PACKAGING MEMS IN FLUIDIC ENVIRONMENTS  
A method and apparatus for packaging a MEMS device is disclosed that includes a MEMS die mounting surface, a MEMS device disposed on the mounting surface, and a fluid contained within the package...
US20090029487 SEMICONDUCTOR PRODUCTION METHOD AND SEMICONDUCTOR PRODUCTION DEVICE  
The objective of the present invention is to prevent the variation in an ashing rate according to a temporal change within an ashing chamber. Then, in order to maintain the ashing rate, the...
US20110244601 METHOD FOR PRODUCING A SUBSTRATE INCLUDING A STEP OF THINNING WITH STOP WHEN A POROUS ZONE IS DETECTED  
A method for producing a substrate including a step of thinning the thickness of the substrate is disclosed. The method is characterized in that it includes the following steps: the formation of a...
US20100297781 METHOD FOR MANUFACTURING MEMS STRUCTURES  
A method for manufacturing MEMS structures having at least one functional layer of silicon that contains structures that are exposed by removing a sacrificial layer, at least one sacrificial layer...
US20150225231 MEMS DEVICE AND METHOD FOR PRODUCING AN MEMS DEVICE OPERATING WITH ACOUSTIC WAVES  
The present invention relates to a method for producing an MEMS device (1) operating with acoustic waves. The method comprises the steps of producing an MEMS component (2) operating with acoustic...
US20110045611 METHOD OF INITIATING MOLECULAR BONDING  
The invention relates to a method of initiating molecular bonding, comprising bringing one face (31) of a first wafer (30) to face one face (21) of a second wafer (20) and initiating a point of...
US20140256065 ETCHING METHOD  
There is provided an etching method. A temperature at a plurality of predetermined positions on an upper surface of an Si substrate is measured during the etching processing. The etching...
US20140346650 SYSTEMS AND METHODS FOR THIN-FILM DEPOSITION OF METAL OXIDES USING EXCITED NITROGEN-OXYGEN SPECIES  
The present invention relates to a process and system for depositing a thin film onto a substrate. One aspect of the invention is depositing a thin film metal oxide layer using atomic layer...
US20110275166 SYSTEMS AND METHODS FOR THIN-FILM DEPOSITION OF METAL OXIDES USING EXCITED NITROGEN-OXYGEN SPECIES  
The present invention relates to a process and system for depositing a thin film onto a substrate. One aspect of the invention is depositing a thin film metal oxide layer using atomic layer...
US20140308762 ADJUSTABLE DUMMY FILL  
A method of placing a dummy fill layer on a substrate is disclosed (FIG. 2). The method includes identifying a sub-region of the substrate (210). A density of a layer in the sub-region is...