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US20110045638 HEAT RESISTANT MASKING TAPE AND USAGE THEREOF  
The present invention provides a masking tape which can be easily released without leaving an adhesive residue. A heat resistant masking tape, comprising (1) a heat resistant backing film layer,...
US20110312132 METHOD FOR POSITIONING CHIPS DURING THE PRODUCTION OF A RECONSTITUTED WAFER  
A process for fabricating a reconstituted wafer that includes chips having connection pads on a front side side of the chip, this process including positioning of the chips on an adhesive support,...
US20130285243 EASILY ASSEMBLED CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD  
A chip assembly includes a PCB, a connecting pad fixed on the PCB, and a chip. The connecting pad defines a through hole. The chip is received in the through hole and fixed on the PCB by an...
US20140252399 ELECTRONIC PACKAGING SUBSTRATE WITH ETCHING INDENTATION AS DIE ATTACHMENT ANCHOR AND METHOD OF MANUFACTURING THE SAME  
An electronics package is disclosed. The electronics package is disclosed as including a substrate core, a metal layer established on top of the substrate core, the metal layer being etched so as...
US20090283876 ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONTINUOUS OR NEAR-CONTINUOUS PERIPHERAL CONDUCTING SEAL AND A CONDUCTING LID  
A semiconductor package structure including a conductive adhesive material which is used to form an electromagnetic interference shield-forming Faraday cage. The Faraday cage incorporates a module...
US20110080718 INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD  
An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a first conductive plate including a first...
US20070212819 Silicone Adhesive  
The present invention provides a silicone adhesive not reducing wire bondability and not reducing the adhesion of the surface of a semiconductor pellet and a lead frame to sealing resin....
US20130069218 HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND METHOD OF MAKING THE SAME  
The integrated circuit packaging techniques of the disclosed embodiments utilize a thermally conductive heat sink to partially enclose an integrated circuit. The heat sink is separated from the...
US20120217614 POWER CONVERTOR DEVICE AND CONSTRUCTION METHODS  
In one aspect, the present invention relates generally to integrated circuit (IC) packages and more specific to some embodiments of IC power convertor technologies. In particular, IC packages that...
US20120241959 MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER  
The present invention relates to a method of bonding a chip to an external electric circuit. The conductors of the external electric circuit for connection to the chip are formed with physical...
US20100301464 ASTERISK PAD  
A method and structure for a semiconductor device can include a chip support having a one or more elongated structures formed in the chip support The elongated structures, which have a width and a...
US20140087522 Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure  
A die includes a metal pad, a passivation layer, and a patterned buffer layer over the passivation layer. The patterned buffer layer includes a plurality of discrete portions separated from each...
US20140070999 RADIATION EFFICIENT INTEGRATED ANTENNA  
An apparatus includes a dielectric slab having first and opposing second major surfaces. A planar antenna element is located on the first major surface. A via formed through the dielectric slab is...
US20080164587 MOLDING COMPOUND FLOW CONTROLLER  
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
US20090253232 Microwave Cure of Semiconductor Devices  
A method for curing an adhesive is disclosed. A preferred embodiment comprises securing a cover onto a substrate to enclose a MEMs device using an adhesive. The adhesive is either partially or...
US20120070931 METHODS FOR REDUCED STRESS ANCHORS  
Methods of anchoring components of a Micro-Electro-Mechanical Systems (MEMS) device to a substrate. An exemplary embodiment has a trace anchor bonded to a substrate, a device anchor bonded to the...
US20090152738 INTEGRATED CIRCUIT PACKAGE HAVING BOTTOM-SIDE STIFFENER  
Embodiments of a bottom-side stiffening element are disclosed. The stiffening element may be disposed between an integrated circuit package and an underlying circuit board. In some embodiments,...
US20130168852 MEMS Devices and Methods of Forming Same  
A microelectromechanical system (MEMS) device may include a MEMS structure over a first substrate. The MEMS structure comprises a movable element. Depositing a first conductive material over the...
US20140175658 ANCHORING A TRACE ON A SUBSTRATE TO REDUCE PEELING OF THE TRACE  
Sonic implementations pertain to a semiconductor device that includes a packaging substrate, a trace coupled to the packaging substrate, and a solder resist layer that covers part of the trace....
US20110065238 PROTECTION LAYER FOR ADHESIVE MATERIAL AT WAFER EDGE  
A wafer is attached to a carrier by using an adhesive layer, and a portion of the adhesive layer is exposed adjacent to an edge of the wafer. After thinning the wafer, a protection layer is...
US20120293964 POWER ELECTRONIC MODULE WITH NON-LINEAR RESISTIVE FIELD GRADING AND METHOD FOR ITS MANUFACTURING  
Exemplary embodiments are directed to a power electronic device with an electronic device including a substrate, a metal layer formed on the substrate and a field grading means located along an...
US20120094435 METHOD OF FABRICATION OF AI/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM  
A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique...
US20150187679 Lid Design for Heat Dissipation Enhancement of Die Package  
Embodiments of a lid covering a device die improving heat dissipation for a die package are described. Trenches are formed on the bottom side of a lid to increase surface area for heat...
US20140080261 METHOD FOR FABRICATING A CHIP HAVING A WATER-REPELLENT OBVERSE SURFACE AND A HYDROPHILIC REVERSE SURFACE  
In order to provide a novel method for producing a chip having a water-repellent obverse surface and a hydrophilic reverse surface, the characteristic of the present disclosure lies in that the...
US20130062722 CHIP MODULE AND A METHOD FOR MANUFACTURING A CHIP MODULE  
In various embodiments, a chip module may include a first chip; and a leadframe with a first leadframe area and a second leadframe area, wherein the first leadframe area is electrically insulated...
US20100059899 IC CARD AND MANUFACTURING METHOD THEREOF  
This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the...
US20150156869 MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTING STRUCTURES FOR HIGH DENSITY PACKAGING  
Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a...
US20150214127 INTEGRATED DEVICE COMPRISING A SUBSTRATE WITH ALIGNING TRENCH AND/OR COOLING CAVITY  
Some features pertain to an integrated device that includes a substrate. The substrate includes a first cavity (e.g., trench). The first cavity includes a first edge that is non-vertical. The...
US20140346658 FABRICATING A MICROELECTRONICS LID USING SOL-GEL PROCESSING  
A method for fabrication of a lid for a microelectronic device is described, wherein the microelectronic device comprises of a die and a laminate. A gel is formed having a coefficient of thermal...
US20120112764 METHOD OF MAKING A FINGER SENSOR PACKAGE AND ASSOCIATED DEVICES  
A method of making finger sensor packages may include advancing a flexible circuit tape along a predetermined path of travel. The flexible circuit tape may include a flexible layer and conductive...
US20110132449 MULTILAYER FILM FOR ENCAPSULATING OXYGEN AND/OR MOISTURE SENSITIVE ELECTRONIC DEVICES  
The present invention refers to a multilayer barrier film capable of encapsulating a moisture and/or oxygen sensitive electronic or optoelectronic device, the barrier film comprises at least one...
US20130309814 LID ATTACH PROCESS  
Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is...
US20130196471 STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS  
A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying...
US20110108966 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing a conductive layer having a first surface and a second surface; forming first concave trenches in the first...
US20120094442 METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BUMP/BASE/LEDGE HEAT SPREADER, DUAL ADHESIVES AND A CAVITY IN THE BUMP  
A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting a first adhesive on the ledge including inserting the bump into an opening in the first adhesive,...
US20090081829 METHOD OF ADHERING WIRE BOND LOOPS TO REDUCE LOOP HEIGHT  
A method of reducing wire bond loop heights in wire bonds electrically connecting an integrated circuit die with a contact pad to a printed circuit board with a conductor, by mounting the...
US20140225283 WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE  
A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is...
US20120068363 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLES AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle;...
US20120299201 Use of a Local Constraint to Enhance Attachment of an IC Device to a Mounting Platform  
An embodiment is directed to an IC mounting assembly that comprises an IC device having a first planar surface, wherein multiple electrically conductive first terminals are located at the first...
US20120244664 REDUCING WARPAGE FOR FAN-OUT WAFER LEVEL PACKAGING  
Fan-out wafer level packaging includes an integrated circuit having a top surface, a bottom surface, a plurality of side surfaces, and a bond pad defined on the top surface. A layer of encapsulant...
US20130193566 Integrated Circuit Shielding Film and Manufacturing Method Thereof  
An integrated circuit shielding film and a manufacturing method thereof. The manufacturing method provides a plate. A stripping glue is coated on the plate. An integrated circuit is disposed on...
US20070105275 Apparatus for positioning power semiconductor modules and method for surface treatment thereof  
An apparatus and an associated method for receiving and positioning a plurality of spaced-apart power semiconductor modules using a molded positioning body. The molded positioning body has a...
US20120241926 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOF  
A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an integrated circuit adjacent the lead; molding an encapsulation encapsulating the lead and...
US20060159930 Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same  
An adhesive comprises a base material which generates adhesive strength through curing, a hardening agent which promotes the curing of the base material, and a filler. In order to solve the...
US20090263214 FIXTURE FOR P-THROUGH SILICON VIA ASSEMBLY  
A silicon-based wafer such as a TSV interposer wafer having a first and second surfaces wherein a glass carrier is mounted on the second surface by a UV tape is held by a vacuum holder applied on...
US20090152691 LEADFRAME HAVING DIE ATTACH PAD WITH DELAMINATION AND CRACK-ARRESTING FEATURES  
One aspect of the invention pertains to a semiconductor package having a die and a die attach pad with a plurality of spaced apart pedestals supported by a web. A die is mounted on the die attach...
US20130277813 CHIP PACKAGE AND METHOD OF FORMING THE SAME  
Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip...
US20110039374 METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BUMP/BASE HEAT SPREADER AND A CAVITY IN THE BUMP  
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump, a base and a flange. The conductive trace...
US20120149155 Electronic Assemblies Including Mechanically Secured Protruding Bonding Conductor Joints  
A method for joining integrated circuit (IC) die. The includes pressing the IC die toward a workpiece so that a protruding bonding feature is inserted into a cavity of a receptacle through an...
US20140183750 ULTRATHIN BURIED DIE MODULE AND METHOD OF MANUFACTURING THEREOF  
A method of forming a buried die module includes providing an initial laminate flex layer and forming a die opening through the initial laminate flex layer. A first uncut laminate flex layer is...