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US20070096281 Implantable microelectronic device and method of manufacture  
An implantable hermetically sealed microelectronic device, and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such...
US20060216860 Flip chip interconnection having narrow interconnection sites on the substrate  
A flip chip interconnect of a die on a substrate is made by mating the interconnect bump onto a narrow interconnect pad on a lead or trace, rather than onto a capture pad. The width of the narrow...
US20050215078 Scribing sapphire substrates with a solid state UV laser  
A process and system scribe sapphire substrates, by performing the steps of mounting a sapphire substrate, carrying an array of integrated device die, on a stage such as a movable X-Y stage...
US20050170658 Methods for preparing ball grid array substrates via use of a laser  
The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire...
US20080179404 METHODS AND APPARATUSES TO PRODUCE INLAYS WITH TRANSPONDERS  
A transponder chip module is recessed into the surface of a substrate, end portions of an antenna wire are held in place on terminal areas of the chip module by a patch which may be transparent to...
US20080241992 Method of assembling chips  
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the...
US20060252181 Method of forming a stack of packaged memory dice  
A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor...
US20050156297 Semiconductor package including flex circuit, interconnects and dense array external contacts  
A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex...
US20060033188 Electronic component packaging  
One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component and including a mechanically planarized sealing surface, and a lid...
US20070031992 Apparatuses and methods facilitating functional block deposition  
A guiding feature used to assist deposition of a functional block into a recessed region formed in a substrate. A template is used to create the guiding feature on a substrate. The template...
US20060035408 Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components  
A method for designing a spacer to be used in a stacked multi-chip module includes configuring a spacer layer that is nonconfluent or includes voids. The spacer layer is configured to at least...
US20050238881 Semiconductor assembly using dual-cure die attach adhesive  
A semiconductor assembly comprising a semiconductor chip on a substrate is adhered to the substrate using a dual cure B-stageable adhesive comprising two chemical compositions, (i) a first...
US20150279782 SEMICONDUCTOR DEVICE  
A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the...
US20060278331 Membrane-based chip tooling  
A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable...
US20060223230 SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME  
A semiconductor package substrate and a method for fabricating the same are proposed. An insulating layer has a plurality of blind vias to expose inner traces underneath the insulating layer. A...
US20060189030 Heat shrinkable insulated packaging  
A method for preparing an insulating packaging material for a container is disclosed. A first layer of insulating material can be placed around a container, a second layer of heat-shrinkable...
US20050230821 Semiconductor packages, and methods of forming semiconductor packages  
The invention includes semiconductor packages having a patterned substrate with openings extending therethrough, conductive circuit traces over the substrate and having portions extending over the...
US20050214973 Semiconductor device and manufacturing method thereof  
In manufacturing a semiconductor device, the first gettering layer is formed on the backside of a wafer, and the second gettering layers are then formed on the backside and side surfaces of a...
US20080308308 METHOD OF MANUFACTURING WIRING BOARD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRING BOARD  
A semiconductor device 100 has such a structure that a semiconductor chip 110 is flip chip mounted on a wiring board 120. The wiring board 120 has a multilayer structure in which a plurality of...
US20060252180 Method for a low profile multi-IC chip package connector  
A method for a low profile multi-IC chip package for high-speed applications comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor...
US20090267219 ULTRA-THIN CHIP PACKAGING  
A packaging method involves attaching a first chip to a stable base, forming contact pads at locations on the stable base, applying a medium onto the stable base such that it electrically...
US20080003712 Methods of making semiconductor fuses  
A method for a low profile multi-IC chip package for high-speed applications comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor...
US20060157838 Multimedia card and transfer molding method  
A semiconductor card is made using a method which, in one molding step, forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral...
US20050227411 Methods for fabricating electronic components to include supports for conductive structures  
A method for fabricating an electronic component, such as a semiconductor device, carrier, or other semiconductor device component, includes providing a support around at least a portion of a...
US20050023663 Method of forming a package  
A method of forming a package. The method includes attaching a device to a baseplate to form a subassembly, and placing the subassembly into an opening defined by a cover that includes a plastic...
US20070166876 Components, methods and assemblies for multi-chip packages  
An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged...
US20070117262 Low Profile Stacking System and Method  
The present invention provides a system and method that amounts integrated circuit devices onto substrates and a system and method for employing the method in stacked modules. The contact pads of...
US20050048696 Microbeam assembly and associated method for integrated circuit interconnection to substrates  
A microbeam interconnection method is provided to connect integrated circuit bond pads to substrate contacts. Conductive leads (microbeams) are releasably formed, by a process such as...
US20140117538 PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF  
A fabrication method of a package structure is provided, which includes the steps of: providing an interposer having a plurality of recess holes; forming a conductive bump in a lower portion of...
US20090032941 Under Bump Routing Layer Method and Apparatus  
Various semiconductor chip conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure...
US20080079129 Shape memory based mechanical enabling mechanism  
Semiconductor packages and methods to fabricate thereof are described. A decoupling assembly is disposed between a package substrate and a circuit board. The decoupling assembly engages in...
US20060255446 Stacked modules and method  
The present invention stacks integrated circuits into modules that conserve board surface area. In a precursor assembly devised as a component for a stacked circuit module in accordance with a...
US20060134826 Methods of forming semiconductor packages  
The invention includes semiconductor packages having a patterned substrate with openings extending therethrough, conductive circuit traces over the substrate and having portions extending over the...
US20050208704 Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof  
Methods for fabricating carrier substrates and other semiconductor device components include disposing a collar around at least a portion of a contact. The collar may be formed by a programmed...
US20050064626 Connection components with anistropic conductive material interconnector  
A connection component for a microelectronic element includes a body of dielectric material having opposing first and second surfaces. A plurality of elongated leads extend through the body...
US20160103369 LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF  
There is provided a high-quality liquid crystal display device that improves viewing angle characteristics and display contrast in low afterglow. A liquid crystal display device includes: a TFT...
US20060199301 Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there from  
Disclosed is a method for making a low CTE curable composition. In one embodiment, the method comprises mixing together (i) from 0.1 to 60.0% by weight of a nanoparticle composition and (ii) from...
US20050168306 MEMS device with integral packaging  
A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is...
US20090184414 WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME  
A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer,...
US20080108178 THERMOPLASTIC FLUXING UNDERFILL METHOD  
A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step...
US20070111380 Fabricating method of printed circuit board having embedded component  
A method of fabricating a printed circuit board having embedded components is disclosed. The method of fabricating a printed circuit board having embedded components according to an embodiment of...
US20070020807 Protective structures and methods of fabricating protective structures over wafers  
A method of fabricating a protective structure and a packaged structure are described.
US20060194366 MULTI-CHIP BALL GRID ARRAY PACKAGE  
A multi-chip BGA package has two or more rerouted chips, each of which has one or more electrode plates. The electrode plate is coplanar with rerouting lines on the rerouted chip and may act as a...
US20060170086 Semiconductor package and method of manufacturing the same  
Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and...
US20070226996 HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME  
An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by...
US20060051891 Methods for packaging image sensitive electronic devices  
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the...
US20050221533 Method of making chip package with grease heat sink  
The present invention relates to enhanced protection of the active surface and the bond wires or ball array of a microelectronic device, and to thermal management of the microelectronic device as...
US20130168803 Semiconductor-On-Insulator Devices and Associated Methods  
Semiconductor-on-insulator (SOI) devices and associated methods are provided. In one aspect, for example, a method for making a SOI device can include forming a device layer on a front side of a...
US20120077313 SEMICONDUCTOR DEVICE MANUFACTURING METHOD  
In a semiconductor device manufacturing method, a first resin layer with optical transmission restrained is formed on a supporting substrate and a second resin layer made of thermoplastic resin is...
US20090029471 Microelectromechanical devices useful for manipulating cells or embryos, kits thereof, methods of making same, and methods of use thereof  
The present invention relates generally to microelectromechanical systems (MEMS) devices for the manipulation of cells or groups of cells, such as oocytes, embryos, and sperm. In particular, the...
Matches 1 - 50 out of 350 1 2 3 4 5 6 7 >