Matches 1 - 25 out of 25


Match Document Document Title
US20080286701 METHOD FOR KINETICALLY CONTROLLED ETCHING OF COPPER  
An etching composition, particularly for kinetically controlled etching of copper and copper alloy surfaces; a process for etching copper and copper alloys, particularly for etching at high rates...
US20050123845 Method of adjusting deviation of critical dimension of patterns  
A method of adjusting a deviation of a critical dimension of patterns formed by a photolithography process is disclosed. The method comprises measuring the deviation of the critical dimension of...
US20060051974 Mask and manufacturing method using mask  
A mask 12 includes half-tone layer 16 and light blocking layer 20. The half-tone layer 16 is of silicon rich silicon nitride SiNx:H. x may be in the range 0 to 1, preferably 0.2 to 0.6, so that...
US20050008983 Wide temperature range chuck system  
An apparatus for supporting a workpiece in a process chamber is provided, comprising a first “hot” chuck having a surface for supporting the workpiece, the hot chuck including electrical heating...
US20060003271 Basic supercritical solutions for quenching and developing photoresists  
A basic supercritical solution formulated to include at least one supercritical fluid and a base may be used to quench a photo-generated acid within a photoresist as well as develop the...
US20080280235 Non-Aqueous Photoresist Stripper That Inhibits Galvanic Corrosion  
Photoresist strippers and cleaning compositions of this invention are provided by non-aqueous, non-corrosive cleaning compositions that resist galvanic corrosion when used on stacked layer...
US20070202446 Semiconductor device fabrication method having step of removing photo-resist film or the like, and photo-resist film removal device  
In the step of removing the photo-resist film formed on a substrate, dry ice particles, with a predetermined particle size, are blasted onto the photo-resist film at a predetermined pressure in a...
US20130273479 PROCESSESS AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES  
Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel...
US20120077132 PROCESSESS AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES  
Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel...
US20060188826 Method for utilizing dry film  
A method for utilizing a dry film is provided. A dry film is pressed onto a substrate, such as a wafer. The dry film includes a photoresist layer tightly attached to the substrate and an exposed...
US20060040216 Method of patterning photoresist film  
A method for patterning a photoresist film provided on a substrate can include exposing the photoresist film, and developing the photoresist film with a developer including a thinner. The method...
US20110200951 METHOD FOR REMOVING PHOTORESIST PATTERN  
Disclosed is a method of removing a photoresist pattern, which includes radiating light onto a substrate having a photoresist pattern formed thereon and implanted with a predetermined dopant so...
US20050106508 Method of fabricating devices and observing the same  
In fabricating process using a light beam or electron beam, reactivity is determined by the total amounts of photons or electrons absorbed by resist and consequently, fine fabrication cannot be...
US20050079451 Processes for treating a substrate and removing resist from a substrate  
The invention includes a process whereby a solvent is utilized to remove soluble portions of a resist, and subsequently the solvent can be removed with a gas-fortified liquid. In particular...
US20080085480 Method to remove resist layers from a substrate  
A method for removing a resist layer from a substrate is described. The method for removing a resist layer from a substrate, wherein the resist layer comprises bulk resist contacting the substrate...
US20050227187 Ionic fluid in supercritical fluid for semiconductor processing  
A method of removing post-etch residue from a patterned low-k dielectric layer is disclosed. The low-k dielectric layer preferably comprises a porous silicon oxide-based material with the...
US20070122752 SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SUBSTRATE PROCESSING SYSTEM  
A semiconductor device manufacturing method includes: forming an etching mask having a predetermined circuit pattern on a surface of an etching target film disposed on a semiconductor substrate;...
US20080076076 REWORK METHODOLOGY THAT PRESERVES GATE PERFORMANCE  
In one embodiment, a method of manufacturing an integrated circuit that comprises forming a circuit layer over a substrate, forming a resist layer on the circuit layer, and subjecting the resist...
US20070262300 METHOD OF FORMING FINE PATTERN USING AZOBENZENE-FUNCTIONALIZED POLYMER AND METHOD OF MANUFACTURING NITRIDE-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE METHOD OF FORMING FINE PATTERN  
Provided is a method of forming a fine pattern having a pattern dimension of 1 μm or less, repeatedly with reproducibility. The method of forming the fine pattern includes: forming an...
US20080261384 METHOD OF REMOVING PHOTORESIST LAYER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME  
A method of removing a photoresist layer is provided. An ion implantation process has been performed on the photoresist layer to transform a surface of the photoresist layer to a crust and a soft...
US20050158664 Method of integrating post-etching cleaning process with deposition for semiconductor device  
A method of integrating a post-etching cleaning process with deposition for a semiconductor device. A substrate having a damascene structure formed by etching a dielectric layer formed thereon...
US20050158671 Method for manufacturing a semiconductor device and a cleaning device for stripping resist  
A method for manufacturing a semiconductor device and a cleaning device for stripping resist provide semiconductor device with superior element characteristic in a sufficient yield, in such away...
US20050250054 Development of photolithographic masks for semiconductors  
A method of forming a photolithographic mask for use in fabricating a semiconductor device is provided. The method includes forming a layer of photoresist material on a wafer and exposing the...
US20150355551 SYSTEMS FOR REMOVING PHOTORESISTS AND METHODS OF REMOVING PHOTORESISTS USING THE SAME  
A system for removing a photoresist includes a solution storage configured to store a preliminary photoresist removal solution, a solution activation unit configured to convert the preliminary...
US20140377951 Apparatus and Method for Removing Challenging Polymer Films and Structures from Semiconductor Wafers  
The present apparatus and method are configured to remove challenging polymer films and structures from semiconductor wafers. This technique involves the use of a double soak and spray sequence...

Matches 1 - 25 out of 25