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US20130230740 |
METAL BONDED STRUCTURE AND METAL BONDING METHOD
After a microcrystalline layer having a grain size that is finer than that of a base member is formed on the surface of at least one of a first bonding portion and a second bonding portion, the... |
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US20150247244 |
THIN NIB OR COB CAPPING LAYER FOR NON-NOBLE METALLIC BONDING LANDING PADS
The invention relates to a substrate having at least one main surface comprising at least one non-noble metallic bonding landing pad covered by a capping layer thereby shielding the non-noble... |
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US20140353030 |
COMPOSITE WIRE AND CONTACT ELEMENT
The invention relates, in particular, to a composite wire which according to the invention has a structure having a core made of steel or a steel alloy and a copper alloy layer surrounding the core. |
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US20140037985 |
HIGH-STRENGTH TIN-PLATED BRONZE TIRE BEAD STEEL WIRE AND FABRICATING METHOD THEREOF
The present invention discloses a high-strength tin-plated bronze tire bead steel wire, which comprises a steel wire base body. The surface of the steel wire base body is provided with at least... |
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US20150179303 |
OXIDATION-RESISTANT ELONGATE ELECTRICALLY CONDUCTIVE ELEMENT
An elongate electrically conductive element has a core made of copper or copper alloy and at least one white-bronze layer encircling the core made of copper or copper alloy, wherein the... |
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US20130115478 |
ELECTRODEPOSITED METALLIC COATINGS COMPRISING COBALT WITH ENHANCED FATIGUE PROPERTIES
Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates... |
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US20130004793 |
COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURE FOR SAME
There is provided a copper alloy for electronic material which exhibits excellent plating uniformity. A copper alloy for electronic material, wherein, when its cross section parallel to a rolling... |
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US20130189540 |
Cooper-Zinc-Manganese Alloys with Silvery-White Finish for Coinage and Token Applications
Alloys of copper and manganese and copper, manganese and zinc can be used for the production of coins, such as the U.S. five cent piece or “nickel.” With appropriate platings, these alloys can... |
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US20090297883 |
METALLIC COMPOSITE WIRE WITH AT LEAST TWO METALLIC LAYERS
A metallic composite wire has at least two metallic layers. One layer, preferably the inner layer, is a non-ferrous metal alloy. A second layer, preferably the outermost layer, consists of copper. |
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US20140311769 |
COMPOSITE CONDUCTOR AND ELECTRIC WIRE USING THE SAME
A composite conductor 10, including an internal layer 11 having a conductive material A, the conductive material A having fatigue strength of at least 150 MPa after being subjected to 106 cycles... |
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US20090075117 |
COMPOSITE ELECTRICAL CONDUCTOR AND METHOD FOR PRODUCING IT
An electrical composite conductor includes a CuAg alloy base having an Ag content of 0.08 to 0.12% and a CuMg alloy having a Mg content of 0.1 to 0.7%. The composite conductor further includes a... |
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US20130240257 |
COPPER FOIL FOR PRINTED WIRING BOARD
Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and... |
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US20120270070 |
HYBRID COPPER ALLOY REALIZING SIMULTANEOUSLY HIGH STRENGTH, HIGH ELASTIC MODULUS, HIGH CORROSION-RESISTANCE, WEAR RESISTANCE, AND HIGH CONDUCTIVITY AND MANUFACTURING METHOD THEREOF
Disclosed are a hybrid copper alloy with high strength, high elastic modulus, high corrosion-resistance, wear resistance, and high conductivity and a method for producing the same. The hybrid... |
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US20090297882 |
Brazing filler metal, brazing filler metal paste, and heat exchanger
A brazing filler metal includes quaternary alloy powder and copper powder. The quaternary allow powder consists of from 0.1 to 27.4 mass percent tin, from 0.8 to 5.1 mass percent nickel, from 2.2... |
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US20060147742 |
Composite copper foil, method of production thereof and high frequency transmission circuit using said composite copper foil
A composite copper foil excellent in conductivity and surface shape, having high strength and able to be used for applications such as high frequency transmission circuits and a method of... |
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US20150047884 |
Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board
Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart... |
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US20070071999 |
Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil
A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium... |
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US20070071998 |
Preferred copper plated finish and method of making same
A copper plated material having at least a surface that is pretreated, copper plated, heat treated, and having a predetermined color blend incorporated into the surface of the material is... |
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US20100304182 |
ELECTRODEPOSITED METALLIC-MATERIALS COMPRISING COBALT
Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates... |
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US20120009464 |
MATERIAL FOR METAL CASE OF SECONDARY BATTERY USING NON-AQUEOUS ELECTROLYTE, METAL CASE, SECONDARY BATTERY, AND PRODUCING METHOD OF MATERIAL FOR METAL CASE
The material for metal cases of secondary batteries using a non-aqueous electrolyte includes a steel sheet; and a plated layer that has a Ni layer, and a Cu—Ni layer, which is disposed between the... |
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US20140242405 |
FRICTION LINER
Grain-refined and amorphous metallic material based friction liners for braking devices as used, e.g., in motor vehicles such as cars, trucks, motorcycles, as well as bicycles and other... |
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US20100247959 |
SN-PLATED COPPER OR SN-PLATED COPPER ALLOY HAVING EXCELLENT HEAT RESISTANCE AND MANUFACTURING METHOD THEREOF
In Sn-plated copper or a Sn-plated copper alloy according to the present invention, a surface plating layer including a Ni layer, a Cu—Sn alloy layer, and a Sn layer which are deposited in this... |
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US20150037609 |
NANO-GRAINED MULTILAYER COPPER ALLOY SHEET HAVING HIGH STRENGTH AND HIGH ELECTRICAL CONDUCTIVITY, AND METHOD FOR MANUFACTURING SAME
In a high strength and high electrical conductive nano crystalline grain multi-layer copper alloy sheet, a plurality of high strength and high electrical conductive nano crystalline grain... |
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US20120270068 |
METHOD FOR MAKING COATED ARTICLE AND COATED ARTICLE THEREOF
A method for making a coated article includes the steps of: providing a substrate; forming a copper-cobalt target by a hot isostatic pressing process using copper powder and cobalt powder; forming... |
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US20110151273 |
LAMINATE FOR PRINTED CIRCUIT BOARD
A laminate for use in the production of a printed circuit board includes a main layer and a face layer made of a material different from the material that the main layer is made of. The main layer... |
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US20110177359 |
METALIZED PLASTIC ARTICLES AND METHODS THEREOF
Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a... |
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US20120270069 |
METHOD FOR MAKING COATED ARTICLE AND COATED ARTICLE THEREOF
A method for making a coated article includes the steps of: providing a substrate; forming a copper-iron target by a hot isostatic pressing process using copper powder and iron powder; forming a... |
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US20140141274 |
COPPER FOIL STRUCTURE HAVING BLACKENED ULTRA-THIN FOIL AND MANUFACTURING METHOD THEREOF
A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier... |
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US20120280217 |
ELECTRODE FOIL AND ORGANIC DEVICE
There are provided an electrode foil which has both the functions of a supporting base material and a reflective electrode and also has a superior thermal conductivity and heat resistance; and an... |
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US20140332961 |
Cu/CuMn BARRIER LAYER AND FABRICATING METHOD THEREOF
In the present invention, the pure Cu film is deposited on the CuMn film and the Mn atoms are induced to diffuse within the dielectric layer. The barrier properties of this self-forming barrier... |
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US20090297879 |
Structure and Method for Reliable Solder Joints
A solder joint (200) has a first contact pad 114 and a second contact pad 124 of a first metal, preferably copper, facing each other across a gap. A coat and 125, respectively) of a second metal,... |
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US20110250468 |
Metal Foil with Carrier
Provided is a metal foil with a carrier as a laminated body in which a carrier A and a metal foil B are placed alternately, wherein the metal foil with a carrier comprises a structure where the... |
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US20100215982 |
Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite
Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper... |
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US20150232244 |
COVER MATERIAL FOR HERMETIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT
This cover material for hermetic sealing is a cover material for hermetic sealing employed for a package for containing an electronic component. The cover material 1 for hermetic sealing is... |
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US20140283506 |
HEAT PIPE, COMPOSITE MATERIAL AND HEAT EXCHANGER
A heat pipe includes a metal cylindrical body including a sealed storage space for storing water, a heat absorbing portion at one end portion of the cylindrical body to absorb heat by means of... |
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US20150237724 |
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability... |
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US20140041910 |
Metal Foil Provided with Electrically Resistive Layer, and Board for Printed Circuit Using Said Metal Foil
Metal foil provided with an electrically resistive layer, characterized in that an alloy (in particular, a NiCrAlSi alloy) resistive layer containing 1 to 6 mass % of Si is formed on the metal... |
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US20050244620 |
Wired circuit board and production method thereof
A wired circuit board which is formed so that even when a wired circuit pattern is formed at a fine pitch and then a tin plating layer is formed on the wired circuit pattern by the electroless tin... |
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US20050031905 |
Magnetic recording medium and producing method thereof
To provide a magnetic recording medium with good record and reproduction characteristics. In the magnetic recording medium having an anodic oxidized alumina nanohole film filled with a magnetic... |
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US20140227557 |
SPUTTERING TARGET FOR FORMING PROTECTIVE FILM AND LAMINATED WIRING FILM
A sputtering target for forming protective film according to the invention is used to form protective film on one surface or both surfaces of a Cu wiring film, and includes 8.0 to 11.0% by mass of... |
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US20070160868 |
Brazing method and brazed structure
A method of brazing different types of metals by a low melting point brazing material is provided. First, a surface of a first metal member is covered by a material enabling brazing with a second... |
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US20170103825 |
HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY ROD OR WIRE
A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A... |
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US20160372421 |
FORMATION OF COPPER LAYER STRUCTURE WITH SELF ANNEAL STRAIN IMPROVEMENT
A copper layer structure includes a first copper layer, a second copper layer and a carbon-rich copper layer. The second copper layer is disposed over the first copper layer. The carbon-rich... |
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US20160319451 |
ELECTRICALLY CONDUCTIVE LIQUIDS BASED ON METAL-DIPHOSPHONATE COMPLEXES
The invention relates to electrically conducting liquids based on diphosphonate complexes and to the use thereof in methods for electrolytically modifying the surface of a flat metal workpiece.... |
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US20160201188 |
SPUTTERING TARGET FOR FORMING PROTECTIVE FILM AND MULTILAYER WIRING FILM
A sputtering target is provided for forming a protective film which is used for forming a protective film on a single surface or both surfaces of a Cu wiring film, the sputtering target including... |
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US20160186328 |
METAL PLATED WEAR AND MOISTURE RESISTANT COMPOSITE ACTUATOR
A component is provided including a body formed at least partially from a composite material. At least a portion of the composite material is covered by a plating. The plating includes a layer of... |
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US20160185605 |
COPPER SUBSTRATE FOR DEPOSITION OF GRAPHENE
Technologies are presented for growing graphene by chemical vapor deposition (CVD) on a high purity copper surface. The surface may be prepared by deposition of a high purity copper layer on a... |
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US20160121582 |
ELECTRIC CONNECTION AND METHOD OF MANUFACTURING THE SAME
An electric connection is provided, and has a first copper (Cu) layer, a second Cu layer, and a composite metal layer disposed between the first Cu layer and the second Cu layer. The composite... |
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US20160053396 |
FE-NI-P-RE MULTICOMPONENT ALLOY PLATING LAYER, AND ELECTRODEPOSITION PREPARATION METHOD AND APPLICATION THEREOF
Disclosed are a Fe—Ni—P-RE multicomponent alloy plating layer, and electrodeposition preparation method and application thereof. An alloy plating layer obtained via electrodeposition contains... |
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US20150299899 |
SUBSTRATE FOR EPITAXIAL GROWTH, MANUFACTURING METHOD THEREFOR, AND SUBSTRATE FOR SUPERCONDUCTING WIRE
An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate... |