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US20140065440 SN-COATED COPPER ALLOY STRIP HAVING EXCELLENT HEAT RESISTANCE  
A Sn-coated copper alloy strip including a surface coating layer containing a Ni layer, a Cu—Sn intermetallic compound layer, and a Sn layer formed in this order over the surface of a base...
US20140353030 COMPOSITE WIRE AND CONTACT ELEMENT  
The invention relates, in particular, to a composite wire which according to the invention has a structure having a core made of steel or a steel alloy and a copper alloy layer surrounding the core.
US20150179303 OXIDATION-RESISTANT ELONGATE ELECTRICALLY CONDUCTIVE ELEMENT  
An elongate electrically conductive element has a core made of copper or copper alloy and at least one white-bronze layer encircling the core made of copper or copper alloy, wherein the...
US20140057054 CO-EVAPORATION ALLOY MATERIAL AND EVAPORATION COATING METHOD USING THE SAME  
A co-evaporation alloy material includes a first evaporation material and a second evaporation material, the first evaporation material being completely covered by the second evaporation material....
US20150226362 ELECTRICALLY HEATED HOSE  
A heated fluid line comprises an inner tube, an outer sheath, and a heating element. The heating element disposed between the inner tube and the outer sheath. The heating element comprises an...
US20090130480 Sn-Plated Copper Alloy Strip Having Improved Fatigue Characteristics  
The object of the invention is to provide a reflow Sn-plated copper alloy strip having improved fatigue characteristics by preventing the degradation of fatigue characteristics caused by reflow Sn...
US20100319967 INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING  
A device fabrication method, according to which a tin-copper-alloy layer is formed adjacent to a copper-plated pad or pin that is used to electrically connect the device to external wiring....
US20120208044 TIN-CONTAINING ALLOY PLATING BATH, ELECTROPLATING METHOD USING SAME, AND SUBSTRATE WITH THE ELECTROPLATING DEPOSITED THEREON  
Provided are a tin-containing alloy plating bath being capable of manufacturing a tin-containing alloy plated product suitable for electric and electronic members with excellent anti-oxidation...
US20150010774 METHODS AND APPARATUSES FOR MITIGATING TIN WHISKER GROWTH ON TIN AND TIN-PLATED SURFACES BY DOPING TIN WITH GERMANIUM  
The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films...
US20110206941 COPPER-TIN ALLOY, COMPOSITE MATERIAL AND USE THEREOF  
The invention relates to a copper-tin alloy, comprising 0.2 to 0.8% by weight Sn, 0.1 to 0.6% by weight Ni and/or Co, 0 to 0.05% by weight Zn, 0 to 0.2% by weight Fe, 0.008 to 0.05% by weight P,...
US20110097597 IMMERSION TIN SILVER PLATING IN ELECTRONICS MANUFACTURE  
A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate...
US20090092851 Heat-Resistant Sn-Plated Cu-Zn Alloy Strip with Suppressed Whiskering  
In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase...
US20090176125 Sn-Plated Cu-Ni-Si Alloy Strip  
In a Sn-plated strip in which a copper base alloy contains 1.0 to 4.5 mass % of Ni, 0.2 to 1.0 mass % of Si and a balance of Cu and unavoidable impurities, an S concentration and a C concentration...
US20120108437 Precursor for Nb3Sn superconductor wire, superconductor wire using the same and method for manufacturing Nb3Sn superconductor wire  
A precursor for a Nb3Sn superconductor wire is configured to be manufactured by the internal Sn diffusion method. The precursor includes a Cu tube including a barrier layer at an inner surface...
US20090239094 Cu-Zn Alloy Strip Superior in Thermal Peel Resistance of Sn Plating and Sn Plating Strip Thereof  
A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu...
US20070218312 Whiskerless plated structure and plating method  
A plated structure is disclosed that includes a base formed of a copper-based material containing copper as a major component, a plating film formed of a tin-based material containing tin as a...
US20130330572 WINDSCREEN WIPER DEVICE  
The invention relates to a layered composite material for sliding elements, comprising a base layer, applied to the surface of a sliding element, made of an alloy comprising copper or aluminum and...
US20090197114 MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS  
A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder...
US20090236123 PLATED FLAT CONDUCTOR AND FLEXIBLE FLAT CABLE THEREWITH  
Disclosed is a plated flat conductor including a flat conductor of copper or a copper alloy and a plated layer formed on a surface of the flat conductor. The plated layer includes a first...
US20140178711 CORROSION RESISTANT BARRIER FORMED BY VAPOR PHASE TIN REFLOW  
A copper substrate for use as a contact having Sn plating, nickel plating and Au plating overlying the substrate. A combination of Sn plating is applied over a copper substrate; nickel plating is...
US20050249968 Whisker inhibition in tin surfaces of electronic components  
A method for reducing whisker formation in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 μm and about 4.0 μm in...
US20120114971 WEAR RESISTANT LEAD FREE ALLOY SLIDING ELEMENT METHOD OF MAKING  
A sliding element 20, such as a bushing or bearing, includes a sintered powder metal base 24 deposited on a steel backing 22. The base 24 includes a tin, bismuth, first hard particles 40, such as...
US20070059549 Metallic pattern for manufacturing prism sheet and method of manufacturing the same  
Disclosed are a metallic pattern for manufacturing a prism sheet having a micro-pattern capable of diffusing light and a method of manufacturing such a metallic pattern. The method includes...
US20100183896 TIN-SILVER BONDING AND METHOD THEREOF  
A Sn—Ag bonding and a method thereof are revealed. By means of a bonding layer formed by tin and silver between wafers, the stress released by diffusion and bonding between tin (Sn) and silver...
US20090291321 Whisker-free lead frames  
A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of...
US20130237105 COPPER ALLOY SHEET WITH SN COATING LAYER FOR A FITTING TYPE CONNECTION TERMINAL AND A FITTING TYPE CONNECTION TERMINAL  
A copper alloy sheet with a Sn coating layer comprises a base material made of Cu—Ni—Si system copper alloy. Formed on the base material is a Ni coating layer having an average thickness of 0.1 to...
US20140287262 TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSERTION/EXTRACTION PERFORMANCE  
Tin-plated copper-alloy terminal material in which Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer is formed between the Sn-based surface...
US20140308540 PLATED CONTACT AND PROCESS OF MANUFACTURING PLATED CONTACT  
Plated contacts and processes of manufacturing plated contacts are disclosed. The processes include providing a metallic substrate, applying tin-containing plating over the metallic substrate,...
US20110220704 COMPOSITE SOLDER ALLOY PREFORM  
Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a...
US20150118515 TIN-PLATED COPPER-ALLOY TERMINAL MATERIAL  
Tin-plated copper-alloy terminal material including a base material made of Cu alloy; a Sn-based surface layer formed on a surface of the base material and having an average thickness of 0.2 μm or...
US20150056466 TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSERTION/EXTRACTION PERFORMANCE  
A tin-plated copper-alloy terminal material wherein: a Sn-based surface layer formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer/a Ni—Sn alloy layer/a Ni or Ni alloy...
US20110151273 LAMINATE FOR PRINTED CIRCUIT BOARD  
A laminate for use in the production of a printed circuit board includes a main layer and a face layer made of a material different from the material that the main layer is made of. The main layer...
US20050123784 Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same  
A terminal obtained by forming a surface layer formed of an Sn—Ag—Cu ternary alloy with electroplating on a whole surface or a portion of a conductive base, wherein the Sn—Ag—Cu ternary alloy is...
US20140370328 Tin Whisker Mitigation Material Using Thin Film Metallic Glass Underlayer  
The present invention relates to a tin whisker mitigation material using thin film metallic glass underlayer, which is a thin film metallic glass (TFMG) formed between a metal substrate and a tin...
US20140170436 TIN-PLATED COPPER-ALLOY MATERIAL FOR TERMINAL HAVING EXCELLENT INSERTION/EXTRACTION PERFORMANCE  
Tin-plated copper-alloy material for terminal in which: a Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer is formed between the Sn-based...
US20130196174 HIGH TEMPERATURE RESISTANT SILVER COATED SUBSTRATES  
A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high...
US20110003167 METALLIC MATERIAL FOR A CONNECTOR AND METHOD OF PRODUCING THE SAME  
A metallic material for a connector, having a base material of a bar material or a rectangular wire material formed of copper or a copper alloy, in which a striped copper-tin alloy layer is formed...
US20100297465 SURFACE-TREATED STEEL SHEET, PROCESS FOR PRODUCING THE SAME, AND RESIN-COATED STEEL SHEET  
It is an object to provide a surface-treated steel sheet which contains no Cr, which is excellent in wet resin adhesion, and which can be used as an alternative to a conventional tin-free steel...
US20130001782 LAMINATED HIGH MELTING POINT SOLDERING LAYER AND FABRICATION METHOD FOR THE SAME, AND SEMICONDUCTOR DEVICE  
The laminated high melting point soldering layer includes: a laminated structure which laminated a plurality of three-layered structures, the respective three-layered structures including a low...
US20150047879 METALLIC MATERIAL FOR ELECTRONIC COMPONENTS, AND CONNECTOR TERMINALS, CONNECTORS AND ELECTRONIC COMPONENTS USING SAME  
The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic...
US20100190390 CONNECTOR AND METALLIC MATERIAL FOR CONNECTOR  
A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer...
US20090297879 Structure and Method for Reliable Solder Joints  
A solder joint (200) has a first contact pad 114 and a second contact pad 124 of a first metal, preferably copper, facing each other across a gap. A coat and 125, respectively) of a second metal,...
US20100203354 FLATTED MATERIAL  
Disclosed is a flatted material produced by conducting cold flatting of copper alloy including 0.1-1.0 mass % of Cu, 0.05-1.5 mass % of Sn, and 0.05-1.5 mass % of Zn, and comprising residue Cu and...
US20120135270 Layer System with Improved Corrosion Resistance  
The present invention relates to a layer system for coating a substrate surface and to a method for coating a substrate surface with a corresponding layer system, the layer system comprising at...
US20110012497 PLATING STRUCTURE AND METHOD FOR MANUFACTURING ELECTRIC MATERIAL  
There is provided a plating structure obtained by heat-treating a silver-plated structure obtained by forming a tin-plated layer, an indium-plated layer, or a zinc-plated layer, having a thickness...
US20090053553 CONDUCTIVE MATERIAL FOR A CONNECTING PART  
Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 μm; and an Sn...
US20140295070 ELECTROCONDUCTIVE MATERIAL SUPERIOR IN RESISTANCE TO FRETTING CORROSION FOR CONNECTION COMPONENT  
An electroconductive material includes a Cu or Cu alloy base member, a Cu—Sn alloy coating layer, and a Sn coating layer. The Cu—Sn alloy coating layer has a Cu content of 20 to 70 atomic %, and...
US20110111253 LEAD-FREE TIN PLATED MEMBER AND METHOD OF FORMING PLATING LAYER  
In a plated member (3) that has a pure Sn plating layer (2) of a lead-free material on a surface of a base material 1, the orientation indices of a (101) plane and a (112) plane of the pure Sn...
US20120064358 SLIDE MEMBER  
A slide member is disclosed. The slide member includes a Cu-based bearing alloy layer; an intermediate layer provided over the Cu-based bearing alloy layer; and a Sn-based overlay provided over...
US20050244620 Wired circuit board and production method thereof  
A wired circuit board which is formed so that even when a wired circuit pattern is formed at a fine pitch and then a tin plating layer is formed on the wired circuit pattern by the electroless tin...

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