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US20140158410 POLYIMIDE, COPPER-CLAD LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE FLEXIBLE PRINTED CIRCUIT BOARD  
A polyimide is formed by dehydrating a polyamic acid. The polyamic acid is formed by polymerizing a diamine and a fluorine dianhydride. The diamine is 2,2′-bis[4-(4-aminophenoxy) phenyl] propane,...
US20120077887 TERPOLYMERS AS PRESSURE-SENSITIVE ADHESIVES  
Disclosed herein are terpolymers that can function as pressure-sensitive adhesives. The disclosed articles comprise the terpolymers adhered to a release liner. The disclosed implant devices...
US20140326487 FLEXIBLE METAL-CLADDED BASE MATERIAL, METHOD FOR PRODUCING FLEXIBLE METAL-CLADDED BASE MATERIAL, PRINTED WIRING BOARD, MULTILAYER FLEXIBLE PRINTED WIRING BOARD, AND FLEX-RIGID PRINTED WIRING BOARD  
The flexible metal-cladded base material pertaining to the present invention includes a metal foil and a first resin layer. The first resin layer is of a first resin composition containing a...
US20150237737 SURFACE TREATED COPPER FOIL AND LAMINATE USING THE SAME, PRINTED WIRING BOARD, AND COPPER CLAD LAMINATE  
A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated...
US20130171390 Thermoplastic Powder Compositions  
Disclosed is a composition comprising polyamide and ionomer useful for powder coating applications and a method for transforming the composition into particulate or powder form for application to...
US20120247820 RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD  
Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one...
US20050238857 Laminated glazing panel  
A laminated glazing panel is disclosed comprising two glass plies and a plastic ply having one or more light emitting diodes mounted on a circuit board laminated between the glass plies, forming...
US20050123769 Fire retardant shades  
A fire retardant solar control sun shade comprising as the shade material, a clear transparent film composite comprising a first transparent film layer, preferably with a metallized layer on one...
US20130040517 RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD  
A resin composition is provided which comprises a polyimide resin, a thermosetting resin, and a filler, the polyimide resin containing a first repeat unit represented by formula (I) and a second...
US20120021234 LOW-THERMAL-EXPANSION BLOCK POLYIMIDE, PRECURSOR THEREOF, AND USE THEREOF  
Provided is a low-cost polyimide, containing cyclohexane diamine as a diamine unit, that has a low thermal expansion coefficient. Said block polyimide contains blocks having the repeating...
US20150044092 LOCAL THERMAL ACTUATION OF MATERIAL SURFACES VIA MICRO- AND NANOWIRE HEATING FOR THE PREVENTION OF CELLULAR ATTACHMENT AND BIOLOGICAL FOULING  
The invention relates in various embodiments to a composite useful as e.g. a medical implant device, and a method of treating fouling, including biofouling as may occur on an implant. The...
US20120202057 HOT-MELT ADHESIVE MATERIAL FOR INDUCTION HEATING  
The present invention provides a laminate in which a formed article as an adherend is adhered without impairing the external designability and touch of the formed article, and a hot-melt adhesive...
US20130084463 SURFACE-TREATED ROUGHENED COPPER FOIL AND COPPER CLAD LAMINATE  
Disclosed is a surface-roughened copper foil that can show excellent adhesion to an anisotropic conductive resin (ACF) and a copper-clad laminate using same. Specifically disclosed is a...
US20120034457 WATER-FREE HIGH-SOLIDS BASE PAINTS, THE PRODUCTION THEREOF AND THE USE THEREOF FOR PRODUCING MULTILAYER PAINT COATINGS, AND MULTILAYER PAINT COATINGS COMPRISING A BASE COATING MADE OF A WATER-FREE HIGH-SOLIDS BASE PAINT  
A waterless high-solids basecoat material having a solids content of at least 35% by weight, comprising (a) 1% to 10% by weight of at least one polyester binder with an acid number of at least 20...
US20080206581 Static-Electricity Proof Tile  
Disclosed is static electricity proof tile, which has volume resistance lower than conventional tiles, prevents bleeding, which typically occurs in static electricity proof tiles manufactured...
US20150111049 ENTRY SHEET FOR DRILLING USE  
The present invention relates to an entry sheet for drilling use, which exhibits excellent hole position accuracy even when transported at ambient temperature for a long time and/or stored under a...
US20150125228 ENTRY SHEET FOR DRILLING AND DRILLING METHOD  
Provided is an entry sheet for drilling that, compared with a conventional entry sheet for drilling, has better hole position accuracy, can suppress drill bit breakage, and exhibits less...
US20120003487 COATING AGENT FOR CORROSION-RESISTANT COATINGS  
The invention relates to a multicoat color and/or effect paint system comprising, lying above one another in this order, (1) at least one first basecoat comprising basecoat material (A),(2)...
US20130126082 METAL COPPER CLAD LAMINATE AND METHOD OF MANUFACTURING METAL CORE PRINTED CIRCUIT BOARD USING THE SAME  
There are provided a metal copper clad laminate (MCCL) and a method of manufacturing a metal core printed circuit board (MCPCB) using the same. The MCCL includes a metal plate; a first polyimide...
US20150140883 RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD  
A resin composition comprises a polyimide resin, a thermosetting resin, and a filler, the polyimide resin containing a first repeat unit represented by formula (I) and a second repeat unit...
US20150027754 RESIN COMPOSITION, LAYERED PRODUCT, MULTILAYER PRINTED WIRING BOARD, MULTILAYER FLEXIBLE WIRING BOARD AND MANUFACTURING METHOD OF THE SAME  
A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate...
US20090269598 CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME  
A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and...
US20150024194 ULTRA LOW CURE POWDER COATINGS  
Methods and systems for coating metal substrates are provided. The methods and systems include application of TGIC-reactive carboxyl-functional polyester resins with high acid number formulated to...
US20120189859 RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND PRINTED WIRING BOARD  
The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear...
US20130302628 PROTECTIVE COATING  
A protective coating including a crosslinked polyester that is removable with a basic composition, as well as coated articles, methods of preparing a protective coating, and methods of using a...
US20140355229 Surface Treated Copper Foil and Laminate Using the Same  
A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. A surface treated...
US20120325914 Combination card of metal and plastic  
A card formed in accordance with the invention includes a first assembly comprised of multiple plastic layers attached via an adhesive to a metal layer. The multiple plastic layers forming the...
US20130108875 INORGANIC FILLER, RESIN COMPOSITION, AND APPLICATION THEREOF  
An inorganic filler containing (1) from 62 to 80 parts by weight of SiO2; (2) from 0 to 10 parts of weight of Al2O3; (3) from 20 to 30 parts by weight of B2O3; and (4) from 0 to 5 parts by weight...
US20120243186 METALLIC LAMINATE AND METHOD FOR PREPARING THE SAME  
The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polymide resin layer. The polymide resin...
US20140124404 DUAL BARRIER LAMINATE STRUCTURE  
The present disclosure relates to a dual barrier laminate structure, particularly suitable for aggressive or moisture containing products. The present disclosure also relates to a plastic based...
US20120024579 BENDABLE CIRCUIT STRUCTURE FOR LED MOUNTING AND INTERCONNECTION  
This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.
US20100040873 Two-Layered Copper-Clad Laminate  
A two-layered copper-clad laminate having a copper layer formed on a polyimide film by sputtering and plating, characterized in that the two-layered copper-clad laminate shows a behavior of...
US20110159280 BACKSHEET FOR A SOLAR MODULE  
Disclosed herein is a backsheet for a solar module. The backsheet includes a first polymeric layer, a second polymeric layer and a moisture-resistant layer. The first polymeric layer includes...
US20140227530 ANTI-CORROSION COATINGS  
The present invention is directed to anti-corrosion coatings. It is particularly directed to coatings comprising a monomer, such as pyrrole, aniline, thiophene, or their analogs, and a resin....
US20050112362 Polyimide resin and cast-on-copper laminate  
A polyimide polymer made from a dianhydride of 3,3′,4,4′-Biphenyltetracarboxylic dianhydride and diamines of p-phenylenediamine and oxydianiline, having similar coefficient of thermal expansion,...
US20120177937 POLYAMIDE RESIN COMPOSITION  
Disclosed is a polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70...
US20060154037 Polyimide-copper composite laminate  
A polyimide-copper composite laminate is composed of a metallic carrier having a thickness of 10-35 μm and a thin copper film having a thickness of 1-8 μm, and an intervening heat-resistant layer...
US20050019598 Copper-clad laminate  
A copper-clad laminate is composed of a polyimide film and an electrolytically plated copper film placed on at least one surface side of the polyimide film, in which the copper film has at most...
US20120231048 Medical Devices and Implants from Nb-Ta-W-Zr Alloys  
The present invention relates to a medical device or implant made at least in part of a high-strength, low-modulus metal alloy comprising niobium, tantalum, and at least one element selected from...
US20130078879 REACTIVE MONOMER FOR A COATING AND/OR REACTIVE COATING  
Disclosed herein are coating solutions comprising a reactive monomer, process and compositions for preparing the same that are suitable for a coating and/or reactive coating. More particularly,...
US20110212334 Low-Melt Poly(Amic Acids) and Polyimides and their Uses  
Provided are low-melt polyimides and poly(amic acids) (PAAs) for use in repair of electrical wire insulation, flat or ribbon wire harnesses, and flat surfaces comprised of high-performance...
US20150152224 POLYETHERIMIDES WITH IMPROVED MELT STABILITY  
A polyetherimide composition comprises the polymerization product of a catalyzed imidization product of a 3-substituted phthalic anhydride and a sulfone diamine having improved melt stability and...
US20060062996 Resin matrix composite with aluminum for lubrication in drilling  
A resin matrix composite with aluminum for lubrication in drilling comprises a resin matrix composite and an aluminum foil. The resin matrix composite is consisting of at least three of the...
US20140024278 Synthesized Resins and Varnishes and Prepegs and Laminates Made Therefrom  
Synthesized base resin compositions that include a raw resin and a maleimide and/or bismaleimide monomer as well as compounded varnishes that include a raw resin or synthesized base resin as well...
US20110120522 BRIGHT WHITE PROTECTIVE LAMINATES  
Laminates of having a first outer layer of weatherable film, at least one mid layer, and a second outer layer containing an opacifying quantity of white pigment. The laminates are particularly...
US20130045388 MATERIALS AND METHODS FOR MANUFACTURING POLYCULTURE EQUIPMENT  
A method of manufacturing polyculture equipment includes providing a building material to build the polyculture equipment; applying a waterproof coating of polyurea or polyaspartic to an interior...
US20150056390 SURFACE-TREATED ALUMINUM PLATE, ORGANIC-RESIN-COATED SURFACE -TREATED ALUMINUM PLATE, CAN BODY AND CAN LID FORMED BY USING THE SAME  
A surface-treated aluminum plate obtained by forming, on at least one surface of an aluminum plate, a conversion-coated layer that contains a polyester resin and a zirconium compound or a titanium...
US20110281126 RESIN COMPOSITE COPPER FOIL  
This invention relates to a resin composite copper foil capable of applying a copper foil with very small unevenness on a copper foil (matte) surface without deteriorating adhesion force to a...
US20070044910 Polyimide based flexible copper clad laminates and method of producing the same  
The present invention relates to a polyimide based flexible copper clad laminate for manufacturing a flexible printed circuit board. The polyimide based flexible copper clad laminate comprises, in...
US20110091644 Water release silver and holographic metal flake and method of manufacturing metal flake  
A metal flake film assembly comprising a base film having a first side and a second side. A coating is positioned on the first side of the base film. The coating is one of a water soluble polymer...