Matches 1 - 50 out of 316 1 2 3 4 5 6 7 >


Match Document Document Title
US20110151213 LABELS  
There is described a multi-layer film. The film comprises a biodegradable layer and a metallised layer, wherein the biodegradable layer comprises a biopolymer selected from the group consisting of...
US20100260984 MICRODEVICES CONTAINING PHOTORECOGNIZABLE CODING PATTERNS AND METHODS OF USING AND PRODUCING THE SAME  
This invention relates generally to the field of moiety or molecule analysis, isolation, detection and manipulation and library synthesis. In particular, the invention provides a microdevice,...
US20080213551 Metallization process and product produced thereby  
A layered structure produced by metallizing a substrate including: (a) providing a transfer film including film layer and metal layer bonded together by a cured breakaway layer; (b) providing a...
US20070059502 Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer  
A fabrication method and a product for the deposition of a conductive barrier or other liner layer in a vertical electrical interconnect structure. One embodiment includes within a a hole through...
US20100015420 BIOLAMINATE COMPOSITE ASSEMBLY AND RELATED METHODS  
Embodiments of the invention relate to a biolaminate composite assembly, including one or more biolaminate layers, a non-plastic rigid substrate and an adhesive layer in contact with the substrate...
US20140154520 Embossed Metallic Flakes Process And Product  
A process for preparing embossed fine particulate thin metal flakes having high levels of brightness and color intensity. The process comprises forming a release coat on a flexible polymeric...
US20050233122 Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein  
The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate...
US20050158574 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier  
To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be...
US20100209680 METHODS FOR PRODUCING PATTERN-FORMING BODY  
A method of producing a pattern-forming body with high accuracy with no need for a post-exposure treatment and without allowing any photocatalyst to remain in the resultant pattern-forming body...
US20050178501 Process for producing a multi-layer printer wiring board  
The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination...
US20050064247 Composite refractory metal carbide coating on a substrate and method for making thereof  
A composite coating for use on semi-conductor processing components, comprising a refractory metal carbide coating with its surface modified by at least one of: a) a carbon donor source for a...
US20150359093 EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY RESIN COMPOSITION, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD  
It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as...
US20080107878 Colored mask for forming transparent structures  
The invention relates to a process for forming a stacked transparent structure comprising providing a support, coating one side of said support with a multicolored mask, coating the other side of...
US20050163982 Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same  
The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the...
US20050118403 Electrical member, electrical device, and method of manufacturing the electrical member and electrical device  
To provide: an electrical member which can effectively apply characteristics of a carbon nanotube such as an electrode; and an electrical device such as an electrical switch. To provide: an...
US20110274897 COMPOSITE COMPONENT HAVING A COVER LAYER  
The invention relates to a composite component of at least (3) different material layers, having the following layer composition: a) a carrier layer or carrier structure of metal and/or...
US20100055423 Machine Readable Code Comprising Ultra-Violet Curable Gellant Inks  
A method for embedding information on a substrate including converting information to machine readable code, wherein the code comprises a set of intended printed markings, wherein each intended...
US20060251872 Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof  
A fabrication method, a product structure, a fabrication method, and a sputtering target for the deposition of a conductive barrier or other liner layer in an interconnect structure. The barrier...
US20060088723 Surface treated copper foil and circuit board  
A surface treated copper foil having high frequency characteristics, capable of forming fine pattern and having sufficient peel strength, wherein surface roughness Rz of roughening treated surface...
US20150034369 RESIN COMPOSITION FOR PRINTED WIRING BOARDS  
Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used...
US20070036955 Laminate, a substrate with wiring, an organic EL display element, a connection terminal for an organic EL display element and a method for producing each  
A laminate for forming a substrate with wires, comprising a conductive layer containing Al or an Al alloy as the major component, formed on a substrate and a capping layer containing a Ni—Mo alloy...
US20050031836 Pattern forming method, pattern forming apparatus, device manufacturing method, conductive film wiring, electro-optical device, and electronic apparatus  
A pattern forming method is provided for forming film patterns W1 to W3 by arranging droplets of a liquid material on a substrate. The method comprises the steps of: defining a plurality of...
US20070004200 Selective activation of aluminum, copper, and tungsten structures  
A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure...
US20050260391 Wired circuit board  
A wired circuit board on which a highly reliable conductor pattern is formed, to allow an electronic component to be mounted on it with improved accuracy. An insulating layer 3 is formed on a...
US20050255304 Aligned nanostructure thermal interface material  
The invention relates to a thermal interface material comprising aligned nanostructures to increase the thermal conductivity of an electronic assembly. Aligned carbon nanotubes are a particularly...
US20050202222 High dielectric constant composition and method of making same  
Dielectric material compositions comprising HfO2 and a second compound are disclosed. The compositions are characterized by at least a part of the compositions being in a cubic crystallographic...
US20140295154 LAMINATE AND COMPOSITE LAYER COMPRISING A SUBSTRATE AND A COATING, AND PROCESS AND APPARATUS FOR PREPARATION THEREOF  
The invention relates to a laminate comprising two plastic films and (optionally in between a metal or metal oxide layer and) a layer of an organic compound other than triazine, the laminate...
US20120241069 Direct Synthesis of Patterned Graphene by Deposition  
A graphene pattern is fabricated by forming a pattern of passivation material on a growth substrate. The pattern of passivation material defines an inverse pattern of exposed surface on the growth...
US20090297880 Electromagnetically transparent bright resin products and processes for production  
The electromagnetically transparent bright resin product includes a resin base 11 made of a polycarbonate (PC), an aluminum (Al) film 13 deposited on the resin base 11 by sputtering, and a...
US20150293025 METAL DOT SUBSTRATE AND METHOD OF MANUFACTURING METAL DOT SUBSTRATE  
A metal dot substrate includes metal-containing metal dots having a maximum outside diameter and height of 0.1 nm to 1,000 nm formed on a substrate and located in a plurality of island regions.
US20130009846 INSERT FOR RADOMES AND METHODS OF MANUFACTURING INSERT FOR RADOMES  
Apparatuses such as inserts for radomes are described herein. The apparatuses and inserts including a metal layer having a frequency selective surface.
US20050034995 Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer  
Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be...
US20090214839 PROCESS FOR PREPARING LIGHT TRANSMISSIVE ELECTROMAGNETIC WAVE SHIELDING MATERIAL, LIGHT TRANSMISSIVE ELECTROMAGNETIC WAVE SHIELDING MATERIAL AND DISPLAY FILTER  
The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic...
US20080174016 Flexible Printed Wiring Board and Semiconductor Device  
A flexible printed wiring board is characterized by a laminate formed by directly laminating an electrodeposited copper foil having S side and M side, each of S side and M side having a different...
US20070148421 PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PREPARING METHOD THEREOF  
A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material...
US20050053772 Wiring board and multilayer wiring board  
A wiring board formed by an electrophotographic system of transferring a visible image to a substrate, the wiring board including: a substrate to which a visible image is transferred; a...
US20150376477 PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL COMPONENT, AND TOUCH PANEL  
Provided are an optical component having an excellent corrosion inhibition effect while achieving a high level of adhesion reliability and transparency, and pressure-sensitive adhesive composition...
US20130344268 MOULDED ARTICLE AND LABEL THEREFOR  
The invention provides an in mould label for injection moulding that comprises a vacuum metallised layer of metal for creating a barrier to oxygen ingress. The invention further provides a moulded...
US20090092803 SELF-ASSEMBLY TECHNIQUE APPLICABLE TO LARGE AREAS AND NANOFABRICATION  
The present invention provides articles and methods for affecting the self-assembly of materials. In some cases, the invention provides an approach for facilitating the self-assembly of various...
US20070104929 Method for plating printed circuit board and printed circuit board manufactured therefrom  
Disclosed herein are a method for plating a printed circuit board and the printed circuit board manufactured therefrom. In the method, a bare soldering or wire bonding portion of a copper (Cu)- or...
US20070098910 Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape  
An object of the invention is to provide a flexible copper clad laminate and the like in use of electro-deposited copper foil having lower profile and higher mechanical strength compared with...
US20060057403 Use of thin SOI to inhibit relaxation of SiGe layers  
High-quality, metastable SiGe alloys are formed on SOI substrates having an SOI layer of about 500 Å or less, the SiGe layers can remain substantially fully strained compared to identical SiGe...
US20160237246 RESIN COMPOSITION, PREPREG, LAMINATED SHEET, AND METAL-FOIL-CLAD LAMINATED BOARD  
It is an object of the present invention to provide a resin composition which can realize a printed wired board having not only low water-absorbing property but also excellent heat resistance...
US20130314765 Metamaterial Devices with Environmentally Responsive Materials  
Metamaterial devices with environmentally responsive materials are disclosed. In some embodiments, a metamaterial perfect absorber includes a first patterned metallic layer, a second metallic...
US20090291276 SYNTHETIC CERAMIC TILE AND METHOD FOR PRODUCING THE SAME  
A method for producing synthetic ceramic tile, including at least providing a ceramic tile, coating a coating on the ceramic tile, the coating containing at least an aluminum pigment and/or at...
US20060083904 Wiring apparatus, protecting cap for device package using the same, and a method for manufacturing them  
A wiring apparatus including a substrate, a via-hole penetrating the substrate, a buffer layer formed on an inner surface of the via-hole, and a plating layer filling filing the via hole inside of...
US20090133922 LIGHT TRANSMITTING CONDUCTIVE FILM, LIGHT TRANSMITTING ELECTROMAGNETIC WAVE SHIELDING FILM, OPTICAL FILTER AND METHOD OF PRODUCING DISPLAY FILTER  
A light transmitting conductive film formed by patterning a conductive metal part and a visible light transmitting part on a transparent support, wherein the conductive metal part is made up of...
US20080038522 POLYIMIDE FILM AND POLYIMIDE COMPOSITE SHEET  
An aromatic polyimide film favorably employable for the chip-on-film (COF) system is composed of a polyimide derived from 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and p-phenylenediamine...
US20070218258 Articles and methods including patterned substrates formed from densified, adhered metal powders  
In general the disclosure relates to manufacturing methods for producing conductive patterns on flexible substrates. For example, a layer of a metal powder composition is deposited onto an...
US20060234045 Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same  
Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate...

Matches 1 - 50 out of 316 1 2 3 4 5 6 7 >