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US20110151213 |
LABELS
There is described a multi-layer film. The film comprises a biodegradable layer and a metallised layer, wherein the biodegradable layer comprises a biopolymer selected from the group consisting of... |
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US20100260984 |
MICRODEVICES CONTAINING PHOTORECOGNIZABLE CODING PATTERNS AND METHODS OF USING AND PRODUCING THE SAME
This invention relates generally to the field of moiety or molecule analysis, isolation, detection and manipulation and library synthesis. In particular, the invention provides a microdevice,... |
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US20080213551 |
Metallization process and product produced thereby
A layered structure produced by metallizing a substrate including: (a) providing a transfer film including film layer and metal layer bonded together by a cured breakaway layer; (b) providing a... |
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US20070059502 |
Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer
A fabrication method and a product for the deposition of a conductive barrier or other liner layer in a vertical electrical interconnect structure. One embodiment includes within a a hole through... |
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US20100015420 |
BIOLAMINATE COMPOSITE ASSEMBLY AND RELATED METHODS
Embodiments of the invention relate to a biolaminate composite assembly, including one or more biolaminate layers, a non-plastic rigid substrate and an adhesive layer in contact with the substrate... |
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US20140154520 |
Embossed Metallic Flakes Process And Product
A process for preparing embossed fine particulate thin metal flakes having high levels of brightness and color intensity. The process comprises forming a release coat on a flexible polymeric... |
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US20050233122 |
Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate... |
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US20050158574 |
Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be... |
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US20100209680 |
METHODS FOR PRODUCING PATTERN-FORMING BODY
A method of producing a pattern-forming body with high accuracy with no need for a post-exposure treatment and without allowing any photocatalyst to remain in the resultant pattern-forming body... |
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US20050178501 |
Process for producing a multi-layer printer wiring board
The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination... |
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US20050064247 |
Composite refractory metal carbide coating on a substrate and method for making thereof
A composite coating for use on semi-conductor processing components, comprising a refractory metal carbide coating with its surface modified by at least one of: a) a carbon donor source for a... |
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US20150359093 |
EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY RESIN COMPOSITION, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as... |
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US20080107878 |
Colored mask for forming transparent structures
The invention relates to a process for forming a stacked transparent structure comprising providing a support, coating one side of said support with a multicolored mask, coating the other side of... |
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US20050163982 |
Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same
The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the... |
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US20050118403 |
Electrical member, electrical device, and method of manufacturing the electrical member and electrical device
To provide: an electrical member which can effectively apply characteristics of a carbon nanotube such as an electrode; and an electrical device such as an electrical switch. To provide: an... |
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US20110274897 |
COMPOSITE COMPONENT HAVING A COVER LAYER
The invention relates to a composite component of at least (3) different material layers, having the following layer composition: a) a carrier layer or carrier structure of metal and/or... |
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US20100055423 |
Machine Readable Code Comprising Ultra-Violet Curable Gellant Inks
A method for embedding information on a substrate including converting information to machine readable code, wherein the code comprises a set of intended printed markings, wherein each intended... |
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US20060251872 |
Conductive barrier layer, especially an alloy of ruthenium and tantalum and sputter deposition thereof
A fabrication method, a product structure, a fabrication method, and a sputtering target for the deposition of a conductive barrier or other liner layer in an interconnect structure. The barrier... |
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US20060088723 |
Surface treated copper foil and circuit board
A surface treated copper foil having high frequency characteristics, capable of forming fine pattern and having sufficient peel strength, wherein surface roughness Rz of roughening treated surface... |
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US20150034369 |
RESIN COMPOSITION FOR PRINTED WIRING BOARDS
Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used... |
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US20070036955 |
Laminate, a substrate with wiring, an organic EL display element, a connection terminal for an organic EL display element and a method for producing each
A laminate for forming a substrate with wires, comprising a conductive layer containing Al or an Al alloy as the major component, formed on a substrate and a capping layer containing a Ni—Mo alloy... |
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US20050031836 |
Pattern forming method, pattern forming apparatus, device manufacturing method, conductive film wiring, electro-optical device, and electronic apparatus
A pattern forming method is provided for forming film patterns W1 to W3 by arranging droplets of a liquid material on a substrate. The method comprises the steps of: defining a plurality of... |
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US20070004200 |
Selective activation of aluminum, copper, and tungsten structures
A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure... |
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US20050260391 |
Wired circuit board
A wired circuit board on which a highly reliable conductor pattern is formed, to allow an electronic component to be mounted on it with improved accuracy. An insulating layer 3 is formed on a... |
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US20050255304 |
Aligned nanostructure thermal interface material
The invention relates to a thermal interface material comprising aligned nanostructures to increase the thermal conductivity of an electronic assembly. Aligned carbon nanotubes are a particularly... |
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US20050202222 |
High dielectric constant composition and method of making same
Dielectric material compositions comprising HfO2 and a second compound are disclosed. The compositions are characterized by at least a part of the compositions being in a cubic crystallographic... |
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US20140295154 |
LAMINATE AND COMPOSITE LAYER COMPRISING A SUBSTRATE AND A COATING, AND PROCESS AND APPARATUS FOR PREPARATION THEREOF
The invention relates to a laminate comprising two plastic films and (optionally in between a metal or metal oxide layer and) a layer of an organic compound other than triazine, the laminate... |
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US20120241069 |
Direct Synthesis of Patterned Graphene by Deposition
A graphene pattern is fabricated by forming a pattern of passivation material on a growth substrate. The pattern of passivation material defines an inverse pattern of exposed surface on the growth... |
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US20090297880 |
Electromagnetically transparent bright resin products and processes for production
The electromagnetically transparent bright resin product includes a resin base 11 made of a polycarbonate (PC), an aluminum (Al) film 13 deposited on the resin base 11 by sputtering, and a... |
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US20150293025 |
METAL DOT SUBSTRATE AND METHOD OF MANUFACTURING METAL DOT SUBSTRATE
A metal dot substrate includes metal-containing metal dots having a maximum outside diameter and height of 0.1 nm to 1,000 nm formed on a substrate and located in a plurality of island regions. |
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US20130009846 |
INSERT FOR RADOMES AND METHODS OF MANUFACTURING INSERT FOR RADOMES
Apparatuses such as inserts for radomes are described herein. The apparatuses and inserts including a metal layer having a frequency selective surface. |
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US20050034995 |
Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer
Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be... |
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US20090214839 |
PROCESS FOR PREPARING LIGHT TRANSMISSIVE ELECTROMAGNETIC WAVE SHIELDING MATERIAL, LIGHT TRANSMISSIVE ELECTROMAGNETIC WAVE SHIELDING MATERIAL AND DISPLAY FILTER
The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic... |
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US20080174016 |
Flexible Printed Wiring Board and Semiconductor Device
A flexible printed wiring board is characterized by a laminate formed by directly laminating an electrodeposited copper foil having S side and M side, each of S side and M side having a different... |
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US20070148421 |
PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PREPARING METHOD THEREOF
A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material... |
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US20050053772 |
Wiring board and multilayer wiring board
A wiring board formed by an electrophotographic system of transferring a visible image to a substrate, the wiring board including: a substrate to which a visible image is transferred; a... |
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US20150376477 |
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL COMPONENT, AND TOUCH PANEL
Provided are an optical component having an excellent corrosion inhibition effect while achieving a high level of adhesion reliability and transparency, and pressure-sensitive adhesive composition... |
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US20130344268 |
MOULDED ARTICLE AND LABEL THEREFOR
The invention provides an in mould label for injection moulding that comprises a vacuum metallised layer of metal for creating a barrier to oxygen ingress. The invention further provides a moulded... |
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US20090092803 |
SELF-ASSEMBLY TECHNIQUE APPLICABLE TO LARGE AREAS AND NANOFABRICATION
The present invention provides articles and methods for affecting the self-assembly of materials. In some cases, the invention provides an approach for facilitating the self-assembly of various... |
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US20070104929 |
Method for plating printed circuit board and printed circuit board manufactured therefrom
Disclosed herein are a method for plating a printed circuit board and the printed circuit board manufactured therefrom. In the method, a bare soldering or wire bonding portion of a copper (Cu)- or... |
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US20070098910 |
Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape
An object of the invention is to provide a flexible copper clad laminate and the like in use of electro-deposited copper foil having lower profile and higher mechanical strength compared with... |
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US20060057403 |
Use of thin SOI to inhibit relaxation of SiGe layers
High-quality, metastable SiGe alloys are formed on SOI substrates having an SOI layer of about 500 Å or less, the SiGe layers can remain substantially fully strained compared to identical SiGe... |
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US20160237246 |
RESIN COMPOSITION, PREPREG, LAMINATED SHEET, AND METAL-FOIL-CLAD LAMINATED BOARD
It is an object of the present invention to provide a resin composition which can realize a printed wired board having not only low water-absorbing property but also excellent heat resistance... |
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US20130314765 |
Metamaterial Devices with Environmentally Responsive Materials
Metamaterial devices with environmentally responsive materials are disclosed. In some embodiments, a metamaterial perfect absorber includes a first patterned metallic layer, a second metallic... |
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US20090291276 |
SYNTHETIC CERAMIC TILE AND METHOD FOR PRODUCING THE SAME
A method for producing synthetic ceramic tile, including at least providing a ceramic tile, coating a coating on the ceramic tile, the coating containing at least an aluminum pigment and/or at... |
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US20060083904 |
Wiring apparatus, protecting cap for device package using the same, and a method for manufacturing them
A wiring apparatus including a substrate, a via-hole penetrating the substrate, a buffer layer formed on an inner surface of the via-hole, and a plating layer filling filing the via hole inside of... |
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US20090133922 |
LIGHT TRANSMITTING CONDUCTIVE FILM, LIGHT TRANSMITTING ELECTROMAGNETIC WAVE SHIELDING FILM, OPTICAL FILTER AND METHOD OF PRODUCING DISPLAY FILTER
A light transmitting conductive film formed by patterning a conductive metal part and a visible light transmitting part on a transparent support, wherein the conductive metal part is made up of... |
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US20080038522 |
POLYIMIDE FILM AND POLYIMIDE COMPOSITE SHEET
An aromatic polyimide film favorably employable for the chip-on-film (COF) system is composed of a polyimide derived from 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and p-phenylenediamine... |
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US20070218258 |
Articles and methods including patterned substrates formed from densified, adhered metal powders
In general the disclosure relates to manufacturing methods for producing conductive patterns on flexible substrates. For example, a layer of a metal powder composition is deposited onto an... |
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US20060234045 |
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate... |