Matches 1 - 43 out of 43


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US20130333678 Nontoxic low melting point fusible alloy lubrication of electromagnetic railgun armatures and rails  
A railgun which has a conductive lubricant and system of delivery reduces the electrical resistance and friction of the armature-rail sliding contact, thereby decreasing the amount of heat...
US20140348203 STABLE NANOCRYSTALLINE ORDERING ALLOY SYSTEMS AND METHODS OF IDENTIFYING SAME  
Provided in one embodiment is a method of identifying a stable phase of an ordering binary alloy system comprising a solute element and a solvent element, the method comprising: determining at...
US20150125338 STABLE BINARY NANOCRYSTALLINE ALLOYS AND METHODS OF IDENTIFYING SAME  
Identifying a stable phase of a binary alloy comprising a solute element and a solvent element. In one example, at least two thermodynamic parameters associated with grain growth and phase...
US20120091404 ZINTL PHASES FOR THERMOELECTRIC APPLICATIONS  
The inventors demonstrate herein that various Zintl compounds can be useful as thermoelectric materials for a variety of applications. Specifically, the utility of Ca3AlSb3, Ca5Al2Sb6, Ca5In2Sb6,...
US20140376351 MATERIALS FOR NEAR FIELD TRANSDUCERS AND NEAR FIELD TRANSDUCERS CONTAINING SAME  
A device including a near field transducer, the near field transducer including gold (Au) and at least one other secondary atom, the at least one other secondary atom selected from: boron (B),...
US20130078138 Bi-Al-Zn-BASED Pb-FREE SOLDER ALLOY  
There is provided a Pb-free solder alloy whose residual stress during solidification is small and which achieves high joint strength and high reliability, can suppress a reaction between Ni and Bi...
US20090104071 SOLDER ALLOY FOR BONDING OXIDE MATERIAL, AND SOLDER JOINT USING THE SAME  
The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy...
US20130037314 BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD  
Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive....
US20130216427 LIQUID METAL ION SOURCE AND SECONDARY ION MASS SPECTROMETRIC METHOD AND USE THEREOF  
A liquid metal ion source for use in an ion mass spectrometric analysis method contains, on the one hand, a first metal with an atomic weight ≧190 U and, on the other hand, another metal with an...
US20130094991 Pb-FREE SOLDER ALLOY  
Disclosed herein is a high-temperature Pb-free solder alloy having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The...
US20140361070 SOLDER ALLOYS  
A solder comprising a bismuth matrix, between about 5-24% copper; and about 0.5-36% tin or antimony or zinc; having a solidus temperature of ≧271° C., a reflow temperature of ≦375° C., and at...
US20130121874 Bi-Sn Based High-Temperature Solder Alloy  
A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an...
US20070071635 Bismuth-indium amalgam, fluorescent lamps, and methods of manufacture  
The disclosure relates to fluorescent lamps and methods of manufacture wherein the mercury is dosed into the lamp in a solid material containing mercury, bismuth, indium and another metal. In one...
US20100294550 BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE  
A bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge and 89.3 to 97.98% by weight of Bi has heat resistance of up to 275° C. and superior wettability, and a...
US20140219711 HIGH IMPACT TOUGHNESS SOLDER ALLOY  
High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt...
US20070227627 Solder composition having dispersoid particles for increased creep resistance  
A solder composition is provided. A solder composition has a solder matrix material and dispersoid particles in the solder matrix material. The solder matrix material has a relatively low melting...
US20090196789 SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP  
To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for...
US20050031483 [SOLDER COMPOSITION]  
A solder composition adapted to bond metallic materials and non-metallic materials is provided. The solder composition can enhance the bonding strength for the metallic materials and the...
US20100159257 BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD  
Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive....
US20070228109 Electronic Package Formed Using Low-Temperature Active Solder Including Indium, Bismuth, and/or Cadmium  
An active solder alloy, an electronic device package including the active solder alloy bonding an electronic device to a substrate, and a method of forming high-strength joints by soldering using...
US20150258637 SOLDER ALLOY FOR DIE BONDING  
An object of the invention is to provide a lead-free solder for die bonding having a high heat resistance temperature and an improved wetting property. Provided are a solder alloy for die bonding...
US20080118761 MODIFIED SOLDER ALLOYS FOR ELECTRICAL INTERCONNECTS, METHODS OF PRODUCTION AND USES THEREOF  
Lead-free solder compositions having a thermal conductivity are disclosed that include at least about 2% of silver, at least about 60% of bismuth, and at least one additional metal in an amount...
US20150037087 Lead-Free Solder Alloy  
A lead-free solder alloy consisting essentially of, in mass percent, Bi: 31-59%, Sb: 0.15-0.75%, at least one element selected from Cu: 0.3-1.0% and P: 0.002-0.055%, and a balance of Sn has a low...
US20100139730 USE OF THERMOELECTRIC MATERIALS FOR LOW TEMPERATURE THERMOELECTRIC PURPOSES  
The invention relates to the use of a thermoelectric material for thermoelectric purposes at a temperature of 150 K or less, said thermoelectric material is a material corresponding to the...
US20060067852 Low melting-point solders, articles made thereby, and processes of making same  
A composition includes a tin-containing solder with a melting temperature below about 150° C. The tin-containing solder includes indium, tin, and bismuth as alloy elements, and optionally contains...
US20090242249 BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECTRONIC DEVICE  
A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component...
US20100015004 LEAD-FREE LOW-TEMPERATURE SOLDER  
A conventional low-temperature solder containing Pb or Cd had problems with respect to environmental pollution. A conventional low-temperature lead-free solder had a liquidus temperature which was...
US20050147521 Cathode for an organic electronics component  
A metal cathode layer manufactured from a low-melting alloy for an electronic component is described.
US20090166876 SEMICONDUCTOR DEVICE AND DIE BONDING MATERIAL  
In a semiconductor device bonded to a motherboard with a bonding material having a melting point of 200° C. to 230° C., a bonding material 15 which is a die bonding material for bonding a...
US20120193800 SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE  
A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.
US20140119981 CONSTRUCTING BISMUTH ANTIMONY THIN FILMS WITH ANISOTROPIC SINGLE-DIRAC CONES  
A Bi1-xSbx thin film is provided that includes a Dirac-cone with different degrees of anisotropy in their electronic band structure by controlling the stoichiometry, film thickness, and growth...
US20150064483 METAL DEPOSITION USING ORGANIC VAPOR PHASE DEPOSITION (VPD) SYSTEM  
A method of depositing a film of a metal having a volatilization temperature higher than 350° C., as well as, a composite material including the same are disclosed. The method can include...
US20130298729 THERMOELECTRIC MATERIAL AND METHOD OF PREPARING THE THERMOELECTRIC MATERIAL  
A method of preparing thermoelectric material particles, the method comprising: disposing a first electrode and a second electrode in a dielectric liquid medium, wherein the first and second...
US20120107228 HYDROGEN GAS GENERATING MEMBER AND HYDROGEN GAS PRODUCING METHOD THEREFOR  
There is provided a hydrogen gas generating member which safely facilitates the hydrogen gas generation reaction by bringing an Al alloy which is subjected to rolling treatment or powdering...
US20150140357 Layer For An Electrical Contact Element, Layer System And Method For Producing A Layer  
A contact layer for an electrical contact is disclosed having bismuth and being tin-free.
US20110108996 JOINT STRUCTURE, JOINING MATERIAL AND METHOD FOR PRODUCING JOINING MATERIAL  
The present invention provides a semiconductor component having a joint structure including a semiconductor device, an electrode disposed opposite the semiconductor device, and a joining material...
US20170136583 High Impact Solder Toughness Alloy  
A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some...
US20160199916 SYNTHESIS OF FERROMAGNETIC MANGANESE-BISMUTH NANOPARTICLES USING A MANGANESE-BASED LIGATED ANIONIC-ELEMENT REAGENT COMPLEX (Mn-LAERC) AND FORMATION OF BULK MnBi MAGNETS THEREFROM  
A method for synthesizing ferromagnetic manganese-bismuth (MnBi) nanoparticles, and the MnBi nanoparticles so synthesized, are provided. The method makes use of a novel reagent termed a...
US20160074971 Lead-Free Solder Alloy  
Disclosed is a Sn—Bi—Cu—Ni series lead-free solder alloy which has a low melting point, good ductility and high tensile strength, suppresses strain in the substrate by suppressing generation of...
US20160043033 ELECTRONIC INTERCONNECTS AND DEVICES WITH TOPOLOGICAL SURFACE STATES AND METHODS FOR FABRICATING SAME  
An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also...
US20160040271 Silver-Bismuth Powder,Conductive Paste and Conductive Film  
To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of...
US20150368542 HEAT SOURCES AND ALLOYS FOR US IN DOWN-HOLE APPLICATIONS  
A chemical reaction heat source for use in heaters used in down-hole applications is provided. The heat source has a fuel composition that comprises thermite and a damping agent. The use of the...
US20150333027 Method of Forming Solder Bump, and Solder Bump  
A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most...

Matches 1 - 43 out of 43