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US20140138155 GLAZING WITH A SOLDERED CONNECTOR  
A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the...
US20140009059 Amalgam spheres for energy-saving lamps and their production  
Energy-saving lamps contain a gas filling of mercury vapour and argon in a gas discharge bulb. Amalgam spheres are used for filling the gas discharge bulb with mercury. A tin amalgam having a high...
US20110180311 SOLDER, ELECTRONIC PART, AND METHOD OF FABRICATING ELECTRONIC PART  
A solder material with favorable mechanical properties and high corrosion resistance is provided. The solder material is not apt to be melted in a re-heating process after the soldering process is...
US20150255414 SOLDER ALLOY TO ENHANCE RELIABILITY OF SOLDER INTERCONNECTS WITH NIPDAU OR NIAU SURFACE FINISHES DURING HIGH TEMPERATURE EXPOSURE  
Embodiments of the present disclosure describe solder compounds for electrically coupling integrated circuit (IC) substrates as well as methods for using the solder compounds to couple IC...
US20150231741 Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder  
A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial...
US20110303448 Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder  
A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial...
US20150144388 SOLDER MATERIAL AND BONDED STRUCTURE  
Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0≦[Cu]≦1.2, where contents...
US20120328361 MN DOPED SN-BASE SOLDER ALLOY AND SOLDER JOINTS THEREOF WITH SUPERIOR DROP SHOCK RELIABILITY  
A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt. % and less than or equal to...
US20090129970 PB FREE SOLDER ALLOY  
The present invention relates to a solder alloy used for mounting or plating electronic components on a printed circuit board (PCB) and the like, and, more particularly, to a Pb-free Sn—Ag based...
US20120038042 LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP  
A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after...
US20060013722 Lead-free solder pastes with increased reliability  
The introduction of undesired intermetallic phases (IMP) is reduced in lead-free solder joints. For this purpose, solder pastes are prepared, which have a metal powder mixture that generates a...
US20080042111 Copper-Containing Tin Powder, Method for Producing the Copper-Containing Tin Powder and Electro-Conductive Paste Using the Copper-Containing Tin Powder  
It is an object to provide a copper-containing tin powder having excellent capabilities in forming fine wiring circuits and filling via holes with ability in bond by melting at a low temperature....
US20100189594 SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT USING SAME  
Disclosed is a Pb-free solder alloy consisting of, in mass %, 0.1-1.5% of Ag, 0.5-0.75% of Cu, Ni in an amount satisfying 12.5≦Cu/Ni≦100, and the balance of Sn and unavoidable impurities. The...
US20080159904 SOLDER ALLOY  
An alloy suitable for use in a ball grid array or chip scale package, the alloy comprising from 0.05-1.5 wt. % copper; from 2.5-5 wt. % silver; one or both of from 0.005-0.3 wt % nickel and/or...
US20080292493 Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In  
Provided is a quaternary Pb-free solder composition incorporating Sn—Ag—Cu—In, which can prevent a cost increase and sufficiently ensure proccessability and mechanical property as a solder...
US20070134125 Lead-Free Solder Alloys And Solder Joints Thereof With Improved Drop Impact Resistance  
Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably comprise...
US20080152996 Intermetallic electrodes for lithium batteries  
This invention relates to intermetallic negative electrode compounds for non-aqueous, electrochemical lithium cells and batteries. More specifically, the invention relates to one or more electrode...
US20100092335 PB-FREE SOLDER ALLOY  
The present invention is provided to prevent the generation of whiskers via a lead (Pb)-free solder alloy. To achieve this objective, the present invention provides a Pb-free solder alloy...
US20070128068 SOLDER ALLOY, SOLDER BALL, AND SOLDER JOINT USING THE SAME  
A solder alloy is provided, which consists of, by mass %: 0.6 to 0.75% of Cu; 0.3 to 1.5% of Ag; more than 0.01% but not more than 0.1% of Ge; and the balance being Sn and incidental impurities....
US20100296965 ALLOY SOLDER AND ALLOY SOLDER MANUFACTURING METHOD  
The present invention solves the problem of the bonding strength of a Pb-free alloy solder being inferior to that of the conventional Pb-containing alloy solder and provides a Pb-free alloy solder...
US20050008525 Lead-free soft solder  
The invention relates to a lead-free soft solder, especially for use in electronic and electrical engineering. The aim of the invention is to provide a lead-free soft solder which does not tend to...
US20090289102 SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH  
Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free...
US20100059576 TIN ALLOY SOLDER COMPOSITION  
A lead-free and solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises, by weight, about 0.2% to about 1% copper; about 0.001% to...
US20140030140 SOLDER ALLOY  
A solder alloy may include a Sn—Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, Al2O3, or a combination thereof.
US20080026240 Solder, and Mounted Components Using the Same  
An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6...
US20090196789 SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP  
To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for...
US20050100474 Anti-tombstoning lead free alloys for surface mount reflow soldering  
A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary...
US20070071634 LOW MELTING TEMPERATURE COMPLIANT SOLDERS  
Low melting temperature compliant solders are disclosed. In one particular exemplary embodiment, a low melting temperature compliant solder alloy comprises from about 91.5% to about 97.998% by...
US20070059548 Grid array package using tin/silver columns  
Techniques have been developed to provide, in some embodiments, an attachment structure for mechanically and electrically connecting substrates that is robust to differences in coefficients of...
US20110274937 LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS  
[PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and...
US20150029670 SN-CU-BASED LEAD-FREE SOLDER ALLOY  
Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass...
US20120321506 METHOD FOR PRODUCING LEAD-FREE COPPER-BISMUTH ALLOYS AND INGOTS USEFUL FOR SAME  
An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin,...
US20100203353 Pb-Free Sn-Ag-Cu-Mn Solder  
A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees C. A solder joint and solder process embody the solder alloy as well as solder balls and solder paste...
US20090304545 LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER FOR AUTOMOBILE-MOUNTED ELECTRONIC MEMBER  
A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member...
US20110110813 Tin-indium based lead-free solders with zinc addition  
A new kind of Sn—In based Pb-free solders with Zn addition is disclosed, which includes: 15˜25 wt % In; 0.05˜1.5 wt % Zn; and balance Sn. When the solder of the present invention is used in the...
US20060239855 Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure  
A hybrid mounting method using a Pb-free solder alloy including a reflow soldering step of soldering a surface mounting component 2 to at least the upper surface of a circuit board 1 using a...
US20090286093 LEAD-FREE SOLDER  
According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of...
US20130336837 Lead-Free Solder Alloy for Vehicle Glass  
A lead-free solder alloy for a vehicle glass according to the present invention contains 26.0 to 56.0 mass % of In, 0.1 to 5.0 mass % of Ag, 0.002 to 0.05 mass % of Ti, 0.001 to 0.01 mass % of Si...
US20100031848 ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES  
The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having...
US20070092396 Technique For Increasing The Compliance Of Lead-Free Solders Containing Silver  
A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al...
US20090232696 Lead-free solder alloy  
A lead-free solder alloy is provided which has improved impact resistance to dropping even after thermal aging and which is excellent with respect to solderability, occurrence of voids, and...
US20140290931 High Temperature Solder For Downhole Components  
A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises a first component, a second component, and a solder electrically and...
US20150004490 INTERMETALLIC M-Sn5 (M=Fe, Cu, Co, Ni) COMPOUND AND A METHOD OF SYNTHESIS THEREOF  
Novel intermetallic materials are provided that are composed of tin and one or more additional metal(s) having a formula M(1-x)-Sn5, where −0.1≦x≦0.5, with 0.01≦x≦0.4 being more preferred and the...
US20140044589 LEAD-FREE SOLDER COMPOSITION FOR GLASS  
The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to...
US20150037088 Lead-Free Solder Alloy  
A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy...
US20100297470 Lead-free solder alloy  
A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and...
US20100272598 LEAD FREE SOLDER ALLOY AND MANUFACTURING METHOD THEREOF  
Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt %...
US20140037369 LEAD-FREE SOLDER ALLOY  
The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost....
US20060113683 Doped alloys for electrical interconnects, methods of production and uses thereof  
Lead free solder compositions are described herein that include at least one solder material; at least one dopant material, wherein the dopant is present in the material in an amount of less than...
US20120280593 Solder Material for Fastening an Outer Electrode on a Piezoelectric Component and Piezoelectric Component Comprising a Solder Material  
A solder material can be used for fastening an outer electrode on a piezoelectric component. The solder material contains tin as the main constituent and at least one addition from the group of...

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