Matches 1 - 21 out of 21


Match Document Document Title
US20110262029 System and method for detecting solder paste printing  
A system and a method detect solder paste printing. The system includes a detecting device for detecting solder paste when a scraping blade pushes the solder paste to spread over a template to...
US20130259359 JOINT INSPETION APPARATUS  
Disclosed herein is a joint inspection apparatus for judging whether an electronic component mounted on a board is appropriately soldered to the board capable of increasing accuracy in judging a...
US20090080764 X-RAY INSPECTION OF SOLDER REFLOW IN HIGH-DENSITY PRINTED CIRCUIT BOARD APPLICATIONS  
According to one embodiment, a method for processing one or more X-ray images includes: receiving at least one image of the one or more X-ray images, the one or more X-ray images being of an...
US20090097738 APPARATUS FOR INSPECTING SOLDER PRINTING  
An apparatus for inspecting solder printing includes a memory medium, an ideal solder information generation unit, and an image processing unit. Design data are stored in the memory medium. The...
US20130182942 METHOD FOR REGISTERING INSPECTION STANDARD FOR SOLDERING INSPECTION AND BOARD INSPECTION APPARATUS THEREBY  
Performing an inspection based on a shape of a solder fillet and setting a standard of the inspection. In order to set the standard of the inspection by a method for determining whether the solder...
US20070177789 Solder paste inspection system and method  
A solder paste inspection machine carries out the steps of automatically generating inspection data for solder paste deposits, automatically determining a squeegee direction of travel for said...
US20100021050 INSPECTING APPARATUS  
The shape of a cream solder is accurately detected, irrespective of a cream solder composition. An illumination setting section (95b) sets the intensity of infrared light radiated by an...
US20090202143 SOLDER PRINTING INSPECTION APPARATUS AND COMPONENT MOUNTING SYSTEM  
A component mounting system includes a solder printing inspection apparatus and a component mounting apparatus. The solder printing inspection apparatus includes an ideal solder position...
US20110216186 SOLDER PRINTING INSPECTION APPARATUS AND SOLDER PRINTING SYSTEM  
A solder printing inspection apparatus for inspection of solder printed on a circuit board has a multiplicity of lands for mounting of electronic components. The apparatus includes an irradiation...
US20120014589 METHOD FOR ANALYZING PERIPHERAL COMPONENT INTERCONNECT SOCKETS  
A method uses a time domain reflectometer (TDR) to determine unqualified clasps of a peripheral component interconnect (PCI) socket. A scanning electron microscope (SEM) captures an image of an...
US20100034452 Method And Apparatus For Reconstructing Solder Joints Using Constrained X-ray Photogrammetry  
A photogrammetry system is provided, for examining a feature of interest of a workpiece, the feature of interest having a first constraint. The system comprises a library of constraints, including...
US20140307948 SOLDER PRINT INSPECTING DEVICE  
A solder print inspecting device includes three-dimensional measurement lighting unit that directs a specific light at a printed substrate, a CCD camera for imaging the printed substrate that is...
US20140133738 METHOD OF INSPECTING A SOLDER JOINT  
A method of inspecting a solder joint through which a lead of a semiconductor device is mounted on a printed circuit board is disclosed. The method includes setting an estimated solder joint...
US20060291715 Machine vision system and method  
Solder fillets are inspected post-reflow by illuminating firstly from one side only along a dimension through a row of components. Only pixels arising from light received normal to the joints on...
US20080166039 PROCESS CONTROL METHOD, DATA REGISTRATION PROGRAM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE  
A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder...
US20090202142 CIRCUIT BOARD, METHOD FOR TESTING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD  
A circuit board according to the present invention comprises an insulating layer, a first electronic component mounted on the insulating layer, and a solder marker provided on the insulating...
US20110285840 SOLDER BONDING AND INSPECTION METHOD AND APPARATUS  
The present invention relates to an automated electrical connection module for automatically attaching a junction box to a composite solar cell structure. The electrical connection module includes...
US20130114882 SYSTEM, DEVICE, AND METHOD FOR ASSISTING VISUAL CHECK OPERATION OF INSPECTION RESULT  
With regard to a target (board) to which an automatic appearance inspection is completed, an image used in the inspection is stored, measurement data obtained by measurement processing in the...
US20160286652 EXPOSED PAD INTEGRATED CIRCUIT PACKAGE  
An IC assembly including an exposed pad integrated circuit (“IC”) package having a thermal pad with a top surface and a bottom surface and with at least one peripheral surface portion extending...
US20120294508 INSPECTION APPARATUS  
A substrate surface detection unit performs image analysis of cross-sectional images of an object to be inspected including a substrate and an electronic component and specifies a surface image on...
US20110103678 SYSTEM AND METHOD FOR ALIGNMENT AND INSPECTION OF BALL GRID ARRAY DEVICES  
A system and method for high-speed alignment and inspection of components, such as BGA devices, having non-uniform features is provided. During training time of a machine vision system, a small...

Matches 1 - 21 out of 21