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US20130250541 |
ELECTRONIC DEVICE HAVING SENSOR WINDOW COVER
An electronic device includes a housing defining an opening, a signal receiving unit received in the housing, a sensor window cover secured to the opening and corresponding to the signal receiving... |
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US20130155641 |
RELAY MODULE
Disclosed herein is an improved relay for replacing an electro-mechanical relay and converting the original electro-mechanical relay to a solid state relay. The improved relay includes a housing... |
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US20120133037 |
CLIP INTERCONNECT WITH ENCAPSULATION MATERIAL LOCKING FEATURE
A clip interconnect comprises a columnar part, a bridge part, and a locking feature. The bridge part has a plurality of sides. The columnar part and the bridge part are configured to form an angle... |
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US20130016492 |
DUAL-AXIS HINGE STRUCTURE AND ELECTRIC DEVICE HAVING THE SAME
A dual-axis hinge structure and electric device having the same are provided, and the dual-axis hinge structure includes a hinge base having a pushed portion, a first pivot portion having a first... |
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US20130176703 |
Thermally-Insulated Micro-Fabricated Atomic Clock Structure and Method of Forming the Atomic Clock Structure
A micro-fabricated atomic clock structure is thermally insulated so that the atomic clock structure can operate with very little power in an environment where the external temperature can drop to... |
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US20110253483 |
ELEVATOR DOOR FRAME WITH ELECTRONICS HOUSING
An exemplary enclosure for housing electronics useful with an elevator system includes a first sidewall and a second sidewall adjacent the first sidewall. A third sidewall is at an oblique angle... |
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US20110216518 |
Self-Cooled Thyristor Valve
The present invention relates to a self-cooled thyistor device for ultra-high voltage fault current limiter. a self-cooled thyristor valve, it adopts horizontal structure consisted by frames,... |
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US20150152805 |
CONTROLLER INTEGRATED FUEL PUMP MODULE
A controller integrated fuel pump module may include a receiving part formed on an outer surface of a flange assembled in a fuel tank, a PCB assembly configured by mounting elements of a... |
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US20130058067 |
SYSTEM WITH A HIGH POWER CHIP AND A LOW POWER CHIP HAVING LOW INTERCONNECT PARASITICS
An IC system includes low-power chips, e.g., memory chips, located proximate one or more higher power chips, e.g., logic chips, without suffering the effects of overheating. The IC system may... |
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US20130119907 |
Power Module with Current Routing
According to an exemplary embodiment, a bondwireless power module includes a common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side... |
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US20120262100 |
Bondwireless Power Module with Three-Dimensional Current Routing
According to an exemplary embodiment, a bondwireless power module includes a common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side... |
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US20110235304 |
IC PACKAGE STIFFENER WITH BEAM
Various exemplary embodiments relate to a stiffener for use with and integrated circuit (IC). The stiffener can be attached to the IC, and can utilize a planar portion and one or more beam... |
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US20090196009 |
Semiconductor module, wiring board , and wiring method
A semiconductor module includes a plurality of rectangular shaped semiconductor devices which are arranged in two rows such that each pair of adjacent semiconductor devices is in orientations... |
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US20090161718 |
TWO-BEAM SEMICONDUCTOR LASER DEVICE
A two-beam semiconductor laser device 10 includes: a two-beam semiconductor element LDC having a first and a second semiconductor laser elements LD1 and LD2 that can be driven independently and... |
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US20130308291 |
ROTATING RECTIFIER ASSEMBLY BUS BAR
A rectifier assembly includes a diode pack. A bus bar includes a first layer electrically connected to the diode pack. The first layer has a first yield strength and a first coefficient of thermal... |
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US20110052117 |
INTEGRATED CIRCUIT WITH PINS AT MULTIPLE EDGES OF A CHIP
An improved integrated circuit (IC) layout is described that provides conductive pads on opposite sides of a substrate. The conductive pads provide for connectivity to the chip in different chip... |
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US20080049412 |
HOLDER DEVICE FOR ANALYZING CHARACTERISTICS OF DOSIMETER
Provided is a holder device for analyzing characteristics of a dosimeter. In the holder device, the dosimeter is located in a desired direction on a radiation path along which radiation is... |
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US20090134502 |
LEADFRAME BASED FLASH MEMORY CARDS
A leadframe design for forming leadframe-based semiconductor packages having curvilinear shapes is disclosed. The leadframes may each include one or more curvilinear slots corresponding to... |
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US20140078711 |
ULTRASONIC WELDING
The described embodiments relate generally to ultrasonic welding and more particularly to performing an ultrasonic welding operation while rotating one part relative to a mating part. A... |
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US20150043190 |
EMBEDDED PACKAGING WITH PREFORMED VIAS
Microelectronic assemblies and methods of making the same are disclosed. In some embodiments, a microelectronic assembly includes a microelectronic element having edge surfaces bounding a front... |
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US20130128488 |
Lithium Battery, Method for Manufacturing a Lithium Battery, Integrated Circuit and Method of Manufacturing an Integrated Circuit
A lithium battery includes a cathode, an anode including a component made of silicon, a separator element disposed between the cathode and the anode, an electrolyte, and a substrate. The anode is... |
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US20110103034 |
ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWEEN CONDUCTING NODES
An electronic chip includes a plurality of conducting pins and a plurality of insulating blocks. The conducting pins are disposed on an outer side of the electronic chip to provide electrical... |
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US20110148469 |
STACKED DEVICE DETECTION AND IDENTIFICATION
Various embodiments include apparatus and methods having circuitry to detect and/or assign identification information to dice arranged in a stack and coupled by conductive paths. |
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US20100020524 |
PROTECTIVE PACKAGE FOR AN ELECTROMECHANICAL MICRO-SYSTEM COMPRISING A WIRING RELAY
The field of the invention is that of the wiring of electromechanical micro-systems also called MEMS (the acronym standing for Micro Electro Mechanical Systems) and more particularly micro-systems... |
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US20130155642 |
MODIFIED TRANSISTOR OUTLINE (TO)-CAN ASSEMBLY FOR USE IN OPTICAL COMMUNICATIONS AND A METHOD
A modified TO-can assembly is provided that has greater versatility with respect to spatial constraints than known TO-can assemblies and that is suitable for use in a wider range of applications... |
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US20120176763 |
CRYSTAL OSCILLATOR
A crystal oscillator is configured by accommodating a crystal blank that functions as a crystal unit and an IC chip that includes at least an oscillator circuit using the crystal blank into a... |
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US20080049386 |
ENCAPSULATED MICROCOMPONENT EQUIPPED WITH AT LEAST ONE GETTER
The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a... |
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US20070291464 |
EMI shielding module
This invention discloses an EMI shielding module installed on the circuit board with at least one connection hole. This EMI shielding module includes a shielding case and at least one protrusion.... |
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US20080217384 |
ELLIPTIC C4 WITH OPTIMAL ORIENTATION FOR ENHANCED RELIABILITY IN ELECTRONIC PACKAGES
An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical... |
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US20090261457 |
DIE STACKING WITH AN ANNULAR VIA HAVING A RECESSED SOCKET
A die stack including a die having an annular via with a recessed conductive socket and methods of forming the die stack provide a structure for use in a variety of electronic systems. In an... |
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US20140328042 |
Power Supply Module
A power supply module and a method for manufacturing the same are disclosed. The power supply module includes a coil including a coil body and a connecting terminal; electronic components at least... |
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US20080144304 |
CARBON NANOTUBE BASED COMPLIANT MECHANISM
A nano-scale compliant mechanism includes a coupler and a plurality of nanotubes disposed for nano-scale motion relative to a grounded component. The nanotubes are fastened at one end to the... |
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US20120098020 |
CERAMIC SUBSTRATE FOR MOUNTING A DEVICE, CERAMIC SUBSTRATE FOR MOUNTING AN LED, LED LAMP, HEADLIGHT AND ELECTRONIC PARTS
According to one embodiment, a ceramic substrate for mounting a device is provided. The ceramic substrate includes a through-hole and a recessed portion provided on at least one edge surface thereof. |
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US20130027899 |
EMBEDDED PASSIVE INTEGRATION
System and method for embedded passive integration relating to a multi-chip packaged device. The packaged device includes a capacitance layer that is configured for electrical coupling to a power... |
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US20120007531 |
FAN MOTOR CONTROL SYSTEMS
A fan system includes a motor control module external to a motor housing of a fan assembly. The motor control module includes a speed control module. The fan assembly includes a fan and the motor... |
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US20120243182 |
SENSORS FOR HIGH-TEMPERATURE ENVIRONMENTS AND METHOD FOR ASSEMBLING SAME
A sensor assembly includes an outer housing and at least one high-impedance sensing device positioned within the outer housing. The sensor assembly also includes a buffering circuit comprising at... |
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US20120265390 |
Controller Assemblies For Electric Drive Utility Vehicles
Controller assemblies and packaging for electronic control systems of electric motors utilized in utility vehicles or other power equipment are disclosed. The controller assemblies are packaged... |
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US20090251879 |
DIE THINNING PROCESSES AND STRUCTURES
Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or... |
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US20110051378 |
Wafer-Level Molded Structure for Package Assembly
An integrated circuit structure includes a bottom die; a top die bonded to the bottom die with the top die having a size smaller than the bottom die; and a molding compound over the bottom die and... |
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US20130050977 |
HOUSING AND PORTABLE ELECTRONIC DEVICE USING SAME
A housing for a portable electronic device is transparent and U-shaped. The housing includes a first section, a second section opposite to the first section, and a connection portion connecting... |
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US20050128726 |
System and method for protecting pins of an integrated circuit
An apparatus for protecting pins of an integrated circuit comprises a cover member; and at least one securing mechanism for securing the cover member to an assembly that includes at least one... |
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US20080205027 |
ASSEMBLY OF TWO PARTS OF AN INTEGRATED ELECTRONIC CIRCUIT
A process for assembling two parts of an integrated electronic circuit has two successive steps. During a first step, the two circuit parts are made into a single unit by molecular bonding,... |
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US20150109753 |
Omedia Panel
An Omedia panel may be provided that includes an at least one network interface device, a housing, and a front panel. The at least one network interface device might be in communication with a... |
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US20120113615 |
SYSTEMS AND METHODS FOR IMPROVED CHIP DEVICE PERFORMANCE
Systems and methods for improved chip device performance are discussed herein. An exemplary chip device for use in an integrated circuit comprises a bottom and a top opposite the bottom. The chip... |
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US20080054452 |
MICROELECTRONIC DEVICE HAVING A PLURALITY OF STACKED MICROELECTRONIC DIES AND METHODS FOR MANUFACTURING SUCH MICROELECTRONIC ASSEMBLIES
Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the... |
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US20070206369 |
Light source module and lighting device for a vehicle
A light source module includes a ceramic circuit board having a predetermined conductive pattern, a semiconductor light emitting element arranged on said ceramic circuit board and connected to the... |
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US20060279943 |
Interposers with alignment fences and semiconductor device assemblies including the interposers
An interposer includes a fence that orients or aligns a semiconductor device, such as a flip-chip type semiconductor device, with an interposer substrate. The fence may include edges that are... |
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US20120127689 |
INTEGRATED PACKAGE CIRCUIT WITH STIFFENER
The present disclosure relates to an improved integrated circuit package and method with a encapsulant retention structure located adjacent to a packaged integrated chip on a substrate. The... |
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US20120002392 |
ELECTRO-STATIC DISCHARGE PROTECTION FOR DIE OF A MULTI-CHIP MODULE
Electro-static discharge (“ESD”) protection for a die of a multi-chip module is described. A contact has an externally exposed surface after formation of the die and prior to assembly of the... |
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US20100172117 |
POWER MODULE
Provided is a power module capable of welding a snubber capacitor without causing melting damage to a resin housing by welding heat. When leads of a snubber capacitor are respectively welded to... |