Matches 1 - 42 out of 42


Match Document Document Title
US20140204551 CIRCUIT BOARD ASSEMBLY  
A circuit board assembly with a printed circuit board, which has an SMD mounting location for attaching a first integrated circuit having an electrical circuit. A replacement circuit board having...
US20110104948 SURFACE MOUNT FOOTPRINT IN-LINE CAPACITANCE  
An interconnection system with capacitors integrated into a printed circuit board footprint of an electrical connector. One end of each capacitor shares a pad on the printed circuit board with a...
US20090016036 CONDUCTOR REINFORCEMENT FOR CIRCUIT BOARDS  
Conductors of a printed circuit board have conductive flanges between pads and traces. In one embodiment, the flange has a maximum width at least one half the maximum width of the pad. It is...
US20110134618 CONNECTION STRUCTURE FOR CHIP-ON-GLASS DRIVER IC AND CONNECTION METHOD THEREFOR  
A connection structure for a chip-on-glass (COG) driver IC and a connection method therefor are provided. The connection structure includes a driver IC having a surface provided with a plurality...
US20110310578 CUT-EDGE POSITIONING TYPE SOLDERING STRUCTURE AND METHOD FOR PREVENTING PIN DEVIATION  
A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are...
US20090273939 SURFACE MOUNT CIRCUIT BOARD INDICATOR  
The present invention is directed to a surface mount circuit board indicator. In one embodiment the surface mount circuit board indicator includes a printed circuit board (PCB) having at least one...
US20100149769 CIRCUIT BOARD DEVICE AND INTEGRATED CIRCUIT DEVICE  
A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor...
US20080089044 Spacer block for rebuilt electrically operated automatic transmission controller assembly  
A spacer block that provides for a method of rebuilding an electrically operated automatic transmission controller assembly is disclosed. The block allows for offsetting and stabilizing or...
US20060176674 Interposer for decoupling integrated circuits on a circuit board  
An interposer (20) is used for decoupling a microchip (10) on a circuit board (30). The interposer (20) contains on its upper and lower surfaces structured metal layers (26a-26d) for attachment to...
US20130107484 CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME  
A semiconductor device (20) has a plurality of device-side lands (23) which are disposed asymmetrically in relation to an intersection point (B). The plurality of device-side lands (23) include 45...
US20110292625 BONDING PAD STRUCTURE  
A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at...
US20110114706 MOUNTING STRUCTURE, AND METHOD OF MANUFACTURING MOUNTING STRUCTURE  
A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having...
US20060169488 Circuit board mounted with surface mount type circuit component and method for producing the same  
A circuit board mounted with a surface mount type circuit component, including: a circuit board body mounted with the surface mount type circuit component, at least a part of a top surface of the...
US20080106877 System and method for manufacturing C-shaped leads  
A system method for manufacturing leads is provided. The method includes providing a conductive sheet, shaping the conductive sheet into at least two opposing longitudinal strips and a plurality...
US20090303691 PORTABLE TERMINAL  
Disclosed is a portable terminal, including a first circuit board coupled to a main body and having a first connection terminal mounted on a surface thereof; a second circuit board coupled to the...
US20140085848 ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT  
An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends...
US20090237901 Monolithic Molded Flexible Electronic Assemblies Without Solder and Methods for their Manufacture  
A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The...
US20090310320 Low profile solder grid array technology for printed circuit board surface mount components  
A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting...
US20080049407 Chip Element  
A chip element according to this invention can reduce the influence of parasitic capacitance and parasitic inductance when used in a GHz band. A substrate is formed of a low permittivity material...
US20060203459 Method of mounting a substrate to a motherboard  
In one embodiment a method is provided. A method comprising forming a plurality of electromechanical formations to electromechanical couple a first printed circuit board to a second printed...
US20090316375 Electronic circuit board including surface mount device  
An electronic circuit board includes a substrate, a plurality of devices mounted on the substrate, and a pattern part disposed on a surface of the substrate. The devices include a surface mount...
US20130170165 ELECTRONIC-COMPONENT MOUNTED BODY, ELECTRONIC COMPONENT, AND CIRCUIT BOARD  
An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode...
US20100061065 ELECTRONIC DEVICE  
According to one embodiment, an electronic device includes a housing, a circuit board in the housing, a plurality of surface-mountable electronic components, and a reinforcing frame. The circuit...
US20080237889 Semiconductor package, method of fabricating the same, and semiconductor package mold  
Provided is a semiconductor package, which may include a plurality of semiconductor chips to form a multi-stack semiconductor package (MSP), a method of fabricating the semiconductor package and...
US20080062665 MOUNTING STRUCTURE  
There is proposed a mounting structure including a plurality of components each having a plurality of solder bumps, a substrate having a plurality of lands, and a solder connecting portion for...
US20140355226 ANISOTROPIC CONDUCTIVE FILM LAMINATE, DISPLAY DEVICE HAVING THE SAME, AND METHOD FOR MANUFACTURING THE DISPLAY DEVICE  
An anisotropic conductive film laminate is provided. The anisotropic conductive film laminate includes a first non-conductive film, an anisotropic conductive film disposed on the first...
US20080218985 MULTILAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME  
A printed circuit board is provided which is capable of shortening intervals among core layer vias and suppressing high impedance. After the core layer vias each having a cylindrical conducting...
US20130033836 CHIP-COMPONENT STRUCTURE  
A chip-component structure includes an interposer and a multilayer capacitor mounted thereon. The interposer includes a substrate, a component connecting electrode, an external connection...
US20080174977 ELECTRONIC COMPONENT CONTAINED SUBSTRATE  
An electronic component contained substrate in which an electronic component is mounted between a pair of wiring substrates, wherein the wiring substrates are connected electrically via solder...
US20110090659 Package Having An Inner Shield And Method For Making The Same  
The present invention relates to a package having an inner shield and a method for making the same. The package includes a substrate, a plurality of electrical elements, a molding compound, an...
US20160198568 PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE  
A printed circuit board includes a first insulating layer including a first circuit pattern, a second insulating layer including a second circuit pattern, and a dummy pattern disposed in the first...
US20160190053 WIRING SUBSTRATE  
A wiring substrate includes a first substrate and an electronic component mounted on an upper surface of the first substrate. A first pad is formed on an uppermost wiring layer of the first...
US20160095218 COMPOSITE WIRING BOARD AND MOUNTING STRUCTURE OF THE SAME  
A composite wiring board includes a first wiring board having an opening for housing an electronic component, and including a plurality of first connection pads on an upper surface and a plurality...
US20160088733 INTERPOSER, ELECTRONIC COMPONENT INCLUDING THE SAME, AND BOARD HAVING ELECTRONIC COMPONENT INCLUDING THE SAME  
There are provided an interposer, an electronic component including the same, and a board having an electronic component including the same and the interposer may include an insulating board,...
US20160071807 METHODOLOGY TO ACHIEVE ZERO WARPAGE FOR IC PACKAGE  
A methodology for addressing package warpage is described. In an embodiment a package includes a die mounted on a wiring board. Portion of a metal plane within the wiring board includes a reduced...
US20160057869 VOIDING CONTROL USING SOLID SOLDER PREFORMS EMBEDDED IN SOLDER PASTE  
Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the...
US20160057860 METALLIZED PARTICLE INTERCONNECT WITH SOLDER COMPONENTS  
An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the...
US20160020163 Wiring Substrate and Semiconductor Device  
A wiring substrate includes a first wiring structure and a second wiring structure. The first wiring structure includes a first insulating layer, which covers a first wiring layer, and a via...
US20150359102 Electronic Device, Test Board, and Semiconductor Device Manufacturing Method  
Electrical characteristics of a mounting board over which a semiconductor device is mounted is improved. A mounting board (wiring board) includes a plurality of first through holes and second...
US20150342045 SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, BACKLIGHT DEVICE, AND MOUNTING SUBSTRATE  
A semiconductor device mounting structure includes a semiconductor device and a mounting substrate. The semiconductor device includes a first external connection terminal and a device-side...
US20150325508 SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF AND CARRIER STRUCTURE  
A carrier structure is provided, which includes: a metal oxide plate having opposite first and second surfaces and a plurality of through holes penetrating the first and second surfaces; a...
US20130039026 SEMICONDUCTOR DEVICE  
Provided is a semiconductor device in which misalignment between a semiconductor die and a substrate (e.g., a circuit board) can be prevented or substantially reduced when the semiconductor die is...

Matches 1 - 42 out of 42