Matches 1 - 43 out of 43

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US20130083494 THREE-DIMENSIONAL ELECTRONICS PACKAGING  
Solutions for providing stackable electronics packaging are provided. In some embodiments, electronic components are accommodated in the cavity of a printed circuit board (PCB) or printed circuit...
US20150245524 MODULAR ACCESSORY  
An accessory is provided that includes power supply module, a first functional module, and a second functional module. The power supply module can be configured to be suspended beneath an overhead...
US20110188210 THREE-DIMENSIONAL SOC STRUCTURE FORMED BY STACKING MULTIPLE CHIP MODULES  
A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector...
US20120020030 ELECTRICAL PACK WITH SEPARATE CONTROL AND POWER MODULES  
An electrical housing includes power components grouped together in power modules and control components grouped together in a control module that is separate from the power modules.
US20080062655 EQUIPMENT RACK PANEL SYSTEM AND METHOD  
An equipment rack panel system using one or more rack extension panels with optional raceway to interconnect equipment cables to service cables through connectors within the rack extension panel....
US20140078686 Stackable Communications System  
A stackable communications apparatus comprises modules to be powered on in a sequence. Each of the modules comprises components that perform an individual function or group of functions of the...
US20080002346 Stackable modular personal computer structure  
A stackable modular personal computer structure, comprising a plurality of framework; the plural frameworks stacked to combine with each other in a sequence; a bottom of each other framework above...
US20070070608 Packaged electronic devices and process of manufacturing same  
An electronic module and a process for forming an electronic module are provided. Uniform and sealed air gaps are formed in a vertical direction between two or more electronic devices. The uniform...
US20130094155 ELECTRONIC DEVICE AND ELECTRONIC DEVICE ASSEMBLY THEREOF  
An electronic device assembly includes at least two electronic devices. Each electronic device has a body, two circuit boards and a flexible circuit board. A male connector and a female connector...
US20070297158 Front-to-back stacked device  
A front-to-back stack device is applied to two or more modularized circuit boards, such as two servo module circuit boards in a blade server. Through the use of the stack device, the two servo...
US20140036454 BVA INTERPOSER  
A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge...
US20130016475 MODULAR FREQUENCY BASED FIBER TRANSPORT AND RADIO TRANSPORT REPEATER PLATFORM FOR DIVERSE RADIO FREQUENCY CONFIGURABLE DEPLOYMENTS  
A modular design repeater platform that allows unique deployment configurations and rapid upgrading, and modifications to a deployed system in a wireless or fiber optic network system is...
US20090214051 STACKABLE COMMUNICATIONS SYSTEM  
A method and apparatus describes a stackable communications system. A system is modularized and stacked in various configurations. The interconnections between the modules may be by close...
US20080170374 Low-Thickness Electronic Module Comprising a Stack of Electronic Packages Provided with Connection Balls  
The invention relates to an electronic module (100) comprising a stack of n packages (10, 10a, 10b) of predetermined thickness E, which are provided on a lower surface with connection balls (12)...
US20080165509 Host With Multiple Adapters for Coupling Consumer Electronic Devices  
A modular system of an appliance host with multiple identical host service interfaces. The multiple identical host service interfaces provide a mechanical service and an electrical service for...
US20130314865 POWER SUPPLY APPARATUS AND MODULAR POWER CONNECTING METHOD THEREOF  
A power supply apparatus includes a first electronic device, a second electronic device, and plural power modules. The first electronic device includes a first compartment. The first compartment...
US20140168908 ELECTRONIC MODULE  
An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic...
US20100193008 Electrical Connection System For Photovoltaic Solar Installations  
A kit for an electrical connection system for photovoltaic solar installations, which includes a plurality of solar cells each with their own electrical connection. The kit includes a number of...
US20080304242 STACK MODULE, CARD INCLUDING THE STACK MODULE, AND SYSTEM INCLUDING THE STACK MODULE  
Provided are a high reliability stack module fabricated at low cost by using simplified processes, a card using the stack module, and a system using the stack module. In the stack module, unit...
US20080304241 Electronic Device, a Housing Part, and a Method of Manufacturing a Housing Part  
The present invention relates to an electronic device (1) which comprises a modular housing (2) comprising a plurality of stacked housing parts (4, 6) that are mechanically interconnected by...
US20050152116 Methods and apparatus for passive cooling of electronic units  
A cooling apparatus for an electronic unit is described which includes a first plate, a second plate, and a controlling mechanism. The first and second plates are generally planar and have holes...
US20140009894 COMMUNICATION DEVICE HAVING MULTI-MODULE ASSEMBLY  
A communication device having multi-module assembly is provided. The communication device includes a body, a first communication module and a second communication module. The body has a front...
US20080002370 Scalable memory DIMM designs with vertical stackup connector  
A plurality of memory modules are vertically stacked on a printed circuit board (PCB). Each memory module includes a socket located on a longitudinal side to receive an overlying memory module in...
US20130223018 HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF  
A high-density Subscriber Identity Module (SIM) card package and a production method thereof are provided. The SIM card package includes a substrate, an Integrated Circuit (IC) chip, a bonding...
US20080137312 INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING THIN PROFILE TECHNIQUES  
An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over...
US20100246141 ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF  
One aspect of the present invention provides an electronic package, comprising at least a first module and a second module arranged on top of the first module, the modules together in the form of...
US20130100616 MULTIPLE DIE STACKING FOR TWO OR MORE DIE  
A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The...
US20150222195 ELECTRIC POWER CONVERTER  
An electric power converter has a semiconductor stacked unit, auxiliary electronic components, a pressing member, and a case for accommodating these components. The case has a front wall in a...
US20140355221 POWER CONVERTER WITH BUS BARS  
A power converter is equipped with a semiconductor module stack, a positive bus bar stack, and a negative bus bar stack. The positive bus bar stack has a first positive bus bar and a second...
US20120020026 MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION  
A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface...
US20110038127 MULTIPLE CHIP MODULE AND PACKAGE STACKING METHOD FOR STORAGE DEVICES  
Stacking techniques are illustrated in example embodiments of the present invention wherein semiconductor dies are mounted in a module to become a MCM which serves as the basic building block. A...
US20100284156 VERTICALLY-STACKED ELECTRONIC DEVICES HAVING CONDUCTIVE CARBON FILMS  
Vertically-stacked electronic devices having conductive carbon films are disclosed. The vertically-stacked devices exhibit non-linear current-versus-voltage response over a voltage sweep range in...
US20100148337 STACKABLE SEMICONDUCTOR PACKAGE AND PROCESS TO MANUFACTURE SAME  
In one form a stackable electrical device package has a first plurality of traces, the electrical device bonded to at least some of the first plurality of traces, a second plurality of vertical...
US20170112001 STACK STRUCTURE AND THE MANUFACTURING METHOD OF THE SAME  
Disclosed is a stack structure and its manufacturing method. The stack structure includes at least two stacked modules, wherein at least one of the modules is a power module; at least one metal...
US20160249478 ELECTRICAL MODULES AND MODULAR ELECTRONIC BUILDING SYSTEMS  
The present disclosure provides an electrical module and a modular electrical building system including electrical modules. The electrical module includes a printed circuit board (PCB), a housing...
US20160174392 DRIVE APPARATUS  
Plug having common specifications are arranged on the side surfaces of each of the devices of different types included in the drive apparatus that controls an electric motor, and the plugs are...
US20160165724 MODULAR PRINTED CIRCUIT BOARD ELECTRICAL INTEGRITY AND USES  
Modular printed circuit board (PCB) structures and methods of producing them are described herein. In some embodiments, a PCB structure may include a first PCB module including first structures on...
US20150373847 MODULAR PRINTED CIRCUIT BOARD  
Described are apparatuses for modular printed circuit boards (PCB) and methods for producing modular PCBs. An apparatus may include a first PCB module with a first pattern of routing structures on...
US20150138732 Semiconductor Device  
A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output...
US20130176687 EXPANDABLE CONTROL UNIT AND CONTROL SYSTEM FOR INDUSTRIAL APPLICATIONS  
A control unit for industrial applications is provided comprising a first compute box having a first microprocessor and being configured to run at least one first operating system. A second...
US20120218719 System and Method of Forming Semiconductor Devices  
Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining...
US20120069530 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME  
According to one embodiment, a semiconductor device includes a stacked chip includes semiconductor chips which are stacked, the semiconductor chips comprises semiconductor substrates and through...
US20110058342 Semiconductor Device  
An object of the present invention is to provide a semiconductor device having a small-sized, thin, and high heat-dissipating multilayer frame mounting structure. To achieve the object, the...
Matches 1 - 43 out of 43