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US20100254093 |
ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME
An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to... |
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US20050201065 |
Preferential ground and via exit structures for printed circuit boards
A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. In the via arrangement, sets of... |
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US20170105322 |
Aluminum EMI / RF Shield
A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for... |
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US20080019103 |
Cooling Device for Light Emitting Diode (LED) Module and Method for Fabricating the Same
A cooling device of a light emitting diode module and a method for fabricating the same are disclosed. According to the cooling device for a light emitting diode module of the present invention,... |
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US20140133105 |
METHOD OF EMBEDDING CPU/GPU/LOGIC CHIP INTO A SUBSTRATE OF A PACKAGE-ON-PACKAGE STRUCTURE
Embodiments of the invention provide an IC system in which low-power chips can be positioned proximate high-power chips without suffering the effects of overheating. In one embodiment, the IC... |
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US20080144292 |
Semiconductor module with heat sink and method thereof
A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct... |
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US20140078679 |
ELECTRONIC DEVICE
An electronic device includes: a resin plate; an electronic component disposed on one side of the resin plate in a thickness direction; and a heat transfer member having higher heat conductivity... |
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US20120120610 |
SEMICONDUCTOR DEVICE
An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat... |
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US20080310110 |
SYSTEM AND METHOD FOR MOUNTING A COOLING DEVICE AND METHOD OF FABRICATION
A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes... |
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US20070253169 |
WEDGELOCK DEVICE FOR INCREASED THERMAL CONDUCTIVITY OF A PRINTED WIRING WIRING ASSEMBLY
A wedgelock device is provided that comprises a shaft, and a plurality of thermally conductive wedge segments mounted on the shaft. The wedgelock device has at least one wedge segment that is... |
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US20070177356 |
THREE-DIMENSIONAL COLD PLATE AND METHOD OF MANUFACTURING SAME
A three-dimensional cold plate assembly and method of manufacturing the same is disclosed. The cold plate assembly includes a metallic substrate having a top side and a bottom side and a... |
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US20140185245 |
SWITCHING CIRCUIT LAYOUT WITH HEATSINK
A circuit board adapted for use in an switching converter for connecting a plurality of switches including a first switch, a second switch, a third switch and a fourth switch. The circuit board... |
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US20120147565 |
HEAT DISSIPATION AND TEMPERATURE-HOMOGENIZING STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME
A heat dissipation and temperature-homogenizing structure which includes a body made of a material with low thermal conductivity and a heat conducting member made of a material with high thermal... |
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US20110273848 |
CONTROL DEVICE
It is possible to provide a small-size and light-weight control device having a structure which prevents detaching of a board even when an external shock is applied without using a screwed... |
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US20070115644 |
Method of cooling electronic device and electronic device with improved cooling efficiency
A method of cooling an electronic device that includes a case, a printed circuit board, and internal components. The method includes disposing a heat conductive filler having elasticity on any one... |
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US20050063158 |
Cooling device for electronic and electrical components
Cooling apparatus for electronic and electrical components, comprising a closed circuit, through which a cooling medium flows and which has an evaporator, an evaporator hood made from graphite... |
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US20120170224 |
CIRCUIT BOARD FRAME WITH INTEGRAL HEAT SINK FOR ENHANCED THERMAL TRANSFER
A circuit board frame and a circuit board assembly that includes the circuit board frame includes a first region designed for receiving a circuit board, and a second region contiguous with the... |
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US20110310561 |
TELEVISION, RADIATING MEMBER, AND ELECTRONIC APPARATUS
According to one embodiment, an electronic apparatus includes a housing, a heat-generating component in the housing, a first radiating portion in the housing thermally connected to the... |
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US20140092561 |
HANDHELD MOBILE DEVICE AND BACK COVER FOR THE SAME
In various embodiments, a handheld mobile device and back cover for the same are provided. The back cover for a handheld mobile device comprises: a back cover body having a first surface and a... |
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US20150062827 |
HEAT SINK AND SUBSTRATE UNIT
A heat sink includes: a fixing unit fixed to a heating element; and a heat dissipation unit including a heat dissipation protruding portion and configured to slide with respect to the fixing unit. |
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US20080144291 |
METHODS AND DEVICES FOR COOLING PRINTED CIRCUIT BOARDS
Methods and devices for cooling printed circuit boards having at least one heat source are disclosed and described. Such a device may include a dielectric layer disposed onto a surface of a... |
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US20160135282 |
ELECTRONIC APPARATUS
According to one embodiment, an electronic apparatus comprises a circuit board, a metal member and a thermal coupling member. The circuit board comprises a heat-producing component and a ground... |
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US20150029674 |
PRINTED CIRCUIT BOARD SET HAVING HIGH-EFFICIENCY HEAT DISSIPATION
A printed circuit board set having high-efficiency heat dissipation includes a printed circuit board (PCB) and a heat dissipating device. The PCB has multiple electronic elements, at least one... |
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US20130235531 |
ELECTRONIC COMPONENT BOARD AND PRODUCTION METHOD OF THE SAME
An electronic component board is made by attaching bus bars to an insulating plate, and by electrically connecting electronic components to the bus bars. In the electronic component board, heat... |
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US20130285513 |
CONTROL DEVICE AND MOTOR UNIT INCLUDING CONTROL DEVICE
A control device for a motor unit includes: a housing including a bottom wall, a side wall and an accommodation space formed so as to be surrounded by the side wall; a heat sink including a first... |
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US20130194754 |
TRANSMISSION LINE TRANSITION HAVING VERTICAL STRUCTURE AND SINGLE CHIP PACKAGE USING LAND GRIP ARRAY COUPLING
An apparatus for a single chip package using Land Grid Array (LGA) coupling is provided. The apparatus includes a multi-layer substrate, at least one integrated circuit chip, and a Printed Circuit... |
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US20090154113 |
THERMAL ENERGY STORAGE FOR MOBILE COMPUTING THERMAL MANAGEMENT
In some embodiments, a device includes power source circuitry, a circuit board supporting electrical components to receive electrical power from the power source circuitry. The device further... |
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US20140071631 |
PRINTED CIRCUIT BOARD UNIT
A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper... |
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US20060250780 |
System component interposer
In some embodiments, a high density circuit module is provided having a support frame supporting a flexible circuit. A main integrated circuit and one or more supporting integrated circuit are... |
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US20140355215 |
Embedded Heat Slug to Enhance Substrate Thermal Conductivity
An electronic package is fabricated wherein a substrate is provided having three or more layers. A heat slug is embedded completely within the substrate. A die is attached above the substrate.... |
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US20100321897 |
COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES
According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies. In exemplary embodiments, thermal interface material is... |
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US20080170372 |
Electronic control apparatus and method of manufacturing the same
An electronic control apparatus includes a circuit board with a circuit element mounted thereon, a heatsink for dissipating heat from the circuit board placed thereon, an external terminal having... |
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US20050157469 |
Cooling arrangement for a printed circuit board with a heat-dissipating electronic element
A cooling arrangement for a printed circuit board with a heat-dissipating electronic element comprises a radiating layer (108, 208, 308) on the top side of the PCB (100, 200, 300) and a covering... |
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US20140092562 |
INSULATION AND HEAT RADIATION STRUCTURE OF POWER DEVICE, CIRCUIT BOARD, AND POWER SUPPLY APPARATUS
Embodiments of the present application provide an insulation and heat radiation structure of a power device, a circuit board, and a power supply apparatus. The insulation and heat radiation... |
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US20050254206 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus
A circuit board is used in common for the first electronic apparatus as the first configuration and for the second electronic apparatus as the second configuration, and the circuit board includes... |
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US20140313676 |
ELECTRONIC COMPONENT PACKAGE
An electronic component package includes: a first insulation layer; an electronic component mounted in one surface of the first insulation layer; a heat sink formed with a cavity corresponding to... |
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US20130058042 |
Laminated heat sinks
An apparatus includes a heat sink with a complex 3D structure. The heat sink includes a stack of metal layers. The metal layers are mechanically connected together and being separated by physical... |
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US20120224329 |
PORTABLE ELECTRONIC DEVICE WITH ENHANCED HEAT DISSIPATION
A portable electronic device includes a circuit board, a heat sink a hinge and a heat dissipating plate. The circuit board is equipped with a heat generating component. The heat sink is for... |
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US20050162835 |
Production of via hole in flexible circuit printable board
A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least... |
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US20160219713 |
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
An electronic component embedded printed circuit board and method thereof a first insulation layer, an electronic component, a second insulation layer, and a circuit layer. The first insulation... |
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US20150116948 |
ELECTRONIC DEVICE AND ELECTROMAGNETIC WAVE SHIELDING MODULE THEREOF
An electronic device including a circuit board, a heat generating component and an electromagnetic wave shielding module is provided. The circuit board has a ground plane. The heat generating... |
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US20100271785 |
HEAT-DISSIPATING AND FIXING MECHANISM OF ELECTRONIC COMPONENT AND PROCESS FOR ASSEMBLING SAME
A heat-dissipating and fixing mechanism of an electronic component includes a heat-dissipating element, a circuit board and a thermally-conductive adhesive interface. The circuit board has... |
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US20080170371 |
Combination assembly of led and heat sink
A combination assembly of LED and heat sink includes a heat sink having a substrate and a plurality of fins, a circuit board provided on the substrate and at least one LED unit provided on the... |
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US20080101036 |
Heat-dissipating assembly structure
A heat-dissipating assembly structure is disclosed that includes a first and a second thermally conductive sheets, each of which includes a plurality of spaced fastening sections including a... |
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US20140347821 |
THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING LINK BETWEEN AT LEAST ONE ELECTRONIC COMPONENT AND A COMPLETELY OR PARTIALLY METAL RADIATOR
The invention relates to a method for producing a thermally conductive and electrically insulating link between at least one electronic component (2) and a completely or partially metal radiator... |
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US20140126156 |
CIRCUIT MODULE
In a circuit module, a multilayer substrate has a core layer made of a metal, a filter device is stored in a storage portion of the core layer, the filter device and a power amp IC are arranged... |
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US20080285239 |
Ic Holder
Provided is an integrated circuit (IC) holder that includes: a case into which an IC package is inserted; a fastening unit for fastening the case to a printed circuit board (PCB); and a... |
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US20060181860 |
Heat sink having directive heat elements
A heat sink includes a heat conducting substrate and a plurality of directive heat elements disposed within the substrate such that a first end of each of the plurality directive heat elements are... |
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US20080137308 |
Thermal Management system and method for semiconductor lighting systems
A method and assembly for dissipating heat from semiconducting light sources. The light sources are connected to a circuit board with a plurality of layers. The waste heat produced by the... |
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US20110063801 |
ELECTRONIC DEVICE WITH A HEAT INSULATING STRUCTURE
An electronic device includes a circuit board and a heat insulating structure. The heat insulating structure includes a heat source, an enclosure for covering the heat source, and a heat... |