Matches 1 - 43 out of 43


Match Document Document Title
US20120050997 Heatsink Device Directly Contacting a Heat Source to Achieve a Quick Dissipation Effect  
A heatsink device includes an insulating board having at least one periphery, a first face and a second face, at least two conductive plates mounted on at least one of the first face and the...
US20110242766 POWER SUPPLY AND HEAT DISSIPATION MODULE THEREOF  
A power supply includes a casing, a printed circuit board (PCB) and a heat dissipation module. The PCB is disposed in the casing and has a heat-generating element. The casing has a top cover. The...
US20150181763 ELECTRONICS CHASSIS AND METHOD OF FABRICATING THE SAME  
An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an...
US20090219697 THERMAL MANAGEMENT FOR ELECTROMAGNETIC COIL SYSTEMS  
A system includes a housing and an electromagnetic coil within the housing. The electromagnetic coil is arranged in a coil stack. A thermal damper is positioned adjacent to the electromagnetic...
US20090309214 Circuit Module Turbulence Enhancement  
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat...
US20100254083 HEAT DISSIPATION DEVICE AND FASTENERS THEREOF  
A heat dissipation device includes a heat sink, a heat absorbing plate, a heat pipe thermally connecting the heat sink and the absorbing plate, a pressing plate secured to the heat absorbing plate...
US20100027221 SHEET STRUCTURE AND METHOD OF MANUFACTURING THE SAME  
The sheet structure includes a plurality of linear structure bundles 12 each of which comprises a plurality of linear structures of carbon atoms arranged, spaced from each other at a first gap and...
US20090059635 Rectifier device for automotive alternator  
An AC generator, referred to as an alternator, is mounted on an automotive vehicle for supplying electric power to an on-board battery and other electric loads. The alternator includes a rectifier...
US20090316365 HEAT SINK SYSTEM HAVING THERMALLY CONDUCTIVE RODS  
A heat sink system to conduct heat away from a printed circuit board assembly is provided. The heat sink system includes a chassis, a chassis cover, at least one thermally conductive block...
US20140355213 ELECTRONIC DEVICES COMPRISING PRINTED CIRCUIT BOARDS  
An electronic device may include at least one power component and a printed circuit board. The at least one power component may include a main body and a lead. The printed circuit board may...
US20050128710 Cooling system for electronic components  
A cooling system for an electronic system housing a heat-generating component. The cooling system generally includes a heat sink having a length and a width. The heat sink is configured to...
US20100142147 Electronic Device and Heat Dissipating Module Thereof  
An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and...
US20090059537 OPTIMIZATION OF ELECTRONIC PACKAGE GEOMETRY FOR THERMAL DISSIPATION  
An electronic package device is disclosed including a microelectronic package and a heat sink positioned over the microelectronic package. A thermal interface element is positioned between the...
US20100290490 HEAT SINK AND ASSEMBLY OR MODULE UNIT  
A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at...
US20100020505 Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution  
A printed circuit board (PCB) assembly is disclosed. The PCB assembly includes a first PCB, a second PCB and a land grid array (LGA). The first PCB includes signal interconnects for transmitting...
US20130301222 STACKED HEAT DISSIPATING MODULE OF AN ELECTRONIC DEVICE  
A stacked heat dissipating module of an electronic device has a holding frame, and at least one first heat conducting medium layer, a heat dissipating medium layer, a first heat sink layer, at...
US20110007476 SYSTEMS AND METHODS FOR PROVIDING HEAT TRANSFER  
There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating...
US20100128444 HEAT-DISSIPATED FASTENER AND ELASTIC FRAME THEREOF  
A heat-dissipated fastener including a heat-dissipated plate, an elastic frame and a heat sink module is provided. The elastic frame includes a sheet element, multiple connecting ribs and multiple...
US20100091463 COOLING BODY  
The invention relates to a cooling body for power electronic modules or for semiconductor elements having a flat metal heat dissipation plate, wherein the heat dissipation plate on the side facing...
US20110194255 Electronic component unit and manufacturing method thereof  
According to embodiments, there is provided an electronic component unit, including: a circuit board including: a heat generating element that generates a heat; and a bonding metal foil layer...
US20080106999 Semiconductor Laser Apparatus, Method for Manufacturing the Same, and Optical Pickup Apparatus Using the Same  
There is provided a semiconductor laser apparatus capable of sufficiently discharging heat generated at a semiconductor laser element, having a simple manufacturing step, and capable of adjusting...
US20100134980 HEAT SINK ASSEMBLY  
A heat sink assembly is characterized by comprising a base consisting of an aluminum casting and a copper base plate, a heat sink consisting of a plurality of aluminum heat fins, and at least a...
US20090097208 Electronic Component Module  
The invention relates to an electronic component module, comprising at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling...
US20100046173 Method and System for Adapting a Mobile Computing Device with a Grounded Metallic Housing  
Devices and systems are for adapting a mobile computing device, such as a handheld radio frequency identification (“RFID”) reader, with a grounded metallic housing substrate without impacting the...
US20060164813 Semiconductor package and semiconductor module  
A semiconductor package includes a plate-like semiconductor element having a first power terminal and a control terminal on a main surface, and a second power terminal on a rear surface; a first...
US20100053903 INSULATION SUBSTRATE, POWER MODULE SUBSTRATE, MANUFACTURING METHOD THEREOF, AND POWER MODULE USING THE SAME  
A process for providing a power module substrate. A brazing sheet is temporarily fixed on a surface of a ceramic substrate by surface tension of a volatile organic medium, and a conductive pattern...
US20140225482 ELECTRONIC CONTROL UNIT AND ROTATING ELECTRIC MACHINE  
An electronic control unit is equipped with a semiconductor module having a semiconductor chip electrically connected to the first circuit pattern and the second circuit pattern. A resin body is...
US20090103268 MODULE ASSEMBLY HAVING HEAT TRANSFER PLATE  
A module assembly includes a component housing having a plurality of walls forming a cavity. At least one of the walls includes an opening therethrough open to the cavity. The heat transfer plate...
US20090290301 HEAT SINK FOR AN ELECTRONIC DEVICE  
An electronic device with a clip and a plate of thermally conductive material is disclosed. A first surface of the plate is attached to a surface of the electronic device. The clip is arranged on...
US20100134982 MEMORY HEAT DISSIPATING STRUCTURE AND MEMORY DEVICE HAVING THE SAME  
A memory heat dissipating structure clamped on a surface of a memory module includes two heat dissipating plates and two uniform temperature plates. The uniform temperature plate includes first...
US20090237890 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME  
A semiconductor device includes: a semiconductor element (106) having a surface on a positive electrode side and a surface on a negative electrode side; multiple conductors (13 to 15) bonded...
US20080055863 Method of manufacturing as component embedded printed circuit board  
A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one...
US20090168361 PRINTED CIRCUIT BOARD ASSEMBLY  
A printed circuit board assembly includes a printed circuit board with a heat generating component attached thereon, a base, and a thermal plate. The heat generating component comprises a side...
US20170110386 HEAT DISSIPATING COMPONENT, MANUFACTURING METHOD FOR HEAT DISSIPATING COMPONENT, ELECTRONIC DEVICE, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, INTEGRATED MODULE, AND INFORMATION PROCESSING SYSTEM  
A heat dissipating component including a main body formed from a first material, and a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the...
US20170079128 PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF  
A package carrier includes a substrate, at least one heat conducting element, an insulating material, a first patterned circuit layer and a second patterned circuit layer. The substrate has an...
US20160174357 Vertical Radio Frequency Module  
A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge...
US20160050794 Electronic Component Mounting Structure, Manufacturing Method and Electronic Component Product  
An electronic component mounting structure, manufacturing method and an electronic component product are provided. The electronic component mounting structure comprises a printed circuit board, a...
US20160037620 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF  
There is provided a printed circuit board including: a core layer having a cavity formed therein; a heat radiation body included in the cavity; an insulating layer provided on an upper surface and...
US20150366102 ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT APPARATUS  
An electronic circuit apparatus includes a circuit substrate, a heat generating component positioned on the circuit substrate, a metal plate forming a portion of an inner layer of the circuit...
US20150351224 METAL-BASED MOUNTING BOARD AND MEMBER PROVIDED WITH METAL-BASED MOUNTING BOARD  
A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first...
US20150351223 METAL-BASED MOUNTING BOARD AND MEMBER PROVIDED WITH METAL-BASED MOUNTING BOARD  
The metal-based mounting board includes: a metal-based circuit board including a metal substrate having a first surface and a second surface, an insulating film provided on the first surface and a...
US20150327403 Power Module  
Provided is a power module that decreases thermal resistance while holding insulating reliability. The present invention provides a power module including: a metal cooling plate; an insulating...
US20150319880 REDUCED THERMAL TRANSFER TO PELTIER COOLED FETS  
A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface...

Matches 1 - 43 out of 43